JPH0197858U - - Google Patents
Info
- Publication number
- JPH0197858U JPH0197858U JP18944087U JP18944087U JPH0197858U JP H0197858 U JPH0197858 U JP H0197858U JP 18944087 U JP18944087 U JP 18944087U JP 18944087 U JP18944087 U JP 18944087U JP H0197858 U JPH0197858 U JP H0197858U
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- plating
- dispersing
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 239000006061 abrasive grain Substances 0.000 description 3
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18944087U JPH0197858U (zh) | 1987-12-15 | 1987-12-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18944087U JPH0197858U (zh) | 1987-12-15 | 1987-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0197858U true JPH0197858U (zh) | 1989-06-29 |
Family
ID=31480470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18944087U Pending JPH0197858U (zh) | 1987-12-15 | 1987-12-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197858U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04115870A (ja) * | 1990-09-05 | 1992-04-16 | Sony Corp | 遊離複合砥粒噴射式加工装置 |
-
1987
- 1987-12-15 JP JP18944087U patent/JPH0197858U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04115870A (ja) * | 1990-09-05 | 1992-04-16 | Sony Corp | 遊離複合砥粒噴射式加工装置 |