JPH0195751U - - Google Patents

Info

Publication number

JPH0195751U

JPH0195751U JP19152287U JP19152287U JPH0195751U JP H0195751 U JPH0195751 U JP H0195751U JP 19152287 U JP19152287 U JP 19152287U JP 19152287 U JP19152287 U JP 19152287U JP H0195751 U JPH0195751 U JP H0195751U

Authority

JP

Japan

Prior art keywords

resin

mold structure

semiconductor device

heat dissipation

dissipation block

Prior art date

1987-12-17

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011347 resin Substances 0.000 claims description 17
• 229920005989 resin Polymers 0.000 claims description 17
• 239000004065 semiconductor Substances 0.000 claims description 14
• 230000017525 heat dissipation Effects 0.000 claims description 7
• 239000004020 conductor Substances 0.000 claims description 3
• 238000000465 moulding Methods 0.000 claims 1
• 230000005855 radiation Effects 0.000 description 3
• 238000001816 cooling Methods 0.000 description 1

Cited By (3)