JPH0195014U - - Google Patents
Info
- Publication number
- JPH0195014U JPH0195014U JP19088487U JP19088487U JPH0195014U JP H0195014 U JPH0195014 U JP H0195014U JP 19088487 U JP19088487 U JP 19088487U JP 19088487 U JP19088487 U JP 19088487U JP H0195014 U JPH0195014 U JP H0195014U
- Authority
- JP
- Japan
- Prior art keywords
- electrically insulating
- conductive adhesive
- flat cable
- tape
- ground wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000012777 electrically insulating material Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Conductors (AREA)
- Communication Cables (AREA)
Description
図面は本考案の実施例を示し、第１図Ａは一部
分の接着性テープを除去したフラツトケーブルの
斜視図、第１図Ｂは第１図ＡのＸ―Ｘ線の断面図
である。
１……テープ状基材、２１……信号線、２２…
…アース線、３……絶縁性材料、４……接着性テ
ープ、４１……テープ状基体、４２……金属層、
４３……導電性接着剤。
The drawings show an embodiment of the present invention, in which FIG. 1A is a perspective view of a flat cable with a portion of the adhesive tape removed, and FIG. 1B is a sectional view taken along the line X--X of FIG. 1A. 1...Tape-shaped base material, 21...Signal line, 22...
... Earth wire, 3 ... Insulating material, 4 ... Adhesive tape, 41 ... Tape-shaped substrate, 42 ... Metal layer,
43... Conductive adhesive.
Claims (1)
二本以上のストライプ状に導電性線状体を設けて
、この線状体の少なくとも一本をアース線とし、
他の線状体を信号線とすると共に、この信用線を
電気絶縁性材料で被覆して成るフラツトケーブル
本体を、 電気絶縁性テープ状基体上に、金属層及び導電
性接着剤を順次設けて成る接着性テープにより、 この導電性接着剤が上記アース線に接触するよ
うに巻き付けて成るフラツトケーブル。[Claims for Utility Model Registration] Two or more conductive linear bodies are provided in the longitudinal direction of an electrically insulating tape-like base material in the form of stripes, and at least one of the linear bodies is used as a ground wire. ,
A flat cable body is formed by using another linear body as a signal line and covering this trust wire with an electrically insulating material, and a metal layer and a conductive adhesive are sequentially provided on an electrically insulating tape-shaped base. A flat cable made of a conductive adhesive wrapped with an adhesive tape such that the conductive adhesive is in contact with the ground wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19088487U JPH0195014U (en) | 1987-12-16 | 1987-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19088487U JPH0195014U (en) | 1987-12-16 | 1987-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195014U true JPH0195014U (en) | 1989-06-22 |
Family
ID=31481823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19088487U Pending JPH0195014U (en) | 1987-12-16 | 1987-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195014U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04211189A (en) * | 1990-03-22 | 1992-08-03 | Canon Inc | Circuit board and its manufacture |
| JP2002118339A (en) * | 2000-10-05 | 2002-04-19 | Sony Chem Corp | Wiring board and manufacturing method therefor |
| JP2002184245A (en) * | 2000-12-13 | 2002-06-28 | Hitachi Cable Ltd | Flat shield cable |
| JP2002279831A (en) * | 2001-03-19 | 2002-09-27 | Dainippon Printing Co Ltd | Shield material for flat cable and flat cable with shield |
| JP2003110279A (en) * | 2001-09-28 | 2003-04-11 | Dainippon Printing Co Ltd | Electromagnetic wave shield material and flat cable with the electromagnetic wave shield |
| WO2009090927A1 (en) * | 2008-01-17 | 2009-07-23 | Sony Chemical & Information Device Corporation | Flat cable |
-
1987
- 1987-12-16 JP JP19088487U patent/JPH0195014U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04211189A (en) * | 1990-03-22 | 1992-08-03 | Canon Inc | Circuit board and its manufacture |
| JP2002118339A (en) * | 2000-10-05 | 2002-04-19 | Sony Chem Corp | Wiring board and manufacturing method therefor |
| JP2002184245A (en) * | 2000-12-13 | 2002-06-28 | Hitachi Cable Ltd | Flat shield cable |
| JP2002279831A (en) * | 2001-03-19 | 2002-09-27 | Dainippon Printing Co Ltd | Shield material for flat cable and flat cable with shield |
| JP2003110279A (en) * | 2001-09-28 | 2003-04-11 | Dainippon Printing Co Ltd | Electromagnetic wave shield material and flat cable with the electromagnetic wave shield |
| WO2009090927A1 (en) * | 2008-01-17 | 2009-07-23 | Sony Chemical & Information Device Corporation | Flat cable |
| JP2009170291A (en) * | 2008-01-17 | 2009-07-30 | Sony Chemical & Information Device Corp | Flat cable |