JPH0194630A - Automatic molding apparatus - Google Patents

Abstract

PURPOSE:To improve productivity of an automatic molding apparatus and to decrease a price of such apparatus, by arranging a plurality of loading frames on the outer periphery of a rotary body rotatable around one of support columns and adapting the apparatus such that the loading frame carrying a semiconductor lead frame thereon is clamped by a molding tool so that resin is molded with the lead frame. CONSTITUTION:An automatic molding apparatus comprises a lower base 21, three or more support columns 23, an upper base 22, a movable base 25, a vertical moving means 24, a molding tool 26 having a bottom mold 26b and a top mold 26a and a resin injecting means. The automatic molding apparatus is further provided with a rotary body 31 rotatable around one of the columns 23 and also movable vertically, a plurality of loading frames 42 arranged on the outer periphery of the rotary body 31 at approximately equal intervals and each capable of carrying a semiconductor lead frame, a rotating means for rotating the rotary body 31 by a predetermined angle and a second vertical moving means for moving the rotary body 31 vertically. The loading frame 42 carrying the semiconductor lead frame is clamped by the molding tool 26 so that resin is molded with the lead frame.

Description

Detailed Description of the Invention [Objective of the Invention] (Industrial Application Field) The present invention relates to a molding device for molding a semiconductor element bonded onto a lead frame, and in particular to a molding device for automatically feeding a lead frame into a mold. The present invention relates to an automatic molding device that places a molded lead frame and automatically takes it out of the mold.

(Prior Art) As shown in FIG. 3, a conventional automatic molding device first chucks a semiconductor lead frame 5a sent from a previous process using a claw chuck 2 of an inloader 4 located on the left side of a mold press device 8. Then, the transfer device 3 of the inloader 4 transports the mold 7 along the guide shaft 6 to the mold 7 provided in the mold press device 8, and moves the lower mold 7a fixed to the lower base 21 of the mold press device 8 to a predetermined position. Place it on. When the loading is completed, the inloader 4 returns to the initial position. Then, the mold press device 8 performs a mold clamping operation. In other words, Mo.

- The movable base 2 is moved by the hydraulic pressure generated by the hydraulic cylinder 9 provided on the upper base 22 of the hand brace device 8.
5 descends along the support 23, the upper mold 7b fixed to the lower surface of the movable base 25 is aligned with the lower mold 7a, and the mold 7
is closed and synthetic resin is injected. Next, after a predetermined molding time has elapsed, the upper mold 7b, that is, the movable base 25 is raised, and the outloader 12 located on the right side of the mold press device 8 is moved to the mold 7. Then, the molded lead frame 5b placed in the lower mold 7a is sucked and held by the vacuum chuck 10 of the outloader 12, and returned to the initial position along the guide shaft 6 by the transfer device 11 of the outloader 12. , the lead frame 5b is discharged to a subsequent process.

By repeating the above-described operations, lead frames are automatically supplied and taken out.

(Problems to be Solved by the Invention) However, in the conventional automatic molding device, (1) the inloader 4 and the outloader 12 each require reciprocating movement between the initial position and the mold 7; Furthermore, since the mold 7 cannot be clamped during operation, cycle time cannot be shortened and productivity cannot be expected to be improved. 11) and the chuck mechanism (
(3) When switching to a lead frame with a different external shape, it is difficult to expect a reduction in equipment cost because the claw chuck 2 and vacuum chuck 10) are required and the mechanism is complicated.
Since the chuck mechanism is complex, it takes time to adjust.
This was done in consideration of problems such as the impossibility of shortening the setup time for product changeover, and the purpose is to provide an automatic molding device that can improve productivity and reduce equipment costs. shall be.

[Structure of the invention]

(Means for Solving the Problems) The present invention includes a lower base, at least three pillars erected on the upper surface of the lower base, and an upper support supported by these pillars and arranged facing the lower base. a base, a movable base that moves up and down using a support as a guide, a first up and down movement means that moves this movable base up and down, and a first metal half fixed to one of the opposing surfaces of the lower base and the upper base. A molding die having a mold and a second half mold fixed on a movable base so as to face the first half mold, and performing resin molding while holding a semiconductor lead frame; In an automatic molding device equipped with a resin injection means for injecting synthetic resin into a mold, a rotating body is provided so that it can rotate about one of the pillars as a rotation axis and can move up and down; A plurality of loading frames arranged at approximately equal intervals on the outer circumference of the body and each capable of mounting a semiconductor lead frame, a rotation means for rotating the rotating body by a predetermined angle, and a second vertical frame for moving the rotating body up and down. The semiconductor lead frame is placed on the molding die, and the loading frame is held between the molding die and the resin molding.

(Function) In the automatic molding apparatus according to the present invention configured as described above, a case will be considered in which the number of loading frames is two and the first half mold is fixed to the upper surface of the lower base. The semiconductor lead frame sent from the previous process is placed on one loading frame. Then, the rotating body is raised to a predetermined height along the pillar by the second vertical moving means, and further rotated by a predetermined angle (180' when there are two loading frames) by the rotating means to mount the semiconductor lead frame. The placed loading frame is placed directly above a predetermined position on the first half mold (hereinafter referred to as the lower mold) fixed on the lower base. Next, the rotating body is lowered along the pillar by the second vertical movement means, and the loading frame on which the semiconductor lead frame is placed is placed on the lower mold. Then, the movable base is lowered along the support column by the first vertical movement means.

Then, the second half mold (hereinafter referred to as the upper mold) fixed on the movable base is aligned with the lower mold, and the molding mold holds the molding frame on which the semiconductor lead frame is placed. Mold clamping is performed.

Next, the molten molding resin is injected into the molding die by the resin injection means. At this time, the semiconductor lead frame sent from the previous process is placed on the other loading frame.

After a predetermined period of time has elapsed and the resin has completely cured, the upper mold, ie, the movable base, is raised along the support by the first vertical movement means. Next, the rotary body is raised to a predetermined height by the second vertical movement means, and rotated by a predetermined angle by the rotation means. Then, one loading frame on which the molded semiconductor lead frame was placed returns to its initial position, and the other loading frame, on which the semiconductor lead frame sent from the previous process was placed, is fixed on the lower base. The resin molding as described above is performed directly above the predetermined position on the lower mold.

According to the automatic molding apparatus of the present invention, cycle time can be shortened by simultaneously discharging semiconductor lead frames after molding and supplying semiconductor lead frames before molding, thereby improving productivity. do.

Further, since a chuck mechanism for chucking the semiconductor lead frame is not required, the mechanical structure becomes relatively simple, and the cost of the device can be reduced.

(Example) An example of the automatic molding apparatus of the present invention is shown in FIGS. 1 and 2.
This will be explained using figures. The mold breath device 20 includes a lower base 21 and three pillars 23a and 23b erected on the upper surface of the lower base 21.

23c, and these three pillars 23a, 23b.

and an upper base 22 supported by 23c. A hydraulic cylinder 2 for mold clamping is mounted on the upper surface of the upper base 22.
4 is disposed, and the movable base 25 is moved up and down by the hydraulic horn of the hydraulic cylinder 24 using the three pillars 23a, 23b, and 23c as guides. And lower base 21
Lower mold 2 on which a semiconductor lead frame is placed
6b, and an upper mold 26a is fixed to the lower surface of the movable base 25 so as to face the lower mold 26b. Cavities 28a, 28b, and 28c are formed in the upper mold 26a and the lower mold, respectively, for resin-sealing the semiconductor element bonded onto the semiconductor lead frame. Further, the lower mold 26b is further formed with a runner portion 30 in which the cavity portion 28 communicates with two pot portions serving as mold resin injection ports.

An injection cylinder (not shown) for injecting molten mold resin under pressure is disposed on the lower base below the pot portion 29.

Post 23a among the three posts 23a, 23b, and 23c
A rotating body 31 that rotates and moves up and down about the support 23a is pivotally attached to the support 23a. And the rotating body 31 is
It is moved up and down by a vertical movement mechanism 36 composed of a motor 32, a cam 33, a lever 34, a roller 35, etc., and is moved up and down by a rotation mechanism 40 composed of a mower 37, a timing belt 38, a timing pulley 39, etc. Can be rotated. In addition, the rotating body 31
Four arms 41a, 41b, 41c are arranged radially along the radial direction at equal intervals on the outer circumference of the frame.

41d are arranged, and these four arms 41
Loading frames 42a, 42b, 42c, and 42d, on which the semiconductor lead frame 27 is placed, are provided at the distal ends of a, 41b, 41c, and 41d, respectively. These loading frames 42a,
42b, 42c, and 42d have shapes (for example, first As shown in the figure, it has an inverted U-shape) and has guide bins 43a and 43b for positioning the semiconductor lead frame 27.

And these loading frames 42a.

42b, 42c, 42d are arms 41a, 4, respectively.
1b, 41c, and 41d have a mounting structure that allows them to be easily attached and detached. In addition, the lower mold 26b has an escape groove 44 so that the loading frame can be clamped and the mold can be clamped.
is formed.

Next, the operation of this embodiment will be explained. First, the semiconductor lead frame sent from the previous process is placed on the loading frame 42c located at the C position on the opposite side from the mold. Next, the rotating body 31 is raised by the vertical movement mechanism 36 and rotated 90 degrees (left rotation) by the rotation mechanism 40 in the direction of the arrow in FIG.
6 to lower it. Then, the loading frame 42c on which the semiconductor lead frame was placed at the C position comes to the D position and becomes a loading frame 42d. At this time, the semiconductor lead frame sent from the previous process is placed on the loading frame 42c located at the C position. Then, as described above, the vertical movement mechanism section 36 and the rotation mechanism section 40
When the rotating body 31 is raised, rotated 90 degrees, and lowered by It enters into the relief groove 44 of the mold 26b, and the semiconductor lead frame 27 is placed in a predetermined position of the lower mold 26b. Next, the upper mold 26a1, that is, the movable base 25 is moved to the supports 23a and 23b by the hydraulic pressure of the hydraulic cylinder 24.

23c and lower the upper mold 26a to the lower mold 26b.
Mold clamping is carried out accordingly. Then, from the injection cylinder (not shown) to the cavity part 28a in the mold 26,
Molten mold resin is injected into 28b and 28c. At this time, the loading frame 42 c l located at the C position: the semiconductor lead frame sent from the previous process is placed thereon.

Then, after a predetermined period of time has elapsed, the cavity portions 28a, 28
When the hardening of the mold resin injected into b and 28c is completed, the upper mold 26a1, that is, the movable base 25 is raised by the hydraulic pressure of the hydraulic cylinder 24, and when the mold 26 is completely opened, it is rotated in the same manner as described above. The body 31 is raised, rotated by 90 degrees, and lowered by the vertical movement mechanism section 36 and the rotation mechanism section 40. Then, the loading frame 42a located at the A position comes to the B position and becomes the loading frame 42b.

On the other hand, the loading frame 42d, which was located at the D position, comes to the A position, and mold clamping is started as described above. During molding, at the B position, the molded semiconductor lead frame 27b placed on the loading frame 42b is discharged to the subsequent process, and at the C position, the semiconductor lead frame sent from the previous process is transferred to the loading frame. 42c and placed thereon.

By repeating the above operations, the semiconductor lead frame is automatically supplied and taken out.

According to the automatic molding apparatus of this embodiment, cycle time can be shortened by simultaneously discharging semiconductor lead frames after molding and supplying semiconductor lead frames before molding, thereby improving productivity. do. Further, since a chuck mechanism for chucking the semiconductor lead frame is not required, the structure becomes relatively simple, and the cost of the device can be reduced. Furthermore, since the loading frame has a mounting structure that allows it to be attached to and detached from the arm, it is possible to shorten the switching time when switching to a semiconductor lead frame having a different external shape.

〔Effect of the invention〕

According to the present invention, it is possible to provide an automatic molding device that can improve productivity and reduce the cost of the device.

[Brief explanation of the drawing]

FIG. 1 is a plan view of an embodiment of an automatic molding apparatus according to the present invention, FIG. 2 is a front view of the embodiment shown in FIG. 1, and FIG. 3 is a front view of a conventional automatic molding apparatus. 20...Mold breath device, 21...Lower base, 22-...Upper base, 23a, 23b, 23cm column, 24...Hydraulic cylinder, 25...Movable base, 2
6... Mold, 26a... Upper die, 26b... Lower die, 27... Semiconductor lead frame, 2'8a, 28
b. 28c...Cavity part, 29...Pot part, 30
...Runner section, 31... Rotating body, 36... Vertical movement mechanism section, 40-... Rotation mechanism section, 41 a, 41 b
. 41c, 41d--Arm, 42a, 42b. 42c, 42d--Loading frame, 43a. 43b...Guide pin, 44...Escape groove.・Applicant's agent Sato -o-n

Claims (1)

[Claims] 1. A lower base, at least three pillars erected on the upper surface of the lower base, and supported by these pillars,
an upper base disposed opposite to the lower base; a movable base that moves up and down using the support column as a guide; a first up-and-down movement means that moves the movable base up and down; and an upper base facing the lower base. It has a first half mold fixed to one of the surfaces and a second half mold fixed on the movable base so as to face the first half mold, and the semiconductor lead frame is sandwiched between the second half molds. In an automatic molding device equipped with a molding die for performing resin molding, and a resin injection means for injecting synthetic resin into the molding die, the automatic molding device rotates about one of the pillars as a rotation axis and also moves up and down. a rotating body that is provided so that the rotating body can be rotated by a predetermined angle; and a second vertical movement means for vertically moving the rotating body, and resin molding is performed by sandwiching a loading frame on which the semiconductor lead frame is mounted on the molding die. Automatic molding equipment. 2. The automatic molding apparatus according to claim 1, wherein the loading frame is removably attached to the outer periphery of the rotating body.