JPH0193791U - - Google Patents
Info
- Publication number
- JPH0193791U JPH0193791U JP18891187U JP18891187U JPH0193791U JP H0193791 U JPH0193791 U JP H0193791U JP 18891187 U JP18891187 U JP 18891187U JP 18891187 U JP18891187 U JP 18891187U JP H0193791 U JPH0193791 U JP H0193791U
- Authority
- JP
- Japan
- Prior art keywords
- units
- guide plate
- convection guide
- gap
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18891187U JPH0193791U (en:Method) | 1987-12-14 | 1987-12-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18891187U JPH0193791U (en:Method) | 1987-12-14 | 1987-12-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193791U true JPH0193791U (en:Method) | 1989-06-20 |
Family
ID=31479975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18891187U Pending JPH0193791U (en:Method) | 1987-12-14 | 1987-12-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193791U (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0557896U (ja) * | 1992-01-09 | 1993-07-30 | 株式会社東芝 | 電子部品の実装構造 |
-
1987
- 1987-12-14 JP JP18891187U patent/JPH0193791U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0557896U (ja) * | 1992-01-09 | 1993-07-30 | 株式会社東芝 | 電子部品の実装構造 |