JPH0193771U - - Google Patents
Info
- Publication number
- JPH0193771U JPH0193771U JP18862787U JP18862787U JPH0193771U JP H0193771 U JPH0193771 U JP H0193771U JP 18862787 U JP18862787 U JP 18862787U JP 18862787 U JP18862787 U JP 18862787U JP H0193771 U JPH0193771 U JP H0193771U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- layer
- integrated circuit
- thick film
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 7
- 239000010410 layer Substances 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18862787U JPH0193771U (it) | 1987-12-11 | 1987-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18862787U JPH0193771U (it) | 1987-12-11 | 1987-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193771U true JPH0193771U (it) | 1989-06-20 |
Family
ID=31479707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18862787U Pending JPH0193771U (it) | 1987-12-11 | 1987-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193771U (it) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0334392A (ja) * | 1989-06-29 | 1991-02-14 | Semiconductor Energy Lab Co Ltd | 配線基板 |
| WO2022130816A1 (ja) * | 2020-12-15 | 2022-06-23 | 株式会社村田製作所 | 伸縮性実装基板 |
| US11659654B2 (en) | 2018-12-27 | 2023-05-23 | Murata Manufacturing Co., Ltd. | Stretchable wiring board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5636176B2 (it) * | 1978-09-08 | 1981-08-22 | ||
| JPS5851597A (ja) * | 1981-09-22 | 1983-03-26 | 富士通株式会社 | クロスパタ−ンの形成方法 |
-
1987
- 1987-12-11 JP JP18862787U patent/JPH0193771U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5636176B2 (it) * | 1978-09-08 | 1981-08-22 | ||
| JPS5851597A (ja) * | 1981-09-22 | 1983-03-26 | 富士通株式会社 | クロスパタ−ンの形成方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0334392A (ja) * | 1989-06-29 | 1991-02-14 | Semiconductor Energy Lab Co Ltd | 配線基板 |
| US11659654B2 (en) | 2018-12-27 | 2023-05-23 | Murata Manufacturing Co., Ltd. | Stretchable wiring board |
| WO2022130816A1 (ja) * | 2020-12-15 | 2022-06-23 | 株式会社村田製作所 | 伸縮性実装基板 |