JPH0193765U - - Google Patents
Info
- Publication number
- JPH0193765U JPH0193765U JP19088687U JP19088687U JPH0193765U JP H0193765 U JPH0193765 U JP H0193765U JP 19088687 U JP19088687 U JP 19088687U JP 19088687 U JP19088687 U JP 19088687U JP H0193765 U JPH0193765 U JP H0193765U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- circuit board
- printed circuit
- flexible printed
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 2
- 239000012787 coverlay film Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19088687U JPH0193765U ( ) | 1987-12-15 | 1987-12-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19088687U JPH0193765U ( ) | 1987-12-15 | 1987-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193765U true JPH0193765U ( ) | 1989-06-20 |
Family
ID=31481825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19088687U Pending JPH0193765U ( ) | 1987-12-15 | 1987-12-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193765U ( ) |
-
1987
- 1987-12-15 JP JP19088687U patent/JPH0193765U/ja active Pending
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