JPH019198Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pallet for transporting chip-shaped electronic components, which transports chip-shaped electronic components while mechanically holding them.

Recently, a chip electronic component mounting machine has been developed that transfers chip electronic components using a pallet, transfers the chip electronic components from the pallet to a mounting head, and then mounts the chip electronic components onto a printed circuit board using the mounting head. has been proposed by the applicant.

By the way, the conventional pallet for transferring chip-shaped electronic components has a structure in which the chip-shaped electronic components are held and transferred by a pair of plate-shaped clamping bars, so that the chip-shaped electronic components may become misaligned due to wear of the clamping bars. In some cases, the presence of fragments of broken parts caused poor clamping. In particular, the latter defect is
During the operation of a chip-shaped electronic component mounting machine, fragments of components often get caught between a pair of clamping bars, and a countermeasure against this problem has been desired.

In view of the above points, the present invention adopts a structure in which chip-shaped electronic components are transferred while being held between a base and a pair of holding round bars, thereby increasing the transfer speed and improving reliability. The present invention aims to provide a pallet for transporting chip-shaped electronic components.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the pallet for transporting chip-shaped electronic components according to the present invention will be described below with reference to the drawings.

In FIGS. 1 and 3, a base 2 of a pallet 1 is attached to an endless belt mechanism such as a chain 3 or a belt, and a carbide base plate 13 is provided at the center of the base 2. A pair of holding round bars 5A and 5B made of cemented carbide are movably provided above. Here, each holding round bar 5A, 5B has a tapered surface at both ends. Both ends of the base 2 are stepped convex portions 7, and curved compression leaf springs 8 are provided between the inner surfaces of the convex portions 7 and the holding round bars 5A, 5B, respectively. Therefore, both holding round bars 5A,
5B will be biased in the direction of close contact. Further, the base 2 has a suction hole 9 opened from the center of the front surface to the center of the top surface for use during transfer. An upper lid 10 is placed on the base 2 with the holding round bars 5A, 5B and the compression leaf spring 8 disposed thereon. The upper cover 10 is attached by screwing screws 11 into screw holes 12 on the base 2 side.

Next, the operation of the above palette 1 will be explained. If the chip-shaped electronic component 20 is inserted from the direction of the arrow A as shown in FIG. 4A, the holding round bars 5A, 5B
has an open end to accept the chip-shaped electronic component 20, and as shown in FIG.
hold. And usually chip-shaped electronic component 20
is pushed into the opening of the suction hole 9 between the holding rods 5A and 5B.

On the other hand, when the chip-shaped electronic component 20 is inserted from the rear end of the holding round bars 5A, 5B as shown by arrow B, the rear ends of the holding round bars 5A, 5B open and the fifth
As shown in the figure, a chip-shaped electronic component 20 can be received.

Furthermore, as shown in FIG. 3, a chip-shaped electronic component 20 is held above the pallet 1, as shown in FIG. In this state, the chip-shaped electronic component 20 that has been sucked by the suction pin 14 is placed in the open position of the suction hole 9 on the top surface of the base, and then the suction pin 14 and the push rod are returned in this order to form a chip as shown in FIG. It can also hold electronic components 20.

To take out the chip-shaped electronic component 20, the chip-shaped electronic component 20 is usually taken out by vacuuming the suction hole 9.
While vacuum suctioning the electronic component 20 to the base 2, insert a push rod wider than the chip-shaped electronic component 20 between the holding round bars 5A and 5B, and insert the suction pin 14 between the holding round bars 5A and 5B. Chip-shaped electronic component 2
0 is suctioned, and in this state, the vacuum suction of the suction hole 9 is stopped, and the chip-shaped electronic component 20 is suctioned and lifted by the suction pin 14.

According to the above embodiment, the following effects can be achieved.

(1) Since the holding round bars 5A and 5B are used as members for holding the chip-shaped electronic component 20, they are hardly worn out during use, and even if they do wear out, there is almost no adverse effect. Furthermore, by forming the holding round bars 5A, 5B from a carbide material and by using the carbide base plate 13 as the portion of the base 2 that faces them, it is possible to take complete measures against wear.

(2) The chip-shaped electronic component 20 has a large degree of freedom in the insertion direction, and can be inserted from both ends of the holding round bars 5A, 5B and from above the holding round bars.

(3) Even if there are small pieces of the chip-shaped electronic component 20 on the pallet, the holding round bar 5
Since A and 5B are used, there is almost no adverse effect from such small fragments. (It just goes under the holding round bars 5A and 5B.) Therefore,
It is possible to prevent malfunctions due to broken parts and the like, and to significantly improve reliability.

In the above embodiment, a leaf spring is used as the elastic member for biasing the holding rods 5A and 5B into close contact with each other, but it is also possible to use other elastic members as appropriate.

As explained above, according to the present invention, a pair of holding round bars are disposed on the base and are urged in a direction that brings them into close contact with each other, and a chip-shaped electronic Since the structure is designed to hold components, it is possible to obtain a pallet for transferring chip-shaped electronic components with a simple structure and high reliability, and it is especially effective when applied to a high-speed chip-shaped electronic component mounting machine that transfers pallets at high speed. is large.

[Brief explanation of drawings]

FIG. 1 is a plan view with the top cover omitted, showing an embodiment of a pallet for transferring chip-shaped electronic components according to the present invention;
Figure 2 is an exploded perspective view, Figure 3 is a front view, and Figure 4 is an exploded perspective view.
Figures A and B are plan views showing the operation of the embodiment, and Figure 5 is a front sectional view thereof. 1... Pallet, 2... Base, 3... Chain, 5A, 5B... Holding round bar, 8... Compression leaf spring, 9... Suction hole, 10... Top cover, 11... Screw, 12 ...Screw hole, 13...Carbide base plate, 20...
...Chip-shaped electronic components.

Claims (1)

[Scope of utility model registration request] A pair of holding round bars that are movably disposed on a base and hold the chip-shaped electronic component between the base and an elastic member that biases the pair of holding round bars in a direction in which they come into close contact with each other. A pallet for transporting chip-shaped electronic components, characterized by comprising: