JPH0126159Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a chip-shaped electronic component feeding device suitable for use in a chip-shaped electronic component insertion machine and the like.

Recently, chip-shaped electronic components are transferred to a pallet in the order of mounting, the chip-shaped electronic components are transferred using the pallet, the chip-shaped electronic components are transferred from the pallet to the mounting head, and the chip-shaped electronic components are transferred by the mounting head. The present applicant has proposed a chip-shaped electronic component mounting machine that mounts chip-shaped electronic components onto printed circuit boards. In this case, one chip-shaped electronic component is placed on a pallet.
A chip-shaped electronic component supply device for individually supplying chip-shaped electronic components is provided opposite to each pallet.

In the chip-shaped electronic component supply apparatus used for such applications, it is necessary to separate the chip-shaped electronic components one by one and transfer them to a pallet. Conventionally, chip-shaped electronic components 2 arranged in N rows in an alignment groove 1 as shown in FIG.
The chip-shaped electronic component 2 is pushed up in the thickness direction to separate only the most advanced chip-shaped electronic component, and this is pushed out to the pallet side by the chip extrusion slider 4.

By the way, in the structure as shown in FIG. 1, since the chip-shaped electronic component 2 is separated in the thickness direction, there is a possibility that an accident may occur due to a dimensional error in the thickness direction of the chip-shaped electronic component 2. In other words, the smallest thickness of the chip-shaped electronic component 2 is 0.5
Since the size is about mm, there is a problem that separation may become impossible due to a slight dimensional error.

In view of the above points, the present invention aims to prevent accidents due to dimensional errors in chip-shaped electronic components and improve reliability by adopting a structure in which chip-shaped electronic components are separated one by one in the horizontal direction. The present invention aims to provide a chip-shaped electronic component supply device.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a chip-shaped electronic component supplying apparatus according to the present invention will be described with reference to the drawings.

In FIGS. 2 and 3, the chip-shaped electronic component supply device supplies a square chip-shaped electronic component 2 to a supply port 1.
a vibrating table 13 for transporting the chip-shaped electronic components 2 in one direction; and an alignment groove 14 disposed at the tip of the vibrating table 13 for aligning and sending out the chip-shaped electronic components 2 to the supply port 12 in a line.
and a belt conveyor 15 for returning the chip-shaped electronic components 2 that have fallen from the middle of the vibrating table 13 and the alignment groove 14 without being aligned to the starting position.

The vibration table 13 is supported on a base 17 by leaf springs 16A and 16B, and an attraction member 18 made of a magnetic plate such as iron fixed to the lower surface of the vibration table 13 is attracted by an electromagnet 19 on the substrate 17. It is becoming more and more common. Then, by energizing the electromagnet 19 with alternating current, the suction member 18, that is, the vibration table 13, vibrates back and forth and transfers the chip-shaped electronic component 2 on the vibration table 13 forward as indicated by arrow P. An alignment groove 14 for aligning the chip-shaped electronic components 2 in a line is connected to the tip of the vibration table 13, and the tip of the alignment groove 14 serves as a supply port 12.

The belt conveyor 15 has a belt pulley 20 on the leading end side.
A belt 22 is provided between the belt pulley 21 on the rear end side and the belt pulley 21 on the rear end side. The belt 22 runs as shown by arrow B from the leading end to the rear end. In this case, the belt pulley 20 is supported at a lower height than the vibration table 13, and the belt pulley 21 is supported at a higher position than the vibration table 13. An inclined receiving tray portion 23 is arranged to receive the chip-shaped electronic component 2 that has fallen from the rear end of the belt conveyor 15. This inclined saucer portion 23 is an inclined surface,
Its lower end is connected to the rear end of the vibration table 13.

A mechanism for separating the chip-shaped electronic components 21 one by one is provided between the alignment groove 14 and the supply port 12, as shown in FIG. That is, the lateral movement separation member 4 has a separation groove 42 formed between the main body block 10 in which the alignment groove 14 is formed and the tip block 41 in which the tip groove 40 constituting the supply port 12 is formed.
3 is provided movably in a direction perpendicular to the alignment groove 14. Here, the main body block 10 and the tip block 41 are each fixed to the main body frame 5, and the lateral movement separation member 43 receives a driving force from a lever 44 engaged therewith.

Furthermore, in order to transfer the separated chip-shaped electronic components 2 to the pallet side, a chip pushing member 45 and a chip pressing member 46 are used as shown in FIGS. 5 to 7.
is provided. Here, the chip pushing member 45 slides back and forth when the separation groove 42 and the tip groove 40 coincide, and the chip pressing member 46
is pivotally connected to the chip pushing member 45 with a pin 47. Also, a stopper 4 is placed on the tip block 41.
8 is fixed, and an abutting pin 50 that comes into contact with the chip holding member 46 is inserted into an arm 49 that is fixed to the main body frame 5, and around the abutting pin 50, the pin 50 protrudes rightward. compression spring 5
1 is provided. A leaf spring 52 and a ball 53 are provided at the rear end of the tip holding member 46, as shown in FIG. The ball 53 is brought into pressure contact with an abutment block 54 erected on the main body frame 5 by the elastic force of the leaf spring 52. This is contact block 5
This is to provide a certain amount of friction between the chip holding member 46 and the tip holding member 46, thereby causing the tip holding member 46 to take a certain posture.

In the configuration of the above embodiment, the chip-shaped electronic component 2 at the rear end of the vibration table 13 is transferred forward as shown by the arrow P by the vibration of the vibration table 13, and
are aligned and sent in the direction of the supply port 12.

In addition, the chip-shaped electronic components 2 in the unaligned state fall onto the belt conveyor 15 at the side edge of the vibration table 13 and in the middle of the alignment groove 14,
As it travels in the direction, it is transferred onto the inclined saucer section 23 at the rear end, slides down the inclined saucer section 23 in the direction of arrow S, and is returned to the rear end of the vibration table 13 again.

The chip-shaped electronic component 2 sent to the tip of the alignment groove 14 enters the separation groove 42 when the separation groove 42 of the lateral movement separation member 43 is located on the extension of the alignment groove 14 . Then, the lateral movement separating member 43 moves to the lever 44.
The movement moves in the direction of arrow Q, and the separation groove 42 and the tip groove 40 are brought into alignment. In this way, the alignment groove 14
Only the most advanced chip-shaped electronic component 2 is separated and sent to the other pallet 60 according to the operating sequence shown in FIGS. 5, 6, and 7. That is, the chip holding member 46 receives a rotational force in a direction in which the chip-shaped electronic component 2 on the separation groove 42 contacts the contact pin 50 and presses the top surface of the chip-shaped electronic component 2.
While being held down by the tip, the tip is pushed out in the direction of the tip groove 40 by the advancement of the tip pushing member 45, as shown in FIG. Thereafter, as shown in FIG. 6, the pin 50 and the chip holding member 46 are separated, and the chip holding member 46 presses the top surface of the chip-shaped electronic component 2 by its own weight. Push in part 2. When the pushing is completed, the tip holding member 46 presses against the stopper 48 as shown in FIG.
As a result, the chip holding member 46 receives a rotational force in the direction away from the chip-shaped electronic component 2, and then the mechanism of the ball 53 and leaf spring 52 keeps the tip in a raised state and the chip holding member 46 retreats. do. In this way, the transfer of the chip-shaped electronic component 2 located at the tip end to the pallet 60 is completed.

As explained above, according to the chip-shaped electronic component supply device of the present invention, the chip-shaped electronic components are separated one by one in the lateral direction by the lateral movement separation member, so that Malfunctions caused by variations in dimensions of chip-shaped electronic components can be reliably prevented. In addition, when transferring chip-shaped electronic components to a pallet or the like, it is possible to transfer the chip-shaped electronic components while holding down the top surface of the chip-shaped electronic components, thereby reliably preventing transfer defects due to the rise of the chip-shaped electronic components, etc. Electronic components can be transferred at high speed.

[Brief explanation of the drawing]

FIG. 1 is a schematic side view showing a mechanism for separating chip-shaped electronic components in a conventional chip-shaped electronic component supply device, and FIG. 2 is a plan view showing an embodiment of the chip-shaped electronic component supply device according to the present invention. 3 is a side view of the same, FIG. 4 is a plan view showing a mechanism for separating chip-shaped electronic components in the embodiment, FIGS. 5 to 7 are side views of the same, and FIG. 8 is a rear end of the chip holding member. FIG. 1, 14... Alignment groove, 2... Chip-shaped electronic component, 12... Supply port, 13... Vibration table, 15...
Belt conveyor, 40... Tip groove, 41... Tip block, 42... Separation groove, 43... Laterally moving separation member, 45... Chip pushing member, 46... Chip holding member, 47... Pin, 48... …Stotsupa,
50... Contact pin, 51... Compression spring, 60...
Palette.

Claims (1)

[Scope of Claim for Utility Model Registration] A vibrating table for transferring rectangular chip-shaped electronic components, an alignment groove for arranging the rectangular chip-shaped electronic components sent from the vibrating table in a line, and an alignment groove located at the tip side of the alignment groove. a lateral movement separation member forming a separation groove with the same width as the alignment groove; a chip extrusion member for extruding the rectangular chip-shaped electronic component within the separation groove; A chip-shaped electronic component feeding device comprising: a chip holding member that presses the upper surface of a rectangular chip-shaped electronic component with a spring force.