JPH0191509U - - Google Patents
Info
- Publication number
- JPH0191509U JPH0191509U JP18828487U JP18828487U JPH0191509U JP H0191509 U JPH0191509 U JP H0191509U JP 18828487 U JP18828487 U JP 18828487U JP 18828487 U JP18828487 U JP 18828487U JP H0191509 U JPH0191509 U JP H0191509U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- dicing
- dicing apparatus
- main body
- front side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 claims 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Feeding Of Workpieces (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987188284U JPH0523291Y2 (pt) | 1987-12-11 | 1987-12-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987188284U JPH0523291Y2 (pt) | 1987-12-11 | 1987-12-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0191509U true JPH0191509U (pt) | 1989-06-15 |
JPH0523291Y2 JPH0523291Y2 (pt) | 1993-06-15 |
Family
ID=31479386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987188284U Expired - Lifetime JPH0523291Y2 (pt) | 1987-12-11 | 1987-12-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0523291Y2 (pt) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05315444A (ja) * | 1992-05-11 | 1993-11-26 | Disco Abrasive Syst Ltd | ダイシング装置 |
JPH10270389A (ja) * | 1997-03-21 | 1998-10-09 | Seiko Seiki Co Ltd | ダイシング装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5534426A (en) * | 1978-08-31 | 1980-03-11 | Toshiba Corp | Wafer dicing device |
JPS60214911A (ja) * | 1985-03-11 | 1985-10-28 | 株式会社日立製作所 | ダイシング装置 |
-
1987
- 1987-12-11 JP JP1987188284U patent/JPH0523291Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5534426A (en) * | 1978-08-31 | 1980-03-11 | Toshiba Corp | Wafer dicing device |
JPS60214911A (ja) * | 1985-03-11 | 1985-10-28 | 株式会社日立製作所 | ダイシング装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05315444A (ja) * | 1992-05-11 | 1993-11-26 | Disco Abrasive Syst Ltd | ダイシング装置 |
JPH10270389A (ja) * | 1997-03-21 | 1998-10-09 | Seiko Seiki Co Ltd | ダイシング装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0523291Y2 (pt) | 1993-06-15 |