JPH019148Y2 - - Google Patents
Info
- Publication number
- JPH019148Y2 JPH019148Y2 JP15442281U JP15442281U JPH019148Y2 JP H019148 Y2 JPH019148 Y2 JP H019148Y2 JP 15442281 U JP15442281 U JP 15442281U JP 15442281 U JP15442281 U JP 15442281U JP H019148 Y2 JPH019148 Y2 JP H019148Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- cylindrical capacitor
- cylindrical
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 52
- 239000003989 dielectric material Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 230000008054 signal transmission Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
本考案は筒状コンデンサをプリント基板に貫通
構造で取り付ける筒状コンデンサの取付構造に関
する。[Detailed Description of the Invention] The present invention relates to a mounting structure for a cylindrical capacitor in which the cylindrical capacitor is attached to a printed circuit board in a penetrating structure.
従来より、外部から侵入するノイズを除去した
り、ノイズが外部に漏洩するのを防止するため、
貫通コンデンサを機器のシヤーシやコネクタ中に
埋め込んだり、あるいは、プリント基板の上にラ
ジアルリード形もしくはアキシヤルリード形のコ
ンデンサを取り付けるようにしていた。 Traditionally, in order to remove noise that enters from the outside and prevent noise from leaking to the outside,
Feedthrough capacitors were embedded in equipment chassis or connectors, or radial or axial lead capacitors were mounted on printed circuit boards.
しかしながら、このようにすると、貫通コン
デンサはノイズを発生するプリント基板上の集積
回路等のノイズ源から離れた個所に取り付けられ
ることになるため、上記のプリント基板以降リー
ド線にまでノイズが乗り、他のプリント基板にノ
イズ障害を起す、コンデンサとして完成された
コンデンサを使用しているため、コストが高く、
スペースフアクタも悪い、等の欠点があつた。 However, if you do this, the feedthrough capacitor will be installed in a location away from the noise source such as the integrated circuit on the printed circuit board that generates noise, so noise will be transmitted to the lead wires from the printed circuit board, causing other noise. The cost is high because it uses a finished capacitor, which causes noise disturbances on the printed circuit board.
It had drawbacks such as poor space factor.
本考案は従来のコンデンサの取付構造における
上記事情に鑑みてなされたものであつて、プリン
ト基板の一部を切除して形成した筒状コンデンサ
の嵌入部からプリント基板の平面に沿う方向に突
出して筒状コンデンサの貫通孔に挿入されるプリ
ント基板により構成される棒状部を突出させ、筒
状コンデンサの内面電極および外面電極をプリン
ト基板の導電膜に半田付けすることにより、プリ
ント基板の導電膜を利用して接地電極および貫通
電極を構成させ、プリント基板に筒状コンデンサ
を直接取り付けるようにしたコストが低く、スペ
ースフアクタの勝れた筒状コンデンサの取付構造
を提供することを目的としている。 The present invention was devised in view of the above-mentioned circumstances in the conventional capacitor mounting structure.The present invention has been developed in view of the above-mentioned circumstances in the conventional capacitor mounting structure. The conductive film of the printed circuit board is made to protrude by protruding the rod-shaped part formed by the printed circuit board that is inserted into the through hole of the cylindrical capacitor, and the inner and outer electrodes of the cylindrical capacitor are soldered to the conductive film of the printed circuit board. It is an object of the present invention to provide a mounting structure for a cylindrical capacitor that is low in cost and has an excellent space factor, in which a ground electrode and a through electrode are formed using the cylindrical capacitor, and the cylindrical capacitor is directly mounted on a printed circuit board.
以下、添付図面を参照して本考案の実施例を説
明する。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
第１図において、１１はプリント基板、１２は
該プリント基板１１に取り付けられている電子部
品（図示せず。）に例えば電源を供給する電源供
給用導電膜、１３，１３はアース用導電膜、１４
は上記プリント基板１１に取り付けられた筒状コ
ンデンサである。 In FIG. 1, 11 is a printed circuit board, 12 is a conductive film for supplying power to, for example, electronic components (not shown) attached to the printed circuit board 11, 13 is a conductive film for grounding, 14
is a cylindrical capacitor attached to the printed circuit board 11.
上記筒状コンデンサ１４は、第２図に示すよう
に、円筒状の誘電体１５の貫通孔１６の内周面お
よび該誘電体１５の外周面に夫々内面電極１７お
よび外面電極１８を形成したものである。 As shown in FIG. 2, the cylindrical capacitor 14 has an inner surface electrode 17 and an outer surface electrode 18 formed on the inner peripheral surface of a through hole 16 of a cylindrical dielectric material 15 and on the outer peripheral surface of the dielectric material 15, respectively. It is.
上記筒状コンデンサ１４は、第３図に示すよう
に、プリント基板１１の一部を切除して形成した
上記筒状コンデンサ１４の嵌入部１９を有してお
り、該嵌入部１９は、プリント基板１１の平面に
沿う方向に突出して上記筒状コンデンサ１４の貫
通孔１６に挿入されるプリント基板１１よりなる
棒状部２０を有する。 As shown in FIG. 3, the cylindrical capacitor 14 has a fitting portion 19 formed by cutting out a part of the printed circuit board 11. It has a rod-shaped portion 20 made of the printed circuit board 11 that protrudes in the direction along the plane of the cylindrical capacitor 11 and is inserted into the through hole 16 of the cylindrical capacitor 14 .
上記嵌入部１９の巾および切込み深さは夫々上
記筒状コンデンサ１４の外径および内径にほぼ等
しい寸法を有する。 The width and cutting depth of the fitting portion 19 are approximately equal to the outer diameter and inner diameter of the cylindrical capacitor 14, respectively.
また、上記棒状部２０は筒状コンデンサ１４の
貫通孔１６に挿入可能で上記筒状コンデンサ１４
の長さよりもやや長い寸法を有し、上記嵌入部１
９をその切込み方向に２等分するように上記プリ
ント基板１１から突出させている。 Further, the rod-shaped portion 20 can be inserted into the through hole 16 of the cylindrical capacitor 14 and
It has a dimension slightly longer than the length of the above-mentioned inset part 1.
9 protrudes from the printed circuit board 11 so as to be divided into two equal parts in the cutting direction.
上記棒状部２０には電源供給用導電膜１２を形
成する一方、上記嵌入部１９の両側にはアース用
導電膜１３，１３を夫々形成している。 A conductive film 12 for power supply is formed on the rod-shaped portion 20, and conductive films 13, 13 for grounding are formed on both sides of the insertion portion 19, respectively.
上記嵌入部１９には、第１図および第４図に示
すように、筒状コンデンサ１４の貫通孔１６に棒
状部２０を貫通させて上記筒状コンデンサ１４を
嵌入し、上記棒状部２０上の電源供給用導電膜１
２を筒状コンデンサ１４の内面電極１７に半田付
けする一方、アース用電極膜１３，１３を筒状コ
ンデンサ１４の外面電極１８に半田付けしてい
る。 As shown in FIGS. 1 and 4, the cylindrical capacitor 14 is inserted into the fitting portion 19 by passing the rod-shaped portion 20 through the through-hole 16 of the cylindrical capacitor 14. Conductive film for power supply 1
2 is soldered to the inner surface electrode 17 of the cylindrical capacitor 14, while the grounding electrode films 13, 13 are soldered to the outer surface electrode 18 of the cylindrical capacitor 14.
筒状コンデンサ１４を上記のようにしてプリン
ト基板１１に取り付けるようにすれば、嵌入部１
９から突出させた棒状部２０上の電源供給用導電
膜１２が筒状コンデンサ１４の貫通電極となる一
方、筒状コンデンサ１４の外面電極１８はプリン
ト基板１１のアース用電極膜１３，１３に接続さ
れることになり、従来のように完成した貫通コン
デンサが不要となつてコストが低くなるととも
に、筒状コンデンサ１４の軸心がプリント基板１
１内に含まれることになり、筒状コンデンサ１４
のスペースフアクタも向上することになる。 If the cylindrical capacitor 14 is attached to the printed circuit board 11 as described above, the fitting part 1
The conductive film 12 for power supply on the rod-shaped portion 20 protruding from the cylindrical capacitor 9 serves as a through electrode of the cylindrical capacitor 14, while the outer electrode 18 of the cylindrical capacitor 14 is connected to the grounding electrode films 13, 13 of the printed circuit board 11. This eliminates the need for a completed feedthrough capacitor as in the past, lowering costs, and the axis of the cylindrical capacitor 14 is aligned with the printed circuit board 1.
1, and the cylindrical capacitor 14
The space factor will also be improved.
なお、上記筒状コンデンサ１４の誘電体１５は
円筒状のものに代えて、第５図に示すように、断
面が四角形の筒体のものであつてもよい。 Note that the dielectric 15 of the cylindrical capacitor 14 may be a cylindrical body having a rectangular cross section, as shown in FIG. 5, instead of being cylindrical.
また、筒状コンデンサ１４を複数個プリント基
板１１に取り付ける場合には、第６図に示すよう
に、プリント基板１１に取り付ける筒状コンデン
サ１４の取付個数に応じた数の嵌入部１９，…
…，１９を設けてこれら嵌入部１９，……，１９
から夫々棒状部２０，……，２０を突出させ、第
１図と全く同様にして、プリント基板１１に筒状
コンデンサ１４，……，１４を取り付けるように
すればよい。 Further, when a plurality of cylindrical capacitors 14 are attached to the printed circuit board 11, as shown in FIG. 6, the number of fitting portions 19, .
..., 19 are provided, and these inset portions 19, ..., 19 are provided.
The rod-like portions 20, . . . , 20 may be respectively projected from the cylindrical capacitors 14, and the cylindrical capacitors 14, .
さらに、筒状コンデンサ１４をプリント基板１
１の内部に取り付けて例えば信号伝達用の導電膜
に乗つているノイズを除去するような場合は、第
７図に示すように、プリント基板１１の筒状コン
デンサ１４の取付け部分を切除して嵌入部１９を
形成し、該嵌入部１９に棒状部２０を突出させ、
第８図に示すように、上記棒状部２０を筒状コン
デンサ１４の貫通孔１６に挿通した状態で、上記
筒状コンデンサ１４を嵌入部１９に嵌入し、その
内面電極１７および外面電極１８を夫々信号伝達
用導電膜１２′およびアース用電極膜１３に半田
付けすればよい。 Further, the cylindrical capacitor 14 is attached to the printed circuit board 1.
1 to remove noise on a conductive film for signal transmission, for example, as shown in FIG. forming a portion 19 and having a rod-shaped portion 20 protrude from the fitting portion 19;
As shown in FIG. 8, with the rod-shaped part 20 inserted into the through hole 16 of the cylindrical capacitor 14, the cylindrical capacitor 14 is fitted into the fitting part 19, and the inner electrode 17 and outer electrode 18 are connected to each other. It may be soldered to the signal transmission conductive film 12' and the grounding electrode film 13.
以上の説明において本考案の基本的な実施例に
ついて説明したが、本考案は上記実施例に限定さ
れるものではなく、本考案の要旨の範囲内で種々
の構成とすることができる。 In the above description, basic embodiments of the present invention have been described, but the present invention is not limited to the above embodiments, and various configurations can be made within the scope of the gist of the present invention.
以上、詳述したことからも分るように、本考案
は、プリント基板の一部を切除してその導電膜を
利用して筒状コンデンサの接地電極および貫通電
極を形成させるようにしたから、簡単な構造を有
する安価な筒状コンデンサを使用して、ノイズの
プリント基板からの漏洩もしくはプリント基板へ
の侵入を防止することができる。また、筒状コン
デンサはプリント基板を切除して設けた嵌入部に
嵌入した状態で使用されることになり、筒状コン
デンサのスペースフアクタも大巾に向上する。 As can be seen from the detailed description above, in the present invention, a part of the printed circuit board is cut out and the conductive film is used to form the ground electrode and through electrode of the cylindrical capacitor. By using an inexpensive cylindrical capacitor with a simple structure, it is possible to prevent noise from leaking from or entering the printed circuit board. Further, the cylindrical capacitor is used while being fitted into a fitting portion provided by cutting out the printed circuit board, and the space factor of the cylindrical capacitor is also greatly improved.
第１図は本考案の１実施例の平面図、第２図は
筒状コンデンサの斜視図、第３図は第１図の実施
例に使用するプリント基板の平面図、第４図は第
１図のＩ−I′線断面図、第５図は四角筒状の誘電
体を有する筒状コンデンサを使用した実施例の断
面図、第６図は複数の筒状コンデンサをプリント
基板に取り付けた場合の実施例の平面図、第７図
はプリント基板中に筒状コンデンサを取り付ける
場合の実施例のプリント基板の平面図、第８図は
第７図のプリント基板を使用した実施例の平面図
である。
１１……プリント基板、１２……電源供給用導
電膜、１２′……信号伝達用導電膜、１３……ア
ース用導電膜、１４……筒状コンデンサ、１５…
…誘電体、１６……貫通孔、１７……内面電極、
１８……外面電極、１９……嵌入部、２０……棒
状部。
FIG. 1 is a plan view of one embodiment of the present invention, FIG. 2 is a perspective view of a cylindrical capacitor, FIG. 3 is a plan view of a printed circuit board used in the embodiment of FIG. A cross-sectional view taken along line I-I' in the figure, Figure 5 is a cross-sectional view of an example using a cylindrical capacitor with a rectangular cylindrical dielectric, and Figure 6 is a case in which multiple cylindrical capacitors are attached to a printed circuit board. 7 is a plan view of a printed circuit board of an embodiment in which a cylindrical capacitor is installed in a printed circuit board, and FIG. 8 is a plan view of an embodiment using the printed circuit board of FIG. 7. be. 11... Printed circuit board, 12... Conductive film for power supply, 12'... Conductive film for signal transmission, 13... Conductive film for grounding, 14... Cylindrical capacitor, 15...
...dielectric material, 16...through hole, 17...inner surface electrode,
18... External electrode, 19... Inset part, 20... Rod-shaped part.
Claims (1)
貫通孔の内周面および該誘電体の外周面に夫々内
面電極および外面電極を形成した筒状コンデンサ
を嵌入する嵌入部を設けるとともに、上記プリン
ト基板により構成され、上記嵌入部からプリント
基板の平面に沿う方向に突出して上記筒状コンデ
ンサの貫通孔に挿入される棒状部を設け、筒状コ
ンデンサの上記内面電極および外面電極を夫々上
記プリント基板の導電膜に半田付けするようにし
たことを特徴とする筒状コンデンサの取付構造。 A part of the printed circuit board is cut out to provide a fitting part for fitting a cylindrical capacitor having an inner surface electrode and an outer surface electrode formed on the inner peripheral surface of the through hole of the cylindrical dielectric material and the outer peripheral surface of the dielectric material, respectively, and A rod-shaped part is formed of the printed circuit board, protrudes from the insertion part in a direction along the plane of the printed circuit board, and is inserted into the through hole of the cylindrical capacitor, and the inner electrode and the outer electrode of the cylindrical capacitor are connected to the inner electrode and the outer electrode of the cylindrical capacitor, respectively. A mounting structure for a cylindrical capacitor characterized by soldering to a conductive film on a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15442281U JPS5860928U (en) | 1981-10-17 | 1981-10-17 | Mounting structure of cylindrical capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15442281U JPS5860928U (en) | 1981-10-17 | 1981-10-17 | Mounting structure of cylindrical capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5860928U JPS5860928U (en) | 1983-04-25 |
| JPH019148Y2 true JPH019148Y2 (en) | 1989-03-13 |
Family
ID=29947020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15442281U Granted JPS5860928U (en) | 1981-10-17 | 1981-10-17 | Mounting structure of cylindrical capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5860928U (en) |
-
1981
- 1981-10-17 JP JP15442281U patent/JPS5860928U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5860928U (en) | 1983-04-25 |
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