JPH0187547U - - Google Patents
Info
- Publication number
- JPH0187547U JPH0187547U JP1987182909U JP18290987U JPH0187547U JP H0187547 U JPH0187547 U JP H0187547U JP 1987182909 U JP1987182909 U JP 1987182909U JP 18290987 U JP18290987 U JP 18290987U JP H0187547 U JPH0187547 U JP H0187547U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- mounting structure
- metal base
- semiconductor
- shaped groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 2
- 230000020169 heat generation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987182909U JPH0187547U (US06373033-20020416-M00002.png) | 1987-12-02 | 1987-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987182909U JPH0187547U (US06373033-20020416-M00002.png) | 1987-12-02 | 1987-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0187547U true JPH0187547U (US06373033-20020416-M00002.png) | 1989-06-09 |
Family
ID=31474349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987182909U Pending JPH0187547U (US06373033-20020416-M00002.png) | 1987-12-02 | 1987-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0187547U (US06373033-20020416-M00002.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03145748A (ja) * | 1989-10-31 | 1991-06-20 | Narumi China Corp | セラミックス回路基板 |
| JPH0472638U (US06373033-20020416-M00002.png) * | 1990-10-31 | 1992-06-26 | ||
| JP2010251457A (ja) * | 2009-04-14 | 2010-11-04 | Nissan Motor Co Ltd | 半導体装置及びその製造方法 |
-
1987
- 1987-12-02 JP JP1987182909U patent/JPH0187547U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03145748A (ja) * | 1989-10-31 | 1991-06-20 | Narumi China Corp | セラミックス回路基板 |
| JPH0472638U (US06373033-20020416-M00002.png) * | 1990-10-31 | 1992-06-26 | ||
| JP2010251457A (ja) * | 2009-04-14 | 2010-11-04 | Nissan Motor Co Ltd | 半導体装置及びその製造方法 |
