JPH0186254U - - Google Patents
Info
- Publication number
- JPH0186254U JPH0186254U JP18165387U JP18165387U JPH0186254U JP H0186254 U JPH0186254 U JP H0186254U JP 18165387 U JP18165387 U JP 18165387U JP 18165387 U JP18165387 U JP 18165387U JP H0186254 U JPH0186254 U JP H0186254U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor
- substrate
- package
- sealing lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18165387U JPH0186254U (fr) | 1987-11-28 | 1987-11-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18165387U JPH0186254U (fr) | 1987-11-28 | 1987-11-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0186254U true JPH0186254U (fr) | 1989-06-07 |
Family
ID=31473131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18165387U Pending JPH0186254U (fr) | 1987-11-28 | 1987-11-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0186254U (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0313751U (fr) * | 1989-06-26 | 1991-02-12 |
-
1987
- 1987-11-28 JP JP18165387U patent/JPH0186254U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0313751U (fr) * | 1989-06-26 | 1991-02-12 |