JPH0185606U - - Google Patents
Info
- Publication number
- JPH0185606U JPH0185606U JP18210287U JP18210287U JPH0185606U JP H0185606 U JPH0185606 U JP H0185606U JP 18210287 U JP18210287 U JP 18210287U JP 18210287 U JP18210287 U JP 18210287U JP H0185606 U JPH0185606 U JP H0185606U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- surface plate
- support rod
- flat
- flatness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003028 elevating effect Effects 0.000 description 2
Landscapes
- A Measuring Device Byusing Mechanical Method (AREA)
Description
第１図は本考案の実施例による平面度及び厚さ
測定装置の、平面板の反りの測定状態を示す正面
図、第２図は第１図に示した平面度及び厚さ測定
装置の、平面板の厚さの測定状態を示す部分正面
図、第３図は従来の平面度及び厚さ測定装置の斜
視図である。
１…定盤台、２…フレーム、３…プレート、４
…定盤、５…水平調節ボルト、６ａ，６ｂ…小孔
、７…昇降機構、８…昇降軸、９…支持棒固定プ
レート、１０ａ，１０ｂ…支持棒、１１ａ，１１
ｂ…高さ調節ナツト、１２ａ，１２ｂ…上端面、
１３…被測定板、１４…隙間ゲージ、１５…テス
トインジケータ、１６…ダイヤルゲージ、１７…
Ｕ字アーム、１８…受け端子、１９…接触端子、
２０…接触端子昇降レバー。
FIG. 1 is a front view of a flatness and thickness measuring device according to an embodiment of the present invention, showing a state in which warpage of a flat plate is measured, and FIG. 2 is a front view of the flatness and thickness measuring device shown in FIG. FIG. 3 is a partial front view showing a state of measuring the thickness of a flat plate, and a perspective view of a conventional flatness and thickness measuring device. 1... Surface plate stand, 2... Frame, 3... Plate, 4
...Surface plate, 5...Horizontal adjustment bolt, 6a, 6b...Small hole, 7...Elevating mechanism, 8...Elevating shaft, 9...Support rod fixing plate, 10a, 10b...Support rod, 11a, 11
b...height adjustment nut, 12a, 12b...upper end surface,
13...Plate to be measured, 14...Gap gauge, 15...Test indicator, 16...Dial gauge, 17...
U-shaped arm, 18...receiving terminal, 19...contact terminal,
20...Contact terminal lifting lever.
Claims (1)
面板を定盤の上面に載置することができる少なく
とも３本以上の支持棒と、定盤の下方に設けられ
た、支持棒を昇降するための昇降機構とを具備し
、前記支持棒が定盤を貫通して垂直に設けられて
いることを特徴とする平面板の平面度及び厚さ測
定装置。 A surface plate with a highly flat top surface, at least three support rods that can place the flat plate to be measured on the top surface of the surface plate, and a support rod provided below the surface plate that can be lifted and lowered. 1. An apparatus for measuring the flatness and thickness of a flat plate, characterized in that the support rod is provided vertically through the surface plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18210287U JPH0185606U (en) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18210287U JPH0185606U (en) | 1987-11-30 | 1987-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0185606U true JPH0185606U (en) | 1989-06-07 |
Family
ID=31473557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18210287U Pending JPH0185606U (en) | 1987-11-30 | 1987-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0185606U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008116354A (en) * | 2006-11-06 | 2008-05-22 | Nec Electronics Corp | Warpage measurement system, film formation system, and warpage measurement method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53105261A (en) * | 1977-02-25 | 1978-09-13 | Hitachi Ltd | Shape measuring method of plate form objects |
-
1987
- 1987-11-30 JP JP18210287U patent/JPH0185606U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53105261A (en) * | 1977-02-25 | 1978-09-13 | Hitachi Ltd | Shape measuring method of plate form objects |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008116354A (en) * | 2006-11-06 | 2008-05-22 | Nec Electronics Corp | Warpage measurement system, film formation system, and warpage measurement method |
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