JPH0185007U - - Google Patents
Info
- Publication number
- JPH0185007U JPH0185007U JP1987181732U JP18173287U JPH0185007U JP H0185007 U JPH0185007 U JP H0185007U JP 1987181732 U JP1987181732 U JP 1987181732U JP 18173287 U JP18173287 U JP 18173287U JP H0185007 U JPH0185007 U JP H0185007U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- slide
- pin
- molding die
- slide pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 3
Description
第１図は本考案の一実施例を示すもので、型締
め状態を示す要部の断面図、第２図は従来の成形
用金型を示す概略断面図である。
１……固定型、２……可動型、５……第２コイ
ルスプリング、６……スライドピン、７……ロー
ラ、８……ガイドピン、９……長孔。
FIG. 1 shows an embodiment of the present invention, and is a sectional view of a main part showing a mold clamping state, and FIG. 2 is a schematic sectional view showing a conventional molding die. 1...Fixed type, 2...Movable type, 5...Second coil spring, 6...Slide pin, 7...Roller, 8...Guide pin, 9...Elongated hole.
Claims (1)
ヤビテイを形成し、アンダーカツト部を有する成
形品を成形する成形用金型において、固定型また
は可動型が垂直方向に昇降自在なスライドピンを
具備し、該スライドピンの一端に回転自在なロー
ラを設け、他端側にコイルスプリングを周設し、
さらに該スライドピンの略中央部にガイドピンが
突設され、該ガイドピンに対向する型部位に係合
孔を穿設したことを特徴とする成形用金型。 In a molding die for forming a molded product having an undercut portion, the cavity is formed by a fixed mold, a movable mold, and a slide core, and the fixed mold or the movable mold is provided with a slide pin that can freely move up and down in the vertical direction, A rotatable roller is provided at one end of the slide pin, a coil spring is provided around the other end,
A molding die further comprising a guide pin protruding from a substantially central portion of the slide pin, and an engagement hole formed in a mold portion facing the guide pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18173287U JPH065132Y2 (en) | 1987-11-27 | 1987-11-27 | Mold for molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18173287U JPH065132Y2 (en) | 1987-11-27 | 1987-11-27 | Mold for molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0185007U true JPH0185007U (en) | 1989-06-06 |
| JPH065132Y2 JPH065132Y2 (en) | 1994-02-09 |
Family
ID=31473206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18173287U Expired - Lifetime JPH065132Y2 (en) | 1987-11-27 | 1987-11-27 | Mold for molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH065132Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0390915U (en) * | 1989-12-28 | 1991-09-17 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5369474B2 (en) * | 2008-04-07 | 2013-12-18 | セイコーエプソン株式会社 | Mold |
-
1987
- 1987-11-27 JP JP18173287U patent/JPH065132Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0390915U (en) * | 1989-12-28 | 1991-09-17 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH065132Y2 (en) | 1994-02-09 |
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