JPH0184430U - - Google Patents
Info
- Publication number
- JPH0184430U JPH0184430U JP1987181519U JP18151987U JPH0184430U JP H0184430 U JPH0184430 U JP H0184430U JP 1987181519 U JP1987181519 U JP 1987181519U JP 18151987 U JP18151987 U JP 18151987U JP H0184430 U JPH0184430 U JP H0184430U
- Authority
- JP
- Japan
- Prior art keywords
- die bonding
- vacuum chuck
- bonding device
- chuck
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987181519U JPH0184430U (en:Method) | 1987-11-27 | 1987-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987181519U JPH0184430U (en:Method) | 1987-11-27 | 1987-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0184430U true JPH0184430U (en:Method) | 1989-06-05 |
Family
ID=31473001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987181519U Pending JPH0184430U (en:Method) | 1987-11-27 | 1987-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0184430U (en:Method) |
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1987
- 1987-11-27 JP JP1987181519U patent/JPH0184430U/ja active Pending