JPH0183387U - - Google Patents
Info
- Publication number
- JPH0183387U JPH0183387U JP1987178314U JP17831487U JPH0183387U JP H0183387 U JPH0183387 U JP H0183387U JP 1987178314 U JP1987178314 U JP 1987178314U JP 17831487 U JP17831487 U JP 17831487U JP H0183387 U JPH0183387 U JP H0183387U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- soldering
- housed
- wound
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987178314U JPH0183387U (hr) | 1987-11-25 | 1987-11-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987178314U JPH0183387U (hr) | 1987-11-25 | 1987-11-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0183387U true JPH0183387U (hr) | 1989-06-02 |
Family
ID=31469937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987178314U Pending JPH0183387U (hr) | 1987-11-25 | 1987-11-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0183387U (hr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020194952A (ja) * | 2019-05-24 | 2020-12-03 | Nissha株式会社 | 筒状プリント基板およびプリント基板一体成形品 |
-
1987
- 1987-11-25 JP JP1987178314U patent/JPH0183387U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020194952A (ja) * | 2019-05-24 | 2020-12-03 | Nissha株式会社 | 筒状プリント基板およびプリント基板一体成形品 |
CN113557799A (zh) * | 2019-05-24 | 2021-10-26 | 日写株式会社 | 筒状印刷基板以及印刷基板一体成形品 |
US11324114B2 (en) | 2019-05-24 | 2022-05-03 | Nissha Co., Ltd. | Cylindrical printed board and printed-board-integrated molded article |