JPH0183336U - - Google Patents
Info
- Publication number
- JPH0183336U JPH0183336U JP1987180394U JP18039487U JPH0183336U JP H0183336 U JPH0183336 U JP H0183336U JP 1987180394 U JP1987180394 U JP 1987180394U JP 18039487 U JP18039487 U JP 18039487U JP H0183336 U JPH0183336 U JP H0183336U
- Authority
- JP
- Japan
- Prior art keywords
- working end
- sound
- machining device
- ultrasonic waves
- vibrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003754 machining Methods 0.000 claims description 2
- 230000002463 transducing effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例である工作装置１１
の基本的な構成を示すブロツク図、第２図は工作
装置１１のキヤピラリ２の周辺の基本的な構成を
示す図、第３図はキヤピラリ２の振動状態を示す
図、第４図は超音波センサ１２が受信する超音波
の周波数とスピーカ１７によつて音響化される信
号の周波数との対応関係を示すグラフである。
２…キヤピラリ、５…トランスデユーサ、６…
伝達部材、７…超音波発振器、１２…超音波セン
サ、１４，１５…混合器、１６…ローカル発振器
、１７…スピーカ。
Figure 1 shows a machining device 11 which is an embodiment of the present invention.
2 is a diagram showing the basic configuration around the capillary 2 of the machine tool 11, FIG. 3 is a diagram showing the vibration state of the capillary 2, and FIG. 4 is a diagram showing the ultrasonic wave. 3 is a graph showing the correspondence between the frequency of ultrasonic waves received by the sensor 12 and the frequency of the signal converted into sound by the speaker 17. FIG. 2...Capillary, 5...Transducer, 6...
Transmission member, 7... Ultrasonic oscillator, 12... Ultrasonic sensor, 14, 15... Mixer, 16... Local oscillator, 17... Speaker.
Claims (1)
手段と、 作業端の振動状態を可聴周波数帯域の音響に変
換して出力する音響変換手段とを含むことを特徴
とする超音波を用いる工作装置。[Scope of Utility Model Registration Claim] A working end that vibrates to perform work, a vibration generating means that generates vibrations supplied to the working end, and converting the vibration state of the working end into sound in an audible frequency band and outputting it. 1. A machining device using ultrasonic waves, characterized in that it includes an acoustic transducing means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180394U JPH0183336U (en) | 1987-11-25 | 1987-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180394U JPH0183336U (en) | 1987-11-25 | 1987-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0183336U true JPH0183336U (en) | 1989-06-02 |
Family
ID=31471915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987180394U Pending JPH0183336U (en) | 1987-11-25 | 1987-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0183336U (en) |
-
1987
- 1987-11-25 JP JP1987180394U patent/JPH0183336U/ja active Pending