JPH0180935U - - Google Patents
Info
- Publication number
- JPH0180935U JPH0180935U JP1987177378U JP17737887U JPH0180935U JP H0180935 U JPH0180935 U JP H0180935U JP 1987177378 U JP1987177378 U JP 1987177378U JP 17737887 U JP17737887 U JP 17737887U JP H0180935 U JPH0180935 U JP H0180935U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit elements
- film
- separated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987177378U JPH0180935U (en, 2012) | 1987-11-20 | 1987-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987177378U JPH0180935U (en, 2012) | 1987-11-20 | 1987-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180935U true JPH0180935U (en, 2012) | 1989-05-30 |
Family
ID=31469043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987177378U Pending JPH0180935U (en, 2012) | 1987-11-20 | 1987-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180935U (en, 2012) |
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1987
- 1987-11-20 JP JP1987177378U patent/JPH0180935U/ja active Pending