JPH0179894U - - Google Patents
Info
- Publication number
- JPH0179894U JPH0179894U JP1987175362U JP17536287U JPH0179894U JP H0179894 U JPH0179894 U JP H0179894U JP 1987175362 U JP1987175362 U JP 1987175362U JP 17536287 U JP17536287 U JP 17536287U JP H0179894 U JPH0179894 U JP H0179894U
- Authority
- JP
- Japan
- Prior art keywords
- connection terminal
- temperature detection
- wiring pattern
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 4
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Control Of Temperature (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
第１図は本考案による一実施例の斜視図、第２
図は第１図の接続用端子を示す要部断面図、第３
図は第１図の他の接続用端子を示す要部断面図、
第４図は従来技術による斜視図、である。
図において、１はプリント基板、１ａは接続用
端子、１ａ−１はスルホール、１ａ−２はソケツ
ト、１ｂは温度検出回路配線パターン、２は温度
検出センサ、２ａはリード、をそれぞれ示す。
Fig. 1 is a perspective view of one embodiment of the present invention;
The figure is a sectional view of the main part showing the connection terminal in Figure 1,
The figure is a sectional view of the main part showing other connection terminals in Figure 1,
FIG. 4 is a perspective view according to the prior art. In the figure, 1 is a printed circuit board, 1a is a connection terminal, 1a-1 is a through hole, 1a-2 is a socket, 1b is a temperature detection circuit wiring pattern, 2 is a temperature detection sensor, and 2a is a lead.
Claims (1)
用端子１ａと、該接続用端子に接続される温度検
出回路配線パターン１ｂとを備えることを特徴と
するプリント基板。 A printed circuit board characterized by comprising a connection terminal 1a to which a temperature detection sensor 2 is connected as necessary, and a temperature detection circuit wiring pattern 1b connected to the connection terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987175362U JPH0179894U (en) | 1987-11-16 | 1987-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987175362U JPH0179894U (en) | 1987-11-16 | 1987-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0179894U true JPH0179894U (en) | 1989-05-29 |
Family
ID=31467156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987175362U Pending JPH0179894U (en) | 1987-11-16 | 1987-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0179894U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000091767A (en) * | 1998-09-10 | 2000-03-31 | Toshiba Corp | Semiconductor device |
-
1987
- 1987-11-16 JP JP1987175362U patent/JPH0179894U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000091767A (en) * | 1998-09-10 | 2000-03-31 | Toshiba Corp | Semiconductor device |