JPH0179840U - - Google Patents
Info
- Publication number
- JPH0179840U JPH0179840U JP1987175267U JP17526787U JPH0179840U JP H0179840 U JPH0179840 U JP H0179840U JP 1987175267 U JP1987175267 U JP 1987175267U JP 17526787 U JP17526787 U JP 17526787U JP H0179840 U JPH0179840 U JP H0179840U
- Authority
- JP
- Japan
- Prior art keywords
- grooves
- detection mechanism
- pitch detection
- pitch
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の一実施例による溝ピツチ検出
機構付ウエハキヤリアを説明する正面図、第２図
は従来のウエハキヤリアの一例を示す正面図、側
断面図、Ａ−Ａ断面図、第３図１，２は従来の溝
ピツチ検出機構を説明する模式図である。
図において、１はキヤリア本体、２はウエハを
収納する複数の溝、３はウエハ、５はフオトセン
サ、７は溝ピツチ検出機構の指標で溝ピツチ検出
用スリツト、である。
FIG. 1 is a front view illustrating a wafer carrier with a groove pitch detection mechanism according to an embodiment of the present invention, and FIG. 2 is a front view, side sectional view, AA sectional view, and 3. FIGS. 1 and 2 are schematic diagrams illustrating a conventional groove pitch detection mechanism. In the figure, 1 is a carrier body, 2 is a plurality of grooves for storing wafers, 3 is a wafer, 5 is a photo sensor, and 7 is an index of a groove pitch detection mechanism, which is a slit for detecting groove pitch.
Claims (1)
列して設けられた溝と、該溝の個々の位置を示し
且つ該溝と同じピツチで指標が配列されたピツチ
検出機構とが同一部材で形成されていることを特
徴とする溝ピツチ検出機構付ウエハキヤリア。 Grooves arranged in a pitched manner for individually storing a plurality of wafers and a pitch detection mechanism in which indicators are arranged at the same pitch as the grooves and indicate the individual positions of the grooves are formed of the same material. A wafer carrier with a groove pitch detection mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987175267U JPH0179840U (en) | 1987-11-17 | 1987-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987175267U JPH0179840U (en) | 1987-11-17 | 1987-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0179840U true JPH0179840U (en) | 1989-05-29 |
Family
ID=31467072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987175267U Pending JPH0179840U (en) | 1987-11-17 | 1987-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0179840U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03133152A (en) * | 1989-10-18 | 1991-06-06 | Yodogawa Kasei Kk | Cassette for substrate |
| JPH04162745A (en) * | 1990-10-26 | 1992-06-08 | Fujitsu Ltd | Transferring method for wafer |
-
1987
- 1987-11-17 JP JP1987175267U patent/JPH0179840U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03133152A (en) * | 1989-10-18 | 1991-06-06 | Yodogawa Kasei Kk | Cassette for substrate |
| JPH04162745A (en) * | 1990-10-26 | 1992-06-08 | Fujitsu Ltd | Transferring method for wafer |