JPH0179834U - - Google Patents

Info

Publication number
JPH0179834U
JPH0179834U JP1987175711U JP17571187U JPH0179834U JP H0179834 U JPH0179834 U JP H0179834U JP 1987175711 U JP1987175711 U JP 1987175711U JP 17571187 U JP17571187 U JP 17571187U JP H0179834 U JPH0179834 U JP H0179834U
Authority
JP
Japan
Prior art keywords
bonding
arm
clamp
capillary
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987175711U
Other languages
English (en)
Other versions
JPH0521880Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987175711U priority Critical patent/JPH0521880Y2/ja
Publication of JPH0179834U publication Critical patent/JPH0179834U/ja
Application granted granted Critical
Publication of JPH0521880Y2 publication Critical patent/JPH0521880Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案のワイヤボンデイング装置の実
施例の構成図、第２図は本考案のワイヤボンデイ
ング装置の実施例のループ長さ決定手段の動作説
明図、第３図は従来のワイヤボンデイング装置の
ループ長さ決定手段の動作説明図である。 １……カツトクランプ、２……キヤピラリ、３
……ワイヤ、５……ループ、１０……第２のボン
デイング点、１１……クランプアーム、１２……
ボンデイングアーム、１４……揺動アーム、１５
……支軸、１７……バネ、１８ａ，１８ｂ……接
点、１９……ストッパ、１９ａ……ストツパアー
ム、Ｄ……カツトクランプ下端とキヤピラリ先端
との固定距離、Ｄｓ……第２のボンデイング点か
らのカツトクランプ下端高さ、Ｐａ，Ｐｂ，Ｐｃ
，Ｐｄ……キヤピラリ先端、Ｐ１……第１のボン
デイング点、Ｐｓ……固定したカツトクランプ下
端。

Claims (1)

    【実用新案登録請求の範囲】
  1. ワイヤボンデイング装置において、キヤピラリ
    と；キヤピラリを拘持するボンデイングアームと
    ；ワイヤが第１のボンデイング点に固着された後
    、第２のボンデイング点に位置決めされるまでの
    間の予め定められたタイミングで該ワイヤを拘持
    し始め、該拘持の状態をワイヤが第２のボンデイ
    ング点に位置決めされるまで持続するカツトクラ
    ンプと；カツトクランプを拘持するクランプアー
    ムと；ボンデイングアームとクランプアームとの
    相対位置を固定する手段と；クランプアームがカ
    ツトクランプを第２のボンデイング点に近づける
    運動を、第２のボンデイング点から予め定められ
    た所定の高さに該カツトクランプが達した時に停
    止させ、カツトクランプに該第２のボンデイング
    点からの所定の高さを保持させるストッパと；を
    具備することを特徴とするワイヤボンデイング装
    置。
JP1987175711U 1987-11-17 1987-11-17 Expired - Lifetime JPH0521880Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987175711U JPH0521880Y2 (ja) 1987-11-17 1987-11-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987175711U JPH0521880Y2 (ja) 1987-11-17 1987-11-17

Publications (2)

Publication Number Publication Date
JPH0179834U true JPH0179834U (ja) 1989-05-29
JPH0521880Y2 JPH0521880Y2 (ja) 1993-06-04

Family

ID=31467496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987175711U Expired - Lifetime JPH0521880Y2 (ja) 1987-11-17 1987-11-17

Country Status (1)

Country Link
JP (1) JPH0521880Y2 (ja)

Also Published As

Publication number Publication date
JPH0521880Y2 (ja) 1993-06-04

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