JPH0178066U - - Google Patents
Info
- Publication number
- JPH0178066U JPH0178066U JP1987173348U JP17334887U JPH0178066U JP H0178066 U JPH0178066 U JP H0178066U JP 1987173348 U JP1987173348 U JP 1987173348U JP 17334887 U JP17334887 U JP 17334887U JP H0178066 U JPH0178066 U JP H0178066U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- mount components
- footprints
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012986 modification Methods 0.000 claims 1
- 230000004048 modification Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987173348U JPH0178066U (enrdf_load_stackoverflow) | 1987-11-13 | 1987-11-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987173348U JPH0178066U (enrdf_load_stackoverflow) | 1987-11-13 | 1987-11-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0178066U true JPH0178066U (enrdf_load_stackoverflow) | 1989-05-25 |
Family
ID=31465273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987173348U Pending JPH0178066U (enrdf_load_stackoverflow) | 1987-11-13 | 1987-11-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0178066U (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02174185A (ja) * | 1988-12-26 | 1990-07-05 | Hitachi Ltd | メモリ・モジュール |
WO2015174202A1 (ja) * | 2014-05-13 | 2015-11-19 | 株式会社村田製作所 | 樹脂封止型モジュール |
WO2024185766A1 (ja) * | 2023-03-08 | 2024-09-12 | 太陽誘電株式会社 | 回路基板 |
-
1987
- 1987-11-13 JP JP1987173348U patent/JPH0178066U/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02174185A (ja) * | 1988-12-26 | 1990-07-05 | Hitachi Ltd | メモリ・モジュール |
WO2015174202A1 (ja) * | 2014-05-13 | 2015-11-19 | 株式会社村田製作所 | 樹脂封止型モジュール |
JPWO2015174202A1 (ja) * | 2014-05-13 | 2017-04-20 | 株式会社村田製作所 | 樹脂封止型モジュール |
US10251277B2 (en) | 2014-05-13 | 2019-04-02 | Murata Manufacturing Co., Ltd. | Resin-sealed module |
WO2024185766A1 (ja) * | 2023-03-08 | 2024-09-12 | 太陽誘電株式会社 | 回路基板 |