JPH0178063U - - Google Patents
Info
- Publication number
- JPH0178063U JPH0178063U JP17409987U JP17409987U JPH0178063U JP H0178063 U JPH0178063 U JP H0178063U JP 17409987 U JP17409987 U JP 17409987U JP 17409987 U JP17409987 U JP 17409987U JP H0178063 U JPH0178063 U JP H0178063U
- Authority
- JP
- Japan
- Prior art keywords
- submount
- optical semiconductor
- view
- solder
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17409987U JPH0178063U ( ) | 1987-11-12 | 1987-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17409987U JPH0178063U ( ) | 1987-11-12 | 1987-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0178063U true JPH0178063U ( ) | 1989-05-25 |
Family
ID=31465974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17409987U Pending JPH0178063U ( ) | 1987-11-12 | 1987-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0178063U ( ) |
-
1987
- 1987-11-12 JP JP17409987U patent/JPH0178063U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0529665A (ja) | Ｌｅｄ光源装置 | |
| JPH0178063U ( ) | ||
| JPH0397952U ( ) | ||
| US6300674B1 (en) | Flat package for semiconductor diodes | |
| US20020063257A1 (en) | Flat package for semiconductor diodes | |
| JPH01127275U ( ) | ||
| JPS61127661U ( ) | ||
| JPS6316457U ( ) | ||
| JPS60166172U (ja) | 半導体発光装置 | |
| JPH0221770U ( ) | ||
| JPS60166173U (ja) | 半導体発光装置 | |
| JPH01163362U ( ) | ||
| JPH0485760U ( ) | ||
| JPH0320456U ( ) | ||
| JPS64353U ( ) | ||
| JPH0436268U ( ) | ||
| JPS63157969U ( ) | ||
| JPS5995652U (ja) | 発光素子 | |
| JPS6312871U ( ) | ||
| JPH0399457U ( ) | ||
| JPS61203572U ( ) | ||
| JPS6169857U ( ) | ||
| JPS61143111U ( ) | ||
| JPH0385673U ( ) | ||
| JPH02138455U ( ) |