JPH0178059U - - Google Patents

Info

Publication number
JPH0178059U
JPH0178059U JP1987173546U JP17354687U JPH0178059U JP H0178059 U JPH0178059 U JP H0178059U JP 1987173546 U JP1987173546 U JP 1987173546U JP 17354687 U JP17354687 U JP 17354687U JP H0178059 U JPH0178059 U JP H0178059U
Authority
JP
Japan
Prior art keywords
exposed
sealing
mainly composed
registration request
external light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987173546U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0534121Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987173546U priority Critical patent/JPH0534121Y2/ja
Publication of JPH0178059U publication Critical patent/JPH0178059U/ja
Application granted granted Critical
Publication of JPH0534121Y2 publication Critical patent/JPH0534121Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP1987173546U 1987-11-12 1987-11-12 Expired - Lifetime JPH0534121Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987173546U JPH0534121Y2 (https=) 1987-11-12 1987-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987173546U JPH0534121Y2 (https=) 1987-11-12 1987-11-12

Publications (2)

Publication Number Publication Date
JPH0178059U true JPH0178059U (https=) 1989-05-25
JPH0534121Y2 JPH0534121Y2 (https=) 1993-08-30

Family

ID=31465450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987173546U Expired - Lifetime JPH0534121Y2 (https=) 1987-11-12 1987-11-12

Country Status (1)

Country Link
JP (1) JPH0534121Y2 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197976A (ja) * 2001-12-27 2003-07-11 Okaya Electric Ind Co Ltd 発光ダイオード
US7336653B2 (en) 1999-04-09 2008-02-26 At&T Labs, Inc. Internet caller identification system and method
US7450701B2 (en) 2002-02-19 2008-11-11 At&T Intellectual Property I, L.P. Method and system for presenting customized call alerts in a service for internet caller identification

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7336653B2 (en) 1999-04-09 2008-02-26 At&T Labs, Inc. Internet caller identification system and method
JP2003197976A (ja) * 2001-12-27 2003-07-11 Okaya Electric Ind Co Ltd 発光ダイオード
US7450701B2 (en) 2002-02-19 2008-11-11 At&T Intellectual Property I, L.P. Method and system for presenting customized call alerts in a service for internet caller identification

Also Published As

Publication number Publication date
JPH0534121Y2 (https=) 1993-08-30

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