JPH0174270U - - Google Patents

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Publication number
JPH0174270U
JPH0174270U JP1987168633U JP16863387U JPH0174270U JP H0174270 U JPH0174270 U JP H0174270U JP 1987168633 U JP1987168633 U JP 1987168633U JP 16863387 U JP16863387 U JP 16863387U JP H0174270 U JPH0174270 U JP H0174270U
Authority
JP
Japan
Prior art keywords
metal plate
electrode
plate
processing
sided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987168633U
Other languages
Japanese (ja)
Other versions
JP2543870Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987168633U priority Critical patent/JP2543870Y2/en
Publication of JPH0174270U publication Critical patent/JPH0174270U/ja
Application granted granted Critical
Publication of JP2543870Y2 publication Critical patent/JP2543870Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の装置の一例の主要部を表わす
側面図、第２図は第１図に示した装置の一部の正
面図、第３図は第１図に示した装置の一部の斜視
図である。 図中、１は処理槽、２は金属板、３は支持ロー
ル、４は電解液、６は絶縁部材、１２は電気遮蔽
板をそれぞれ示す。 Fig. 1 is a side view showing the main parts of an example of the device of the present invention, Fig. 2 is a front view of a part of the device shown in Fig. 1, and Fig. 3 is a part of the device shown in Fig. 1. FIG. In the figure, 1 is a processing tank, 2 is a metal plate, 3 is a support roll, 4 is an electrolytic solution, 6 is an insulating member, and 12 is an electric shielding plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 帯状金属板に電気的処理を行なう、電極を具備
した処理槽と、該金属板を処理槽で連続的に移動
させる移動装置からなる金属板片面処理装置にお
いて、絶縁部材を前記金属板の電極に対向する面
の幅方向端部を覆うように設け、該金属板の幅以
上の幅を有する電気遮蔽板を、金属板の電極対向
側の反対面を覆うように設けたことを特徴とする
金属板片面処理装置。 In a metal plate single-sided processing apparatus comprising a processing tank equipped with an electrode for electrically processing a strip-shaped metal plate, and a moving device that continuously moves the metal plate in the processing tank, an insulating member is attached to the electrode of the metal plate. A metal characterized in that an electrical shielding plate is provided so as to cover the widthwise end portions of the opposing surfaces, and has a width equal to or greater than the width of the metal plate, and is provided to cover the opposite surface of the metal plate on the side facing the electrode. Single-sided plate processing equipment.
JP1987168633U 1987-11-04 1987-11-04 Metal plate single-side processing equipment Expired - Lifetime JP2543870Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987168633U JP2543870Y2 (en) 1987-11-04 1987-11-04 Metal plate single-side processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987168633U JP2543870Y2 (en) 1987-11-04 1987-11-04 Metal plate single-side processing equipment

Publications (2)

Publication Number Publication Date
JPH0174270U true JPH0174270U (en) 1989-05-19
JP2543870Y2 JP2543870Y2 (en) 1997-08-13

Family

ID=31457976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987168633U Expired - Lifetime JP2543870Y2 (en) 1987-11-04 1987-11-04 Metal plate single-side processing equipment

Country Status (1)

Country Link
JP (1) JP2543870Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010236037A (en) * 2009-03-31 2010-10-21 Hitachi Cable Ltd Plating method of copper foil and plating apparatus therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010236037A (en) * 2009-03-31 2010-10-21 Hitachi Cable Ltd Plating method of copper foil and plating apparatus therefor

Also Published As

Publication number Publication date
JP2543870Y2 (en) 1997-08-13

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