JPH0174243U - - Google Patents
Info
- Publication number
- JPH0174243U JPH0174243U JP1987170312U JP17031287U JPH0174243U JP H0174243 U JPH0174243 U JP H0174243U JP 1987170312 U JP1987170312 U JP 1987170312U JP 17031287 U JP17031287 U JP 17031287U JP H0174243 U JPH0174243 U JP H0174243U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- die
- mounting base
- header
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 description 1
Landscapes
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
Description
第１図はこの考案に係るシール装置のダイヘツ
ダーへの取付状態を示す正面図、第２図は同上要
部のシール状態を示す拡大断面図、第３図は同上
の開放状態を示す拡大断面図、第４図は同要部の
分解斜視図、第５図は従来のシール手段を示す正
面図である。
１……重合反応缶、２……ダイヘツド付バルブ
、３……バルブ、４……ダイヘツダー、５……ダ
イプレート、１２……取付台、１３，１５……テ
ーパ面、１７……シリンダ、２０……シール板、
２１……スプリング。
Fig. 1 is a front view showing the sealing device according to the invention attached to the die header, Fig. 2 is an enlarged sectional view showing the sealed state of the main parts of the same, and Fig. 3 is an enlarged sectional view showing the same as the above in the open state. , FIG. 4 is an exploded perspective view of the same essential parts, and FIG. 5 is a front view showing a conventional sealing means. DESCRIPTION OF SYMBOLS 1...Polymerization reaction can, 2...Valve with die head, 3...Valve, 4...Die header, 5...Die plate, 12...Mounting stand, 13, 15...Tapered surface, 17...Cylinder, 20 ...Seal plate,
21...Spring.
Claims (1)
の直下に対して上り傾斜で進退動するよう配置し
、この取付台上に押上用のスプリングを介してシ
ール板を取付け、このシール板を前進位置でダイ
プレートの下面に圧接させるようにした合成樹脂
ダイヘツダーのシール装置。 A mounting base is placed at the bottom of the die header so that it can move forward and backward at an upward slope directly below the die plate, and a sealing plate is attached to this mounting base via a push-up spring. A sealing device for a synthetic resin die header that is brought into pressure contact with the bottom surface of a plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17031287U JPH0351322Y2 (en) | 1987-11-06 | 1987-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17031287U JPH0351322Y2 (en) | 1987-11-06 | 1987-11-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0174243U true JPH0174243U (en) | 1989-05-19 |
| JPH0351322Y2 JPH0351322Y2 (en) | 1991-11-01 |
Family
ID=31461145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17031287U Expired JPH0351322Y2 (en) | 1987-11-06 | 1987-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351322Y2 (en) |
-
1987
- 1987-11-06 JP JP17031287U patent/JPH0351322Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0351322Y2 (en) | 1991-11-01 |