JPH0173996U - - Google Patents
Info
- Publication number
- JPH0173996U JPH0173996U JP1987168758U JP16875887U JPH0173996U JP H0173996 U JPH0173996 U JP H0173996U JP 1987168758 U JP1987168758 U JP 1987168758U JP 16875887 U JP16875887 U JP 16875887U JP H0173996 U JPH0173996 U JP H0173996U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- module
- sealed
- opening
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168758U JPH0173996U (ar) | 1987-11-02 | 1987-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168758U JPH0173996U (ar) | 1987-11-02 | 1987-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173996U true JPH0173996U (ar) | 1989-05-18 |
Family
ID=31458219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987168758U Pending JPH0173996U (ar) | 1987-11-02 | 1987-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173996U (ar) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022270412A1 (ja) * | 2021-06-25 | 2022-12-29 | 株式会社デンソー | 冷却システム |
-
1987
- 1987-11-02 JP JP1987168758U patent/JPH0173996U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022270412A1 (ja) * | 2021-06-25 | 2022-12-29 | 株式会社デンソー | 冷却システム |
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