JPH0173959U - - Google Patents
Info
- Publication number
- JPH0173959U JPH0173959U JP1987169554U JP16955487U JPH0173959U JP H0173959 U JPH0173959 U JP H0173959U JP 1987169554 U JP1987169554 U JP 1987169554U JP 16955487 U JP16955487 U JP 16955487U JP H0173959 U JPH0173959 U JP H0173959U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- shield plate
- sandwiching
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002787 reinforcement Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987169554U JPH0173959U (tr) | 1987-11-05 | 1987-11-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987169554U JPH0173959U (tr) | 1987-11-05 | 1987-11-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0173959U true JPH0173959U (tr) | 1989-05-18 |
Family
ID=31459722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987169554U Pending JPH0173959U (tr) | 1987-11-05 | 1987-11-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0173959U (tr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015050111A1 (ja) * | 2013-10-01 | 2015-04-09 | 株式会社フジクラ | 配線板組立体及びその製造方法 |
-
1987
- 1987-11-05 JP JP1987169554U patent/JPH0173959U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015050111A1 (ja) * | 2013-10-01 | 2015-04-09 | 株式会社フジクラ | 配線板組立体及びその製造方法 |
US10237971B2 (en) | 2013-10-01 | 2019-03-19 | Fujikura Ltd. | Wiring board assembly and method for producing same |