JPH0173956U - - Google Patents

Info

Publication number
JPH0173956U
JPH0173956U JP1987170213U JP17021387U JPH0173956U JP H0173956 U JPH0173956 U JP H0173956U JP 1987170213 U JP1987170213 U JP 1987170213U JP 17021387 U JP17021387 U JP 17021387U JP H0173956 U JPH0173956 U JP H0173956U
Authority
JP
Japan
Prior art keywords
transparent conductive
conductive surface
chip
electrode
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987170213U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987170213U priority Critical patent/JPH0173956U/ja
Publication of JPH0173956U publication Critical patent/JPH0173956U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1987170213U 1987-11-06 1987-11-06 Pending JPH0173956U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987170213U JPH0173956U (enExample) 1987-11-06 1987-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987170213U JPH0173956U (enExample) 1987-11-06 1987-11-06

Publications (1)

Publication Number Publication Date
JPH0173956U true JPH0173956U (enExample) 1989-05-18

Family

ID=31460962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987170213U Pending JPH0173956U (enExample) 1987-11-06 1987-11-06

Country Status (1)

Country Link
JP (1) JPH0173956U (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826980A (enExample) * 1971-08-12 1973-04-09
JPS6236561B2 (enExample) * 1981-07-06 1987-08-07 Yokokawa Denki Kk

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826980A (enExample) * 1971-08-12 1973-04-09
JPS6236561B2 (enExample) * 1981-07-06 1987-08-07 Yokokawa Denki Kk

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