JPH0171451U - - Google Patents
Info
- Publication number
- JPH0171451U JPH0171451U JP1987167299U JP16729987U JPH0171451U JP H0171451 U JPH0171451 U JP H0171451U JP 1987167299 U JP1987167299 U JP 1987167299U JP 16729987 U JP16729987 U JP 16729987U JP H0171451 U JPH0171451 U JP H0171451U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- dip type
- package body
- leads
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987167299U JPH0171451U (pt) | 1987-10-31 | 1987-10-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987167299U JPH0171451U (pt) | 1987-10-31 | 1987-10-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0171451U true JPH0171451U (pt) | 1989-05-12 |
Family
ID=31455463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987167299U Pending JPH0171451U (pt) | 1987-10-31 | 1987-10-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0171451U (pt) |
-
1987
- 1987-10-31 JP JP1987167299U patent/JPH0171451U/ja active Pending