JPH0171443U - - Google Patents
Info
- Publication number
- JPH0171443U JPH0171443U JP16752087U JP16752087U JPH0171443U JP H0171443 U JPH0171443 U JP H0171443U JP 16752087 U JP16752087 U JP 16752087U JP 16752087 U JP16752087 U JP 16752087U JP H0171443 U JPH0171443 U JP H0171443U
- Authority
- JP
- Japan
- Prior art keywords
- silver paste
- nozzle
- supplying
- air blow
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 239000008188 pellet Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16752087U JPH0171443U (fr) | 1987-10-31 | 1987-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16752087U JPH0171443U (fr) | 1987-10-31 | 1987-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0171443U true JPH0171443U (fr) | 1989-05-12 |
Family
ID=31455892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16752087U Pending JPH0171443U (fr) | 1987-10-31 | 1987-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0171443U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011258626A (ja) * | 2010-06-07 | 2011-12-22 | Panasonic Corp | 部品実装装置および部品実装方法 |
-
1987
- 1987-10-31 JP JP16752087U patent/JPH0171443U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011258626A (ja) * | 2010-06-07 | 2011-12-22 | Panasonic Corp | 部品実装装置および部品実装方法 |