JPH0170352U - - Google Patents
Info
- Publication number
- JPH0170352U JPH0170352U JP1987165749U JP16574987U JPH0170352U JP H0170352 U JPH0170352 U JP H0170352U JP 1987165749 U JP1987165749 U JP 1987165749U JP 16574987 U JP16574987 U JP 16574987U JP H0170352 U JPH0170352 U JP H0170352U
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- semiconductor device
- mounting board
- hole
- package body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165749U JPH0170352U (xx) | 1987-10-29 | 1987-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165749U JPH0170352U (xx) | 1987-10-29 | 1987-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170352U true JPH0170352U (xx) | 1989-05-10 |
Family
ID=31452517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987165749U Pending JPH0170352U (xx) | 1987-10-29 | 1987-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170352U (xx) |
-
1987
- 1987-10-29 JP JP1987165749U patent/JPH0170352U/ja active Pending