JPH0168617U - - Google Patents
Info
- Publication number
- JPH0168617U JPH0168617U JP1987165711U JP16571187U JPH0168617U JP H0168617 U JPH0168617 U JP H0168617U JP 1987165711 U JP1987165711 U JP 1987165711U JP 16571187 U JP16571187 U JP 16571187U JP H0168617 U JPH0168617 U JP H0168617U
- Authority
- JP
- Japan
- Prior art keywords
- component mounting
- mounting board
- insulating filling
- metal body
- interposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987165711U JPH0168617U (en:Method) | 1987-10-27 | 1987-10-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987165711U JPH0168617U (en:Method) | 1987-10-27 | 1987-10-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0168617U true JPH0168617U (en:Method) | 1989-05-02 |
Family
ID=31452446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987165711U Pending JPH0168617U (en:Method) | 1987-10-27 | 1987-10-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0168617U (en:Method) |
-
1987
- 1987-10-27 JP JP1987165711U patent/JPH0168617U/ja active Pending