JPH0167012U - - Google Patents
Info
- Publication number
- JPH0167012U JPH0167012U JP16237687U JP16237687U JPH0167012U JP H0167012 U JPH0167012 U JP H0167012U JP 16237687 U JP16237687 U JP 16237687U JP 16237687 U JP16237687 U JP 16237687U JP H0167012 U JPH0167012 U JP H0167012U
- Authority
- JP
- Japan
- Prior art keywords
- pot
- resin
- runner
- molding device
- cull
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 6
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16237687U JPH0167012U (no) | 1987-10-22 | 1987-10-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16237687U JPH0167012U (no) | 1987-10-22 | 1987-10-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0167012U true JPH0167012U (no) | 1989-04-28 |
Family
ID=31446144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16237687U Pending JPH0167012U (no) | 1987-10-22 | 1987-10-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0167012U (no) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06210674A (ja) * | 1993-01-14 | 1994-08-02 | Nec Corp | 樹脂封止金型 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6239215A (ja) * | 1985-08-14 | 1987-02-20 | Mitsubishi Electric Corp | 樹脂封止型半導体装置の製造方法および樹脂成形用金型 |
-
1987
- 1987-10-22 JP JP16237687U patent/JPH0167012U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6239215A (ja) * | 1985-08-14 | 1987-02-20 | Mitsubishi Electric Corp | 樹脂封止型半導体装置の製造方法および樹脂成形用金型 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06210674A (ja) * | 1993-01-14 | 1994-08-02 | Nec Corp | 樹脂封止金型 |