JPH0165864U - - Google Patents
Info
- Publication number
- JPH0165864U JPH0165864U JP1987162187U JP16218787U JPH0165864U JP H0165864 U JPH0165864 U JP H0165864U JP 1987162187 U JP1987162187 U JP 1987162187U JP 16218787 U JP16218787 U JP 16218787U JP H0165864 U JPH0165864 U JP H0165864U
- Authority
- JP
- Japan
- Prior art keywords
- permanent magnet
- plated
- conductive rod
- plating electrode
- electromagnet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162187U JPH0165864U (ko) | 1987-10-23 | 1987-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162187U JPH0165864U (ko) | 1987-10-23 | 1987-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0165864U true JPH0165864U (ko) | 1989-04-27 |
Family
ID=31445787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987162187U Pending JPH0165864U (ko) | 1987-10-23 | 1987-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0165864U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100528667B1 (ko) * | 1998-09-18 | 2006-02-08 | 삼성전자주식회사 | 도금 장치의 전류 인가부 |
-
1987
- 1987-10-23 JP JP1987162187U patent/JPH0165864U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100528667B1 (ko) * | 1998-09-18 | 2006-02-08 | 삼성전자주식회사 | 도금 장치의 전류 인가부 |