JPH0165170U - - Google Patents
Info
- Publication number
- JPH0165170U JPH0165170U JP1987161287U JP16128787U JPH0165170U JP H0165170 U JPH0165170 U JP H0165170U JP 1987161287 U JP1987161287 U JP 1987161287U JP 16128787 U JP16128787 U JP 16128787U JP H0165170 U JPH0165170 U JP H0165170U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- circuit board
- insulating layer
- board bonding
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161287U JPH0165170U (de) | 1987-10-21 | 1987-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161287U JPH0165170U (de) | 1987-10-21 | 1987-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0165170U true JPH0165170U (de) | 1989-04-26 |
Family
ID=31444083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161287U Pending JPH0165170U (de) | 1987-10-21 | 1987-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0165170U (de) |
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1987
- 1987-10-21 JP JP1987161287U patent/JPH0165170U/ja active Pending