JPH0165168U - - Google Patents

Info

Publication number

JPH0165168U

JPH0165168U JP1987159681U JP15968187U JPH0165168U JP H0165168 U JPH0165168 U JP H0165168U JP 1987159681 U JP1987159681 U JP 1987159681U JP 15968187 U JP15968187 U JP 15968187U JP H0165168 U JPH0165168 U JP H0165168U

Authority

JP

Japan

Prior art keywords

pattern

circuit board

printed circuit

chassis

soldered

Prior art date

1987-10-19

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 230000037431 insertion Effects 0.000 claims description 6
• 238000003780 insertion Methods 0.000 claims description 6
• 239000002184 metal Substances 0.000 claims 1
• 229910000679 solder Inorganic materials 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1

Cited By (1)