JPH0165138U - - Google Patents

Info

Publication number
JPH0165138U
JPH0165138U JP1987160138U JP16013887U JPH0165138U JP H0165138 U JPH0165138 U JP H0165138U JP 1987160138 U JP1987160138 U JP 1987160138U JP 16013887 U JP16013887 U JP 16013887U JP H0165138 U JPH0165138 U JP H0165138U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
circuit boards
fixing
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987160138U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0442939Y2 (US06272168-20010807-M00014.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987160138U priority Critical patent/JPH0442939Y2/ja
Publication of JPH0165138U publication Critical patent/JPH0165138U/ja
Application granted granted Critical
Publication of JPH0442939Y2 publication Critical patent/JPH0442939Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987160138U 1987-10-20 1987-10-20 Expired JPH0442939Y2 (US06272168-20010807-M00014.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987160138U JPH0442939Y2 (US06272168-20010807-M00014.png) 1987-10-20 1987-10-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987160138U JPH0442939Y2 (US06272168-20010807-M00014.png) 1987-10-20 1987-10-20

Publications (2)

Publication Number Publication Date
JPH0165138U true JPH0165138U (US06272168-20010807-M00014.png) 1989-04-26
JPH0442939Y2 JPH0442939Y2 (US06272168-20010807-M00014.png) 1992-10-12

Family

ID=31441943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987160138U Expired JPH0442939Y2 (US06272168-20010807-M00014.png) 1987-10-20 1987-10-20

Country Status (1)

Country Link
JP (1) JPH0442939Y2 (US06272168-20010807-M00014.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04113475U (ja) * 1991-03-22 1992-10-05 富士ゼロツクス株式会社 ハイブリツトic

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04113475U (ja) * 1991-03-22 1992-10-05 富士ゼロツクス株式会社 ハイブリツトic

Also Published As

Publication number Publication date
JPH0442939Y2 (US06272168-20010807-M00014.png) 1992-10-12

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