JPH0162666U - - Google Patents
Info
- Publication number
- JPH0162666U JPH0162666U JP15709887U JP15709887U JPH0162666U JP H0162666 U JPH0162666 U JP H0162666U JP 15709887 U JP15709887 U JP 15709887U JP 15709887 U JP15709887 U JP 15709887U JP H0162666 U JPH0162666 U JP H0162666U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid integrated
- integrated circuit
- circuit
- circuit board
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15709887U JPH0162666U (sl) | 1987-10-13 | 1987-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15709887U JPH0162666U (sl) | 1987-10-13 | 1987-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0162666U true JPH0162666U (sl) | 1989-04-21 |
Family
ID=31436242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15709887U Pending JPH0162666U (sl) | 1987-10-13 | 1987-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0162666U (sl) |
-
1987
- 1987-10-13 JP JP15709887U patent/JPH0162666U/ja active Pending
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