JPH0160543U - - Google Patents
Info
- Publication number
- JPH0160543U JPH0160543U JP15631687U JP15631687U JPH0160543U JP H0160543 U JPH0160543 U JP H0160543U JP 15631687 U JP15631687 U JP 15631687U JP 15631687 U JP15631687 U JP 15631687U JP H0160543 U JPH0160543 U JP H0160543U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor device
- utility
- insulating sheet
- solid material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000011343 solid material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15631687U JPH0160543U (ko) | 1987-10-13 | 1987-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15631687U JPH0160543U (ko) | 1987-10-13 | 1987-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0160543U true JPH0160543U (ko) | 1989-04-17 |
Family
ID=31434749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15631687U Pending JPH0160543U (ko) | 1987-10-13 | 1987-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0160543U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001026432A1 (en) * | 1999-10-01 | 2001-04-12 | Seiko Epson Corporation | Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment |
-
1987
- 1987-10-13 JP JP15631687U patent/JPH0160543U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001026432A1 (en) * | 1999-10-01 | 2001-04-12 | Seiko Epson Corporation | Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment |
| US6867496B1 (en) | 1999-10-01 | 2005-03-15 | Seiko Epson Corporation | Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument |
| US7009293B2 (en) | 1999-10-01 | 2006-03-07 | Seiko Epson Corporation | Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument |
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