JPH0160536U - - Google Patents
Info
- Publication number
- JPH0160536U JPH0160536U JP15592787U JP15592787U JPH0160536U JP H0160536 U JPH0160536 U JP H0160536U JP 15592787 U JP15592787 U JP 15592787U JP 15592787 U JP15592787 U JP 15592787U JP H0160536 U JPH0160536 U JP H0160536U
- Authority
- JP
- Japan
- Prior art keywords
- plane
- supply nozzle
- tip
- seal
- chip seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001154 acute effect Effects 0.000 claims 2
- 238000007664 blowing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15592787U JPH0648841Y2 (ja) | 1987-10-12 | 1987-10-12 | チップシール供給ノズル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15592787U JPH0648841Y2 (ja) | 1987-10-12 | 1987-10-12 | チップシール供給ノズル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0160536U true JPH0160536U (fr) | 1989-04-17 |
| JPH0648841Y2 JPH0648841Y2 (ja) | 1994-12-12 |
Family
ID=31433996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15592787U Expired - Lifetime JPH0648841Y2 (ja) | 1987-10-12 | 1987-10-12 | チップシール供給ノズル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648841Y2 (fr) |
-
1987
- 1987-10-12 JP JP15592787U patent/JPH0648841Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648841Y2 (ja) | 1994-12-12 |