JPH0160174B2 - - Google Patents
Info
- Publication number
- JPH0160174B2 JPH0160174B2 JP9505183A JP9505183A JPH0160174B2 JP H0160174 B2 JPH0160174 B2 JP H0160174B2 JP 9505183 A JP9505183 A JP 9505183A JP 9505183 A JP9505183 A JP 9505183A JP H0160174 B2 JPH0160174 B2 JP H0160174B2
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- temperature
- treatment
- low
- resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005992 thermoplastic resin Polymers 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 15
- 238000009832 plasma treatment Methods 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000003672 processing method Methods 0.000 claims description 2
- 208000028659 discharge Diseases 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 229920005669 high impact polystyrene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 239000004797 high-impact polystyrene Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 229920006127 amorphous resin Polymers 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 229920006038 crystalline resin Polymers 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 1
- VXKWYPOMXBVZSJ-UHFFFAOYSA-N tetramethyltin Chemical compound C[Sn](C)(C)C VXKWYPOMXBVZSJ-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
本発明は熱可塑性樹脂の処理方法に関し、詳し
くは熱可塑性樹脂を特定の温度で低温プラズマ処
理することに特色を有する熱可塑性樹脂の処理方
法に関する。
熱可塑性樹脂はすぐれた物性を有し、かつ成形
が容易であること等の理由から多くの分野で用い
られている。しかしながら、ポリオレフインで代
表される熱可塑性樹脂は極性が小さいために、接
着性、塗装性、印刷性、メツキ性などに劣り、こ
れらの問題点を改善する目的で該樹脂の表面処理
を行なう場合が多い。
熱可塑性樹脂の表面処理法としては、クロム酸
混液処理、コロナ放電処理、フレーム処理などが
知られている。ところが、クロム酸混液を用いる
処理法は廃液の処理に問題があり、他の処理法は
適用しうる熱可塑性樹脂が制限される等の問題が
ある。
そのため、新たな処理法として低温プラズマ処
理法が近年注目されている。この低温プラズマ処
理による熱可塑性樹脂の表面処理を効率的に行な
う方法として、熱可塑性樹脂の表面温度を40〜
100℃という比較的高温度にして行なうことが提
案されている（特開昭57−115431号公報）。しか
し、この方法は熱可塑性樹脂成形品の変形などを
避けるため、使用樹脂の融点もしくは軟化点より
10℃以上低い温度を上限とすることが必要であ
る。一方、種類の異なる２種以上の熱可塑性樹脂
を用いて積層体を製造する場合、接着剤を用いて
両者を貼り合わせる方法や両樹脂間に接着性樹脂
を共押出しする方法などが採用されている。とこ
ろが、この方法は第３成分としての接着剤を必要
としたり、接着性樹脂用の押出設備を必要とする
などの問題点を有している。
本発明は、上記のような欠点をことごとく解消
した熱可塑性樹脂の処理方法を提供することを目
的とするものであり、低温プラズマ処理による効
果がすぐれ、かつ該処理を行ななつた熱可塑性樹
脂表面の活性を利用して樹脂積層体を得ることを
可能にしたものである。
本発明は、熱可塑性樹脂を該樹脂の融点もしく
は軟化点以上の温度で低温プラズマ処理すること
を特徴とする熱可塑性樹脂の処理方法を提供する
ものである。
本発明が適用される熱可塑性樹脂としては特に
制限がなく、たとえば高密度ポリエチレン、低密
度ポリエチレン、ポリプロピレン、２種のオレフ
インの共重合体、オレフインと不飽和カルボン酸
またはその誘導体との共重合体などのポリオレフ
イン；ポリエステル；ポリカーボネート；ポリア
ミド；汎用ポリスチレン（GP−PS）、耐衝撃性
ポリスチレン（HI−PS）、AS樹脂、ABS樹脂な
どのポリスチレン系樹脂；ポリ塩化ビニル；アク
リル樹脂などを挙げることができる。これら熱可
塑性樹脂は単独で用いてもよく、あるいは２種以
上を混合して用いてもよい。さらに、熱可塑性樹
脂には、必要に応じて各種安定剤（酸化、熱、光
など）、充てん剤（炭酸カルシウム、タルク、ク
レーなど）、補強材（ガラス繊維、炭素繊維な
ど）、ゴム類、滑剤、帯電防止剤、可塑剤などを
適宜添加することができる。
本発明においては、上記熱可塑性樹脂を結晶性
樹脂は融点以上、非晶性樹脂は軟化点（あるいは
ガラス転移温度）以上の温度で低温プラズマ処理
を行なう。したがつて、成形品については加熱に
より表面温度を上記の如く昇温し、また押出成形
などの場合はダイより押出された熱可塑性樹脂を
冷却する前の段階で低温プラズマ処理を行なうこ
ととなる。
ここで低温プラズマとは非平衡プラズマであ
り、具体的には高周波放電、グロー放電、マイク
ロ波放電、コロナ放電等によつて空気、酸素、窒
素、水素、アルゴン、ヘリウム、キセノン、炭酸
ガス、亜酸化窒素、メタン、エタン、フレオン、
エチレン、アクリロニトリル、アクリル酸、ベン
ゼン、テトラフルオロエチレン、テトラメチルシ
ラン、テトラメチルスズなど、およびこれらの混
合ガスを活性化して得られるものである。
低温プラズマ処理は0.005〜20トール（Torr）、
好ましくは0.02〜５トールの圧力下で上記放電を
行ない、生じた低温プラズマで所定時間、通常は
１秒〜10分間熱可塑性樹脂を処理する。
低温プラズマ処理後、熱可塑性樹脂は成形品に
あつては所定温度まで降温させ、未成形品にあつ
ては加圧処理などによりシート、フイルム等に成
形する。その場合、他の樹脂類、金属類などの材
料と積層してもよい。低温プラズマ処理した熱可
塑性樹脂と積層する材料が他の熱可塑性樹脂であ
る場合には、該樹脂も前記の如く低温プラズマ処
理を行ない、それぞれの処理された表面同士を重
ね合わせて積層することが望ましい。積層は真空
下もしくは非真空下で行なう。
本発明では、上記した如く、熱可塑性樹脂は融
点もしくは軟化点以上の温度で低温プラズマ処理
を行なうことが必要であり、該温度より低い温度
で処理しても目的とする効果が十分に得られな
い。
本発明によれば、熱可塑性樹脂の表面改質効果
が高く、塗装性、印刷性、メツキ性、接着性など
の性質が向上するほか、積層体を製造する場合に
接着性樹脂を使用しないで接着強度のすぐれた積
層体を得ることができる。しかも、不純物や空気
などが存在しない清浄な雰囲気下で接着を行なう
ことができ、良質の製品が得られる。本発明の方
法はシート、フイルムなどの成形工程に組込んで
一体化できるので設備コストを低減できる。ま
た、本発明により得られる製品にそりや変形がな
いことも特色の１つである。
次に、本発明を実施例により詳しく説明する。
実施例 １
GP−ポリスチレン（メルトインデツクス
（MI）3.8g／10分）のシートをプラズマ処理室に
挿入した後210℃に加熱し、この温度に保持して
１×10-2トールまで減圧した。次いで、窒素ガス
を50c.c.／分の速度で流しながら１トールに調節
し、放電出力50Wで60秒間低温プラズマ処理を行
なつた。
この処理によつてシート表面の水の接触角は39
度となり、処理前の接触角86度と比較し親水性が
増したことが判明した。
実施例 ２
実施例１においてGP−ポリスチレンの代りに
高密度ポリエチレン（密度0.965g／cm3、MI14g／
10分）を用い、かつ加熱温度を190℃としたこと
以外は実施例１に準じて処理した。
処理後の成形品の水の接触角は61度であつた。
なお、処理前の接触角は100度であつた。
実施例 ３〜７
第１表に示す熱可塑性樹脂をそれぞれ所定の温
度に加熱、保持して実施例１に準じて低温プラズ
マ処理を行なつた。次に、プラズマ処理室内で引
続いて２種類の樹脂Ａ、Ｂの各処理面を内側にし
て重ね合せ、加圧して積層体を得た。
得られた積層体の熱融着部の180度剥離強度の
測定結果を未処理試料についての結果と共に第１
表に示す。
The present invention relates to a method for treating a thermoplastic resin, and more particularly to a method for treating a thermoplastic resin, which is characterized by subjecting the thermoplastic resin to a low-temperature plasma treatment at a specific temperature. Thermoplastic resins are used in many fields because they have excellent physical properties and are easy to mold. However, because thermoplastic resins such as polyolefins have low polarity, they have poor adhesion, paintability, printability, plating properties, etc., and in order to improve these problems, surface treatment of the resins is sometimes performed. many. As surface treatment methods for thermoplastic resins, chromic acid mixture treatment, corona discharge treatment, flame treatment, etc. are known. However, the treatment method using a chromic acid mixture has problems in the treatment of waste liquid, and other treatment methods have problems such as limitations on the thermoplastic resins that can be applied. Therefore, low-temperature plasma processing has recently attracted attention as a new processing method. As a method to efficiently perform surface treatment of thermoplastic resin by this low-temperature plasma treatment, the surface temperature of thermoplastic resin is
It has been proposed to carry out the process at a relatively high temperature of 100°C (Japanese Patent Laid-Open No. 115431/1983). However, in order to avoid deformation of thermoplastic resin molded products, this method
It is necessary to set the upper limit to a temperature that is 10°C or more lower. On the other hand, when manufacturing a laminate using two or more different types of thermoplastic resins, methods such as pasting them together using an adhesive or coextruding an adhesive resin between both resins are adopted. There is. However, this method has problems such as requiring an adhesive as a third component and requiring extrusion equipment for adhesive resin. The object of the present invention is to provide a method for treating thermoplastic resins that eliminates all of the above-mentioned drawbacks, and which provides excellent effects from low-temperature plasma treatment and which treats thermoplastic resins that have undergone this treatment. This makes it possible to obtain a resin laminate by utilizing surface activity. The present invention provides a method for treating a thermoplastic resin, which comprises subjecting the thermoplastic resin to a low-temperature plasma treatment at a temperature higher than the melting point or softening point of the resin. The thermoplastic resin to which the present invention is applied is not particularly limited, and includes, for example, high-density polyethylene, low-density polyethylene, polypropylene, copolymers of two types of olefins, and copolymers of olefins and unsaturated carboxylic acids or derivatives thereof. Polyolefins such as polyesters; polycarbonates; polyamides; polystyrene resins such as general-purpose polystyrene (GP-PS), high-impact polystyrene (HI-PS), AS resins, and ABS resins; polyvinyl chloride; acrylic resins, etc. can. These thermoplastic resins may be used alone or in combination of two or more. In addition, thermoplastic resins include various stabilizers (oxidation, heat, light, etc.), fillers (calcium carbonate, talc, clay, etc.), reinforcing materials (glass fiber, carbon fiber, etc.), rubbers, A lubricant, an antistatic agent, a plasticizer, etc. can be added as appropriate. In the present invention, the thermoplastic resin is subjected to low-temperature plasma treatment at a temperature above the melting point of the crystalline resin and above the softening point (or glass transition temperature) of the amorphous resin. Therefore, for molded products, the surface temperature is raised by heating as described above, and in the case of extrusion molding, low-temperature plasma treatment is performed before cooling the thermoplastic resin extruded from the die. . Here, low-temperature plasma refers to non-equilibrium plasma, and specifically, it is produced by high-frequency discharge, glow discharge, microwave discharge, corona discharge, etc., such as air, oxygen, nitrogen, hydrogen, argon, helium, Nitric oxide, methane, ethane, freon,
It is obtained by activating ethylene, acrylonitrile, acrylic acid, benzene, tetrafluoroethylene, tetramethylsilane, tetramethyltin, etc., and mixed gases thereof. Low temperature plasma treatment is 0.005~20 Torr,
The above discharge is preferably carried out under a pressure of 0.02 to 5 Torr, and the thermoplastic resin is treated with the resulting low temperature plasma for a predetermined period of time, usually from 1 second to 10 minutes. After the low-temperature plasma treatment, the temperature of the thermoplastic resin is lowered to a predetermined temperature in the case of molded products, and in the case of unmolded products, it is molded into sheets, films, etc. by pressure treatment. In that case, it may be laminated with other materials such as resins and metals. If the material to be laminated with the low-temperature plasma-treated thermoplastic resin is another thermoplastic resin, the resin may also be subjected to the low-temperature plasma treatment as described above, and the treated surfaces of the resins may be laminated by overlapping each other. desirable. Lamination is performed under vacuum or non-vacuum. In the present invention, as mentioned above, it is necessary to perform low-temperature plasma treatment on the thermoplastic resin at a temperature higher than the melting point or softening point, and even if the thermoplastic resin is treated at a temperature lower than the above temperature, the desired effect cannot be sufficiently obtained. do not have. According to the present invention, the surface modification effect of thermoplastic resin is high, and properties such as paintability, printability, plating performance, and adhesiveness are improved, and when manufacturing a laminate, adhesive resin is not used. A laminate with excellent adhesive strength can be obtained. Furthermore, bonding can be carried out in a clean atmosphere free of impurities and air, resulting in a high-quality product. The method of the present invention can be incorporated and integrated into the process of forming sheets, films, etc., thereby reducing equipment costs. Another feature is that the product obtained by the present invention is free from warping and deformation. Next, the present invention will be explained in detail with reference to examples. Example 1 A sheet of GP-polystyrene (melt index (MI) 3.8 g/10 minutes) was inserted into a plasma treatment chamber, heated to 210°C, maintained at this temperature, and depressurized to 1 × 10 -2 Torr. . Next, while flowing nitrogen gas at a rate of 50 c.c./min, the pressure was adjusted to 1 Torr, and low-temperature plasma treatment was performed at a discharge output of 50 W for 60 seconds. This treatment reduces the contact angle of water on the sheet surface to 39
The contact angle was 86 degrees before treatment, indicating an increase in hydrophilicity compared to the contact angle of 86 degrees before treatment. Example 2 In Example 1, high-density polyethylene (density 0.965 g/cm 3 , MI 14 g/cm 3 ) was used instead of GP-polystyrene.
10 minutes) and the heating temperature was 190°C. The water contact angle of the molded article after treatment was 61 degrees.
Note that the contact angle before treatment was 100 degrees. Examples 3 to 7 The thermoplastic resins shown in Table 1 were heated and maintained at predetermined temperatures, and subjected to low-temperature plasma treatment according to Example 1. Next, in a plasma processing chamber, two types of resins A and B were successively stacked on top of each other with their respective treated surfaces facing inside, and pressurized to obtain a laminate. The results of measuring the 180 degree peel strength of the heat-sealed part of the obtained laminate were compared with the results for the untreated sample.
Shown in the table.
【表】
比較例
実施例３において低温プラズマ処理を25℃で行
ない、220℃に加熱して積層体を得た。この積層
体の180度剥離強度は60g／15mmであつた。[Table] Comparative Example In Example 3, low-temperature plasma treatment was performed at 25°C and heated to 220°C to obtain a laminate. The 180 degree peel strength of this laminate was 60 g/15 mm.
Claims (1)
以上の温度で低温プラズマ処理することを特徴と
する熱可塑性樹脂の処理方法。 ２ 熱可塑性樹脂がシートもしくはフイルム状で
ある特許請求の範囲第１項記載の処理方法。[Scope of Claims] 1. A method for treating a thermoplastic resin, which comprises subjecting the thermoplastic resin to low-temperature plasma treatment at a temperature higher than the melting point or softening point of the resin. 2. The processing method according to claim 1, wherein the thermoplastic resin is in the form of a sheet or film.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58095051A JPS59221336A (en) | 1983-05-31 | 1983-05-31 | Treatment of thermoplastic resin |
| DE8484105965T DE3481041D1 (en) | 1983-05-31 | 1984-05-25 | METHOD FOR TREATING THERMOPLASTIC PLASTIC. |
| EP84105965A EP0127149B1 (en) | 1983-05-31 | 1984-05-25 | A method for the treatment of a thermoplastic resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58095051A JPS59221336A (en) | 1983-05-31 | 1983-05-31 | Treatment of thermoplastic resin |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59052097A Division JPS6096445A (en) | 1984-03-21 | 1984-03-21 | Manufacture of resin laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59221336A JPS59221336A (en) | 1984-12-12 |
| JPH0160174B2 true JPH0160174B2 (en) | 1989-12-21 |
Family
ID=14127253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58095051A Granted JPS59221336A (en) | 1983-05-31 | 1983-05-31 | Treatment of thermoplastic resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59221336A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2875438B2 (en) * | 1992-09-24 | 1999-03-31 | 日本ペイント株式会社 | Surface treatment method for thermoplastic resin products |
| JP5602529B2 (en) * | 2010-07-29 | 2014-10-08 | 日本合成化学工業株式会社 | Manufacturing method of laminate, manufacturing method of polarizing plate with glass substrate, and polarizing plate with glass substrate obtained thereby |
| WO2014069459A1 (en) * | 2012-11-01 | 2014-05-08 | Nok株式会社 | Resin-rubber composite |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57115431A (en) * | 1980-12-30 | 1982-07-17 | Mitsubishi Petrochem Co Ltd | Surface treatment of thermoplastic synthetic resin molded product |
-
1983
- 1983-05-31 JP JP58095051A patent/JPS59221336A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57115431A (en) * | 1980-12-30 | 1982-07-17 | Mitsubishi Petrochem Co Ltd | Surface treatment of thermoplastic synthetic resin molded product |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59221336A (en) | 1984-12-12 |
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