JPH0158665U - - Google Patents
Info
- Publication number
- JPH0158665U JPH0158665U JP15253387U JP15253387U JPH0158665U JP H0158665 U JPH0158665 U JP H0158665U JP 15253387 U JP15253387 U JP 15253387U JP 15253387 U JP15253387 U JP 15253387U JP H0158665 U JPH0158665 U JP H0158665U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- nickel
- tin
- watch
- directly above
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910001369 Brass Inorganic materials 0.000 claims description 3
- 239000010951 brass Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- WDHWFGNRFMPTQS-UHFFFAOYSA-N cobalt tin Chemical compound [Co].[Sn] WDHWFGNRFMPTQS-UHFFFAOYSA-N 0.000 claims description 2
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 claims 1
- 239000010956 nickel silver Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
Landscapes
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15253387U JPH0158665U (ar) | 1987-10-05 | 1987-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15253387U JPH0158665U (ar) | 1987-10-05 | 1987-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0158665U true JPH0158665U (ar) | 1989-04-12 |
Family
ID=31427547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15253387U Pending JPH0158665U (ar) | 1987-10-05 | 1987-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0158665U (ar) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6105798B1 (ja) * | 2016-08-22 | 2017-03-29 | 東京金属工業株式会社 | 装飾めっき物品及びその製造方法 |
-
1987
- 1987-10-05 JP JP15253387U patent/JPH0158665U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6105798B1 (ja) * | 2016-08-22 | 2017-03-29 | 東京金属工業株式会社 | 装飾めっき物品及びその製造方法 |
| JP2018031030A (ja) * | 2016-08-22 | 2018-03-01 | 東京金属工業株式会社 | 装飾めっき物品及びその製造方法 |