JPH0151049B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an array of electrical components such as a disk-shaped porcelain capacitor.

It is convenient to automatically attach electrical components to a printed circuit board if the electrical components are arranged in advance using adhesive tape or the like. For the above purpose, after the electrical components are completed, the electrical components are arranged at predetermined intervals, the lead wires of the electrical components are supported with adhesive tape, etc., and the arrangement is kept constant. Then, only the lead wires are held at predetermined intervals with adhesive tape or the like to form something similar to a lead frame, and then the electrical component is completed by gluing the chip of the electrical component to the tip of the lead wire. A method of taping electrical component arrays has already been adopted.

By the way, the latter method of holding the lead wires in advance with tape has the advantage that not only the insertion into the printed circuit board but also the assembly of the electrical parts can be performed automatically. However, as is clear from Japanese Patent Publication No. 43-11548, etc., such a lead wire arrangement generally has a U
Since the U-shaped lead wire 1 is held between a supporting tape 2 generally called a mount and a single-sided adhesive tape 3, it was necessary to prepare the U-shaped lead wire 1 to obtain two lead wires in the end. . and,
Since this U-shaped lead wire 1 is made by bending a straight metal wire, not only does the amount of metal wire feed become large, but also a space is required for the bending, making the device large and complicated. Furthermore, it has been difficult to increase the lead wire supply speed. Further, since one lead wire 1a and the other lead wire 1b of the U-shaped lead wire 1 are connected by the U-shaped portion having elasticity, one lead wire 1a and the other lead wire 1
It was difficult to maintain the distance from b to a constant value. In addition, since the lead wire 1 is U-shaped, taping work becomes difficult, and the lead wire 1 is attached to the tape.
It was difficult to hold it stably.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for manufacturing an electrical component array that can easily produce an electrical component array that is easy to use.

To achieve the above object, the present invention will be described with reference to the reference numerals in the drawings showing the embodiments. 4, and a step of sandwiching the plurality of lead wires 4 with a support tape 6 and an adhesive tape 7 to form a lead wire array 8, one end 10 and the other end of each lead wire 4. The portion 11 includes the supporting tape 6 and the adhesive tape 7.
an intermediate portion exposed from and including the bent portion 5 is sandwiched between the support tape 6 and the adhesive tape 7;
a step including holding the plurality of lead wires 4 with the support tape 6 and the adhesive tape 7 so that the plate-shaped electric component element 13 can be attached to the tips of the pair of lead wires 4; , a step of sandwiching a plate-shaped electrical component element 13 between one tip and the other tip of the pair of lead wires 4 protruding from the support tape 6 and the adhesive tape 7. It is related to the method.

In the above invention, the lead wire array 8 is formed in advance before the plate-shaped electrical component element 13 is attached to the lead wire 4, and the plate-shaped electrical component element 13 is attached to this, so that the electrical component array can be easily assembled. It can be manufactured. In addition, since the lead wires 4 in the lead wire array 8 are provided with the bent portions 5 in advance, when the plate-shaped electrical component element 13 is clamped at the tips of the lead wires 4, the lead wires 4 do not rotate, and this clamping is prevented. This can be achieved easily and reliably.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 2 to 11.

FIGS. 2 to 6 show each step of manufacturing a lead wire array and an electrical component using the lead wire array. To make a lead wire array, first send out a long metal wire in a certain direction, cut it with a cutter to form the straight lead wire 4 shown in Fig. 2, and insert a wire in the middle of the wire as shown in Fig. 3. A V-shaped bent portion 5 is formed, and then, as shown in FIG. 4, a large number of lead wires 4 are held at predetermined intervals using a lead wire support tape 6 called a mount and a single-sided adhesive tape 7 to form a lead wire array. Make 8. At this time, the bent portions 5 are covered with the adhesive tape 7 with the protruding direction of the V-shaped bent portion 5 of each lead wire 4 aligned with the longitudinal direction of the pair of tapes 6 and 7. As a result, the bent portion 5 is prevented from protruding to push up the adhesive tape 7, and the lead wire 4 is held between the lead wire support tape 6 and the adhesive tape 7 so that it cannot rotate. Ru.
Further, the lead wire 4 is held in such a manner that it cannot be easily pulled out in the axial direction.

In the lead wire array 8 shown in FIG. 4, the lead wires 4 are arranged at predetermined intervals, feed holes 9 are provided at predetermined intervals, and one end 10 and the other end 11 of the lead wires 4 are exposed. Automatic feeding is easy. Therefore, while automatically feeding the lead wire array 8 shown in FIG. 4, bent portions 12a and 12b as shown in FIG. lead wire 4
Create an X shape with a and 4b.

Next, as shown in FIG. 6, a disk-shaped ceramic capacitor element 1 is placed between the bent end portion 12a of one lead wire 4a and the bent end portion 12b of the other lead wire 4b.
3 are sandwiched using the elasticity of a pair of lead wires 4a, 4b, and then the pair of lead wires 4a, 4b are connected to the capacitor element 13 with solder, and then coated with a synthetic resin or the like to form an array of ceramic capacitors. Complete item 14. The magnetic capacitor array 14 as shown in FIG. 6 is cut along the dashed line 15 just before mounting the magnetic capacitor on the printed circuit board.

If the lead wire arrangement 8 is formed as shown in FIG. 4, it becomes easier to arrange the lead wires 4 at predetermined intervals compared to U-shaped lead wires. Further, the bending portion 5 prevents the lead wire 4 from rotating, and also prevents the lead wire 4 from easily coming off in the axial direction. Therefore, as shown in FIG.
The lead wires 4 are stably held by the support tape 6 and the adhesive tape 7 when making the capacitor elements 2a and 12b and when holding the capacitor element 13 as shown in FIG.

FIG. 7 is a side view schematically showing an apparatus for making the lead wire array 8 shown in FIG. 4. In this device, 16 is a first lead wire forming supply section, 17 is a second lead wire forming supply section, and these are the first lead wire forming supply section.
The molding roller 18 is composed of a second molding roller 19, and a guide plate 20, respectively. The reason why the two lead wire forming supply units 16 and 17 are provided in this way is to increase the lead wire supply speed. Therefore, if the supply speed is low, only one unit is sufficient. The first forming roller 18 has holding grooves 21 for holding the lead wires 4 at predetermined angular intervals, and has a V-shaped bent portion forming groove 22 on the outer circumferential surface 23, as shown in detail in FIG. It also has a positioning part 24 for determining the axial position of the lead wire 4. Note that the holding groove 21 located at the highest position in FIG. 7 of the first forming roller 18 is marked with an arrow 25 in FIG.
The metal wire is fed out in the direction shown until it contacts the positioning part 24, and then cut to the length shown in FIG. 8 to obtain a lead wire 4 of a predetermined length. Hold and transport.

The second forming roller 19 that rolls into contact with the first forming roller 18 has a triangular protrusion 26 corresponding to the bent portion forming groove 22, as shown in detail in FIG. Therefore, while the lead wire 4 is being rotated and transferred by the first forming roller 18, it is sandwiched between the first forming roller 18 and the second forming roller 19, thereby forming a V-shape. A bent portion 5 is formed.

Chain type lead wire conveying device 27 shown in FIG.
is a pair of chain drive wheels 28, 29 and a chain 30
The lead wire 4 is horizontally transferred by moving the chain 30 in the horizontal direction shown by an arrow 31. Chien 30 is the 10th
As shown in the figure, it consists of a pair of chains 30a and 30b arranged at a predetermined interval, and recesses 32 for rotatably holding the lead wire 4 are provided at a predetermined interval. First forming roller 1
8 and the chain 30 are driven in synchronization, so when the lead wire 4 is guided by the guide plate 20 and moves near the bottom of the first forming roller 18, the recessed portions 32 of the chains 30a and 30b line 4
, and receives the falling lead wire 4. As shown in FIG. 10, the lead wire 4 is rotatably engaged with the chains 30a and 30b at one end 10 and the other end 11, so that the bent portion 5
always points downward.

Reference numeral 33 denotes a support tape supply device, which includes a support tape supply reel 34 for supplying the support tape 6 and a support tape guide roller 35. Reference numeral 36 denotes an adhesive tape supply device, which includes an adhesive tape supply reel 37 for supplying the single-sided adhesive tape 7 and an adhesive tape guide roller 38.

Reference numeral 39 denotes a first taping roller, which has lead wire holding grooves 40 at predetermined angular intervals, and has an outer peripheral surface 41 around the center of which the support tape 6 is wound, as shown in FIG. left and right protrusions 42 for forming left and right lead wire holding grooves 40;
43 is formed narrower than the distance between the pair of chains 30a, 30b. Further, as is clear from FIG. 7, the roller 39 rotating clockwise is connected to the chain 3.
The left side of the lead wire holding groove 40 is steeply cut to prevent the lead wire 40 from falling when the lead wire 4 is received from 0, but the right side is formed with a gentle slope toward the bottom of the groove 40. has been done. A support tape 6 is wound around the first taping roller 39 by about 90 degrees, and the lead wire 4 is supplied from the chain 30 onto the support tape 6. That is, when the lead wire 4 is moved by the chain 30 to the position closest to the first taping roller 39, that is, to the rightmost end of the chain drive wheel 29, the chain 3
It becomes impossible to hold the lead wire 4 by the recesses 32 of 0a and 30b, and instead, the teeth or protrusions 42 and 43 of the first taping roller 39 lift the lead wire 4 under the lead wire 4. The lead wire 4 is firmly held in the holding groove 40 as the first taping roller 39 rotates clockwise. When transferring the lead wire 4 from the chain 30 to the first taping roller 39, there is no restriction on the direction of rotation of the lead wire 4, so the bent portion 5 is always kept facing downward and the supporting tape 6
placed on top.

The first taping roller 39 transports the lead wire 4 together with the support tape 6 in the clockwise direction in FIG. 4 is held. Since the second taping roller 44 is arranged to press the support tape 6 and the adhesive tape 7 in the direction of the outer circumferential surface 41 of the first taping roller 39, the adhesive tape 7 is pressed against the support tape 6 and the adhesive tape 7. The lead wire 4 is reliably bonded to the lead wire array 8 shown in FIG. 4, which is completed and continuously fed out.

As is clear from the above, according to the present device and method, the amount of feed of the lead wire 4 to the first forming roller 18 is halved compared to the U-shaped case, and U-shaped processing is not required. This makes it possible to downsize the device.

Furthermore, since the bent portion 5 of the lead wire 4 is formed by the groove 22 and the protrusion 26 of the first and second forming rollers 18 and 19, the period for supplying the lead wire 4 to the chain conveying device 27 can be reduced. Using this bending part 5
It becomes possible to form.

Further, since the bent portion 5 is provided in the middle portion of the lead wire 4, the first forming roller 18, the chains 30a, 30b, and the first taping roller 39
When transferring the lead wire 4, it becomes possible to hold both ends 10 and 11 of the lead wire 4, and the transfer of the lead wire 4 becomes easy and reliable.

Furthermore, since the chains 30a, 30b and the first taping roller 39 hold the lead wire 4 so as not to prevent it from rotating, it is possible to keep the bent portion 5 facing downward at all times. The directions are automatically aligned.

Although the embodiments of the present invention have been described above, the present invention is not limited thereto and can be further modified. For example, as shown in Figure 12,
Of course, the present invention can also be applied to a case where three lead wires 4 are arranged to correspond to one electrical component. Further, the bent portion 5 may be formed into a U-shape. Further, although the supporting tape 6 is a non-adhesive tape in the embodiment, it may also be a single-sided adhesive tape.

[Brief explanation of drawings]

FIG. 1 is a front view showing a conventional lead wire arrangement;
2 to 11 show one embodiment of the present invention, FIG. 2 is a front view of the lead wire before the bending part is formed, FIG. 3 is a front view of the lead wire after the bending part is formed,
Figure 4 is a front view of the lead wire array, Figure 5 is a front view of the lead wire array with a bent part provided at the tip of the lead wire, and Figure 6 is a front view of the lead wire array with a capacitor element connected to the lead wire. 7 is a schematic side view of the apparatus for manufacturing a lead wire array, FIG. 8 is an enlarged sectional view of the first forming roller in FIG. 7, and FIG. 10 is an enlarged plan view showing the chain in FIG. 7, and FIG. 11 is a partially longitudinal sectional view of the first and second taping rollers in FIG. 7. It is an enlarged front view. FIG. 12 is a front view showing a modification of the lead wire arrangement. In addition, in the symbols used in the drawings, 4 is a lead wire, 5 is a bent part, 6 is a lead wire support tape,
7 is an adhesive tape, 8 is a lead wire array, 18 is a first forming roller, 19 is a second forming roller,
22 is a bent portion forming groove, 27 is a lead wire conveying device, 33 is a support tape supply device, 36 is an adhesive tape supply device, 39 is a first taping roller,
44 is a second taping roller.

Claims (1)

[Claims] 1. A step of preparing a plurality of lead wires 4 having a straight portion and a bent portion 5 provided at an intermediate portion of the straight portion; and connecting the plurality of lead wires 4 with a support tape 6. This is a step of forming a lead wire array 8 by sandwiching it with an adhesive tape 7, one end 10 and the other end 11 of each lead wire 4.
is exposed from the supporting tape 6 and the adhesive tape 7, the intermediate part including the bent part 5 is sandwiched between the supporting tape 6 and the adhesive tape 7, and a plate-shaped electrical component element is attached to the tip of the pair of lead wires 4. holding the plurality of lead wires 4 between the support tape 6 and the adhesive tape 7 so that the lead wires 13 can be attached to the lead wires 4; A method of manufacturing an electrical component array comprising the steps of: holding a plate-shaped electrical component element 13 between one tip and the other tip of the pair of lead wires 4.