JPH01500255A - Inclined grinding control device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] Inclined grinding assembly field of invention The present invention relates to an assembly for diagonally grinding an object, and more specifically to an assembly for grinding an object diagonally. In other words, the area where the object rests is precisely exposed at the selected angle to a predetermined grinding depth. The invention relates to an inclined grinding assembly.

Related applications This application is a U.S. patent application filed September 5, 1985 by Dawson et al. Part of No. 772.269 "Grinding Guide and Method for Controlling Automatic Grinding of Objects" This is a continuation application.

Background of the invention Currently, the grinding operation establishes a timing interval between each application of the abrasive to the object to be ground. human observation of the speed at which the abrasive material hits the object during grinding. is mainly controlled by. Another control procedure involves the grinder controlling each grinding operation. Attempt to install the mechanical stop at the level corresponding to the desired grinding depth for each operation. ing.

One such object to be ground is a coupon for a printed wiring board. printed wiring board However, the mounting for components such as diodes, capacitors, etc. is surface and electrical. It becomes an interconnection device. Initially, printed wiring boards were printed only on one side. However, today, most wiring boards are double-sided or multilayered.

Multilayer printed wiring boards, i.e. wiring boards with circuits printed on several layers of substrates, are requires uniform and reliable electrical connections. These critical connections are Through-hole is a through-plated hole made by drilling the entire hole through the stacked board layers. (Plated through hole). In other words, the hole is cut with copper. and then soldering to establish electrical interconnection vct. Which through line? It is also necessary to maintain a predetermined uniform thickness for the plating holes. , bumps and other defects during plating make the entire board defective.

Furthermore, the reliability of printed wiring boards depends on whether the solder layer properly adheres to the copper layer. Therefore it depends.

Solder separation is a serious problem in certain situations, especially with 128 Journal of Electrochemical Society, pp. 379-383 (1981 ) Kumar, Kay and Moscaritolo.

Ei, “Optical and Auger traces of peeling of adhesives in printed wiring” 5 (11-143.6 °C (120-1 This becomes a problem when used for long periods at temperatures above 30F.

Oxygen particles accumulate at the interface between the solder layer and the copper layer, eventually causing the solder bond to peel off. arise.

It is common for multiple printed wiring boards to be formed on a single panel of material. inspection Fortunately, plating defects are usually small defects, Appears in most of the through-plated holes of printed wiring boards or the interface between copper and solder. Therefore, One or more coupons are formed on the panel for each wiring board to be printed.

To examine the copper-solder interface, each coupon was plated at the same time as the printed wiring board. There are one or more elongated pads. Coupons are specific to individual circuit boards. An identification code is affixed to it and then removed for later lateral distortion.

Grind the specimen at a slight angle to expose more of the interface. is desirable. The enlargement of the exposed interface is due to the fact that the layers are very thin, i.e. the copper layer and the solder. The layer is generally 0.05 to αO75+w (2 to 3 mil), and the interface is further This is especially important since it is thin. Currently, one or more specimens have an inclination of 6 degrees. It is attached to a Teflon cylinder. The botting mold can be cut out from specimens and cylinders. and filled with botting material to form a first potting surface. filled. This mold was removed and the partially pot-molded specimen was placed in a Teflon cylinder. Pull it up and turn it upside down. A second mold is placed on the exposed surface of the coupon and added of botting material and now act as a holder for the coupon. Make sure to completely bury it in the potting material.

Unfortunately, for inspection purposes, grinding is currently not possible as it requires very high accuracy. is a tedious, time-consuming process. Human monitoring of grinding machines thus including at least 3 or 4 steps achieved manually or semi-uniformly. Ru. The grinder has a number of adjustments located within the disc and containing a hardened material such as diamond. Accepts one or more retainers with flexible mechanical stops.

The first potted surface of each holder is pressed against a grit that rotates at several hundred rpm. and then ground for several minutes.

The coarse whetstone is replaced with a raw stone, and the medium whetstone is pressed against the holder and pressed against the holder for a powerful time. Disciplined and rotated. When using semi-automatic machines, the operator must After the do stopper comes into contact with the grindstone, the worker removes the cut piece from the living Buddha and then , reattach the diamond stopper. Next, use a fine-grain abrasive for 50 to 50 seconds in the dark or Press against the specimen until all diamond stops touch the abrasive material again. It will be done. For grinding machines, the diamond stop should be set at the same height as the retainer. It will be fixed. After that, the exposed specimen at the location where the copper-solder interface was prepared was Processed in more than one polishing stage.

The total cost and labor for grinding one or more cutouts for each board is Considering that the number of "millions of marks" circuit boards produced is constantly increasing. and raises serious issues. Currently, most of the cutting specimens are 1 piece per cutting specimen. It is hand-ground at a cost of $5 to $20. Manual grinding requires constant worker Requires care and frequent inspection with microscopic fl. Visual inspection is carried out on a case-by-case basis. Suspend cutting work. Reliability varies greatly depending on the operator.

That is, over-grinding and under-grinding frequently occur.

Since the specimen is destructively exposed, grinding errors are irreparable and the second cut If coupons are not available for complete regrinding, the value of a matched printed wiring board This results in complete elimination. If insufficient grinding is detected, cut out the specimen and remove the entire work. It can be corrected by returning the cut specimen to the Therefore, additional unplanned grinding work had to be started.

Half-white W or N stock assisted grinding also requires one operator to be very careful. collection Although hand grinding is more reliable, there are several sources of accumulating errors, so Unreliable for exposing thin interfaces. The cut-out specimen is a potting material. It may be installed in the wrong place against the bring about too much. Furthermore, the retainer is located at the lowest point within the disc relative to the mechanical stop foot. It can become misaligned initially, and the stop itself can wear out over time. There is sex. Also, it is possible to misplace some retainers relative to each other within a single disk. There is sex.

One device interconnects two terminal boards with a shorting conductor attached to the substrate to be ground. We are trying to automate grinding by doing this. Grinding operation flows through the shorted conductor controlled by the amount of current drawn. This technique, however, is relatively inaccurate and last Relying on manual finishing.

Therefore, an object of the present invention is to perform grinding along a plane oblique to the surface to be ground of an object. An object of the present invention is to provide an inclined grinding assembly that accurately controls cutting.

Another object of the present invention is to cut out a specimen of a printed wiring board to expose the copper-no-da interface. An object of the present invention is to provide an inclined grinding assembly for grinding in a manner similar to that of the present invention.

Another object of the invention is to provide an inclined grinding assembly adapted for fully automated grinding. Is Rukoto.

Another object of the present invention is to prevent over- or under-grinding of cut specimens. It is an object of the present invention to provide an inclined grinding assembly such as Uedago.

The present invention provides a method for processing an object, such as a printed circuit board, at an angle to its surface. Truly effective control of grinding requires a disposable control plate that carries the grinding guide. achieved by mounting coupons on precisely positioned and beveled shelves. The guide is mounted on the control board and the two conductive leads are interconnected. The shelf has a control track that allows the track to be cut out at all pre-position angles. This occurs at the same time as the specimen is ground to the desired predetermined depth. It arises from the realization that it is positioned in the right direction.

The present invention is a grinding assembly for grinding an object at a predetermined angle to a predetermined grinding depth. It shall be a metal symbol. Conductive interconnecting conductive leads with at least two conductive leads a control plate carrying a grinding guide with a control track and a top surface supporting said object? There is a shelf to hold. The shelf ensures the grinding surface of the oblique object at the predetermined angle. It is positioned relative to the control board so that it is upright. The shelf further includes the predetermined location of the object. The depth of the object is positioned so that it is aligned with a portion of the trailing edge of the track. When the front track is ground along the diagonal grinding surface to a predetermined grinding depth is completely polished.

In one embodiment, the grinding assembly further includes a shelf and a control plate relative to each other. means for positioning, e.g., means for engaging the shelf at the control plate such that the control plate aligns with the shelf; Includes at least one touring bin hole for receiving the touring bin means to Ru. The tooling pin holes are oriented to engage the tooling bin means on the top surface of the shelf. You may position it so that it can add t.

Tooling bin means is a metal bin made of soft metal that is easily ground and exhausted. There may be. Alternatively, said means for positioning may secure the shelf relative to the control board. There are bracket means to attach it. This bracket means is slidable on the control plate. It may include means for movably engaging and clip means for slidably receiving the shelf. .

In another embodiment, the control track.

A 1m through-plated hole passes through the control board, and the grinding assembly also attaches objects to the shelf. have the means to do so.

This grinding assembly may be potted with the upper of the botting material and the grinding guide further interconnects the conductive leads such that at least a portion of the trailing edge is connected to the control track of the other. and a second control track precisely positioned relative to the trailing edge of the track.

The control board may have multiple layers, each control track having two different layers. arranged in layers.

In yet another embodiment, a shelf is formed in the cup that supports the object during grinding. be done. The shelf has one or more ridges that raise the object at a predetermined angle. The cup may further have a predetermined depth with respect to the top surface of the shelf and receive the control plate. It may also have a long hole. The object to be ground is a mark with a plated interface to be exposed. It can also be a cut-out sample of a printed wiring board (1° Description of the preferred invention Other objects, features and advantages may be found in the following description of the preferred embodiment and in the accompanying drawings. will be found from. In the drawing, Figure 1 is an exploded axial projection view of a conventional multilayer printed wiring board. FIG. 2 shows the multiple printed arrangement of FIG. 1 illustrating possible defects in the plating operation. A cross-sectional view of a plated hole in a wire plate, FIG. 3A is a schematic plan view of a conventional cutout specimen and wiring board arranged on a panel; FIG. 3B is an enlarged view of one of the coupons in FIG. 3A; Figure 4 shows the errors that occur during measurement of plating thickness against the distance from the diameter of the test hole in the cross section. The difference diagram, Figure 5A, shows the new skewed grinding assembly printed on the cutout 9 specimen. plan view of FIG. 5B is an enlarged detail of a portion of the control track of FIG. A view showing the trailing edge of the track aligned with Figure 6 shows the axial side projection of the specimen shown in Figure 5A embedded in the stand with the specimen attached. figure, Figure 7 shows a through-plated hole on the cut-out specimen that is used as a control hole. Top view of the new grinding guide, Figures 8A and 8B are schematic cross-sections of the cut-out carcass of Figure 7 after successive grinding stages. side view, Figure 9 shows the use of common through plated holes to enable continuous monitoring of the guide. Axial projection of two new grinding guides interconnected with each other, FIG. 10A shows a specimen with a rust-solder interface to be exposed. 1 is a schematic exploded axonometric projection of an inclined grinding assembly according to the invention; FIG.

FIG. 10B is a cross-sectional view of one of the coupons shown in FIG. 10A.

11 is a schematic elevational view of the grinding assembly of FIG. 10A, and FIG. 12 is a schematic elevational view of the grinding assembly of FIG. 10A and FIG. FIG. 12 is a schematic elevational view of the inner layer of the control plate shown in FIGS.

Figure 13 is a schematic axial measurement of the two brackets that position the shelf shown in Figure 10A. Projection view, Figure 14 is a shaft side projection view of a more complicated bracket, Figure 15 is a control board. FIG. 4 is a partially cutaway axial perspective view of an alternative inclined grinding assembly according to the present invention with the Figure 16 shows a tool for forming the shelf and miso shown in Figure 15.

FIG. 17 is a cross-sectional view of an alternative shelf configuration.

The present invention provides a rack for supporting an object to be ground at a predetermined angle to a predetermined grinding depth, Each conductive control track has one or more conductive control tracks that connect a pair of conductive leads to each other. This can be achieved by an inclined grinding assembly having a control plate carrying the cutting guide. The shelf is Establish an inclined grinding surface at a predetermined angle and control the predetermined depth of the object. The object is positioned relative to the control plate so that it is aligned with a portion of the trailing edge of the The track is ground out when the track is ground to the predetermined depth. Ru.

The inclined grinding assembly according to the present invention can be used for cutting coupons etc. for single-sided or double-sided wiring boards. Although it can be used for objects, the inclined grinding assembly is suitable for multilayer wiring boards such as the one shown in Figure 1. This is particularly useful for cutting and grinding specimens because each multilayer plate has a large number of This is because time and money are invested. Multilayer printed wiring board 10 includes layers 12, ill, Contains 16.1g and 2o. Wiring board layers 12.16 and 2o carry circuits. Both sides are plated to form copper-clad plates on their skin. each time The paths are insulated from each other by insulating layers ill and 18, respectively. Wiring board layer 12. The circuits printed on the top side of 16.2° are shown as solid lines, and the circuits printed on the bottom side of these layers are shown as solid lines. The circuits shown are indicated by dotted lines.

After assembling and aligning the wiring board layers and insulation Wj with each other, the wiring board completes the circuit. selectively plated to establish through-plated holes as shown in phantom lines. Hole 26.2g represents the electrical interconnection provided by the plated hole. ing. f(I)

The components attached to the stand 30 are installed separately. , holes 110.1JI, 112.113 and H 1111 are exemplified by hole 26. When plated as a single through-plated hole, as shown in Interconnected by lines 52.31+, 36 and 38.

The trace plating holes 26 (Fig. 1) of the assembled multilayer wiring board 1o are made through the nine holes. Shown in cross section in Figure 2 to illustrate possible defects that may exist during the plating step. These defects were discovered by examining the test holes in the attached cut-out specimen. It is expected that Printed wiring boards 12, 16 and 20 are respectively Shown with 3o and 52, 31i and 56, and 38 and 39 on the copper cane plate 3o and 52. ing. Through-plated holes such as hole 26 must electrically connect these circuits. The circuits are internally separated by interlayers 11I, 18. Each layer assembled together After the copper clad plate 90 is plated through the holes 26 by an additional plating step, Ru. Artifact 91 was not properly removed, and the connection between copper clad plate 36 and plating 90 was This represents contamination of the resin that reduces the electrical contact between the two. Racking within the laminate 92 indicates the potential for short circuits between weakened structures and copper-clad circuits. groove 93 is a hair-thin crack in the plating 90.

Next, solder plating 91i is plated on copper plating 90. Flaw 96 is unbroken. The void 98 shows both the copper plating 90 and the solder plating 94. It shows the void in the plating that penetrates. Groove 9 penetrates copper plating 90 This indicates a large crack. Certain defects such as nodules 100 can be tolerated. However, copper plating 90 may create unacceptable nodules 102. Also, plating Pocket 104 and circumferential clearance 9106.108 are also unacceptable.

Finally, the plating layer itself has a specified density. The dimension arrow 110 is Represents the range of plating thickness desired for solder plating 94, which is typically o, OO25 to α005 (m. Dimensional arrow 112 indicates the tolerance of the copper plating layer 90. This indicates that the possible width range is o, OO25 to 0.005crIL. Ru.

It is immediately clear that it is necessary to determine the quality of through plating. Also, what It is also clear that individual electrical testing of through-plated holes is also expensive and time consuming.

Additionally, destructive testing, while most commonly revealing defects, still It cannot be done. Therefore, individual coupons with a large number of sacrificial test holes are Provides a practical heat bath to check the quality of plating.

Typically, multiple circuit boards are printed on a single panel, such as panel 116 in Figure 3A. It will be done. Printed wiring boards +48, 50, 52, and 51I are mounted on panel li6. A pair of cut-out specimens of 56% 5g, 60% and 60% were placed in close proximity to each printed wiring board. and 62. In order to test the quality of the plating, the line above the cutout specimen 69 is 68 is later stressed to ensure proper plating. Printed wiring board 118 To test the quality of through-plated holes such as hole 611 in The test hole in specimen 66 is then examined in cross section.

The coupon 66 is shown in greater detail in FIG. 3B. Usually printed wiring board Test holes to monitor the starting and finishing quality of the drill bit on the 70 and 72 are drilled before hole 614 is drilled, and test holes 71i and 7 6 can be put aside for later. Test hole? 0,72.711 and 76 are hole 61i At the same time, it is plated with Sutsuka.

Additionally, the botting material was heated to form a support to support the cut-out specimen. The specimen is used to align in the conventional manner in the −6’kW before Alignment holes! ! 0.82 is also shown. The cutout specimen 66 is removed from panel II6 using a punch.

Once the test hole in the cut specimen is exposed in cross section, the depth of exposure is the measurement of plating thickness. affect. Figure 4 shows the thickness of the copper plating 113 as shown in the cross section of Figure 3B. 7 is a diagram of the error that occurs during the measurement of the distance from the diameter of the hole 72. line 111 1 represents the cross section corresponding to the diameter, lines 116, 118, 120 and 122 are l It represents an exposed cross-section with increasingly larger displacements from the diameter 1111. straight The measurement error in μm for the displacement from the diameter 1114 is IG mil for the hole 72. When the plating 113 is 1 m11, O shown in Table 1 Table 1 25.0 (LO) α65 (0,0250) 50.0 (2,0) 156 (α0 625) 75.0 (3,0) 150 (α1000) 100゜0 (14,0) 14.58 (0,1750) cross section 116 is 25.0 μm- 1ml1l-displaced. Radius line 1211 and cross section 116 inside copper plating 90 The difference in length between them is 0.63 μm (0.025 m11). The cross section 122 is The true thickness represented by line 126 is 11.511μm (0.1750ml ), which results in a measurement error of 17.5%.

These errors caused by over-grinding and under-grinding can be corrected by the new grinding method shown in Figure 5A. This can be prevented using the cutting guide 130. The grinding guide 150 is attached to the cutting specimen 132 I get kicked. The tooling hole 13+1, 136 indicated by a temporary line is located on the grinding guide 150. Not just a part.

It is used during normal handling and alignment of the coupon 152. Grinding guide 1 50 is conductive lead 15F! , 11i0.142 and 1lj14 .

Conductive leads 138 and 1110 are interconnected by conductive control tracks 1li6. The conductive leads 1142 and 11411 are connected by track 1118. conductive leads 111O and 142 are connected by track 150. It is. The control holes 152, 151i and 156 have three grinding stages, e.g. Track 1146 as coarse, intermediate and fine grinding machine-broken track , 111 & and 150.

Although the control holes are shown as drill holes, for example, the control holes may be surrounded by holes 152. Removal of scratched track material by laser etching or other removal methods good.

Conductive lead 138.11+O%IIJ2 and 114+4 are through plating test hole 1 60.162.1611 and 166. Cut out The surface 168 of the sample 152 is ground to expose the test holes in cross section. When the grinding causes the material to stagnate up to the control hole 152.

Breaking occurs first at track 1116. Track 11↓0 or track 150 A circuit is formed by powering another lead that responds, lead 138 to detect current or voltage. The circuit allows surface 168 to pass through the track and control When grinding at hole 1521, it is interrupted. Thereby, the predetermined grinding depth is established by its control track.

After track II46 is interrupted, it becomes smaller until track Ill is interrupted. A suitable grinding force is applied to the grinding surface 168. Finally, grinding with a fine-grain abrasive is done using a track 150. continues until interrupted. Transfers power to the next lead when monitoring the next track. Track 14 when it is desired to keep positive power on a single lead instead of 0 or 1112' Jk can be traced back, and the remaining 5 tracks can be used. You can monitor it to know about sudden drops in power, which would indicate a broken truck. Instead, The induced pulses generated when the track is fully ground may be detected.

Conductive leads 1110, 1112 and control tracks 150 are shown in an enlarged view in FIG. 5B. It is shown in Diameter where control hole 156 passes through the center of test holes 162, 1611 170. Dimension 172 indicates that control hole 156 is slightly ahead. The grinding machine, which performs the grinding operation with Make sure to remove part of the surface 168 and make another square in the garden. It shows that you are doing something. For a typical coupon grinding operation, 17 The leading distance shown in 2 is from 25,0 to 50,000. Oμ mouth (1 to 2 mil ). The control track 15I4 in FIG. 5A is 75.0 μm in diameter of the test hole. (3 mil), and the coarse control track 152 is 150.0 μm (6 mil) ahead. precede by l).

To prepare the specimen 152 for grinding.

It is shown in Figure 6 that the specimen is attached to the base 1.711. Epo-Kwik sold by Buehler “Potted” into a potting material such as epoxy. Cut sample 132 is surrounded by potting material up to line 176. Cutting specimen during grinding Surface 168 of 132 is polished to surface 168a shown in phantom.

Conductive leads 13g, 1140.1112 and 1lill are The thickness is shown slightly raised so that it protrudes somewhat from the surface of piece 132. There is. This protrusion facilitates coupling with the edge connector of the grinding machine.

The individual grinding force for each cutout specimen is determined by grinding a single cutout specimen at a time. is most accurately obtained by The same attachment can be attached to a pedestal, as shown by specimen 178. additional cutting The coupon is aligned with the coupon 132 during botting, for example. It will be done. The top of each non-contoured coupon 178 is above the limit 176 of the top botting material. It is desirable that the specimen 15 should not extend significantly on υ and be monitored accordingly. 2 and the grinding machine without any physical obstruction. Then turn off The cutout specimen 132 is being ground, and all the cutout specimens on the mounting table 1711 are being ground. monitored to control.

The grinding guide 180 in FIG. Mounted on two different sides of interconnected coupons 182. control Rack holes 181i and 2011.206 are formed by test holes 208.186 and 188. During the same process, it is milled and plated. The control track hole 2011 is , interconnecting the upper conductive lead 210 with the lower conductive lead 212 shown in phantom. do. Similarly.

The control track hole 206 connects the upper 1 conductive lead 2111 to the lower 11 conductive lead 21. 6 and the side repair track 184 interconnects the lead 189 with the lead 190. Continue.

In this configuration, the grinding guide 180 can also be used as a waste wire connector with only four contacts. all four contact points are on the same plane. This convenient configuration (2, 11 conductive Leads 190, 216, 212t - common lead 192 and one through plated hole 4 This is accomplished by connecting to the power supply lead 196 through the power supply lead 196.

Control track hole 13: I, 2 cores, 296 trailing edge is the test indicated by the dashed line 21B Precisely positioned with respect to the centerline of holes 186, 188, 208. Grinding in progress , the trailing edge of each control track hole 181&, 201i, 206 is completely ground next k. Apply the whetstone to the grinding surface 220 until the grinding surface 220 is ground. For example, the control track hole 201i.

As shown in Figure 8A, it has been completely ground.

Test hole 208 is partially exposed and control track hole 206 is partially ground down. has been done. but.

Trailing edge 207 remains intact at this stage.

After the trailing edge of the control track hole 2011 is ground, the finer grinding wheel is used to control It is applied until the trailing edge 207 of the track hole 206 is completely ground. This trailing edge The chipping occurs simultaneously with the exposure of the true cross-sectional diameter of the test hole 208.

Control track hole 1f! l! %204.206 of copper.

Can be through-plated with copper and solder or other conductive materials. Additionally, control Tracks are not limited to through-plated holes. For example, to establish a control track A solid wire or rod can be passed through a pre-drilled hole in the coupon.

Establishing a control track throughout the thickness of the specimen tends to have a number of drawbacks. This is especially true if what is to be exposed also extends through the thickness of the specimen. It is. In order to take out the test hole 2J in the wire resistance cutout specimen, C is parallel to the test hole. Positioning of the trailing edge of the control track hole ensures that the test hole is not over-ground. No. As shown in phantom in Figure 8B, the trailing edge 207 of the control track hole 206 is Even a partial hole in the solder may still cause the grinding operation to stop. Therefore, Even if the plane of the grinding wheel is not parallel to the control track hole 206, the test hole 208 will not grind. There will be no over- or under-grinding.

Grinding control device 228 in FIG. 9 represents a combination of grinding guides 130 and 180. Ru. The control device 228 controls the grinding guide 230 connected by the through-plated hole 25. , 252, and the damping device 22g mates with a standard 4-bin edge connector, but with a 6-bin edge connector. control over two grinding operations. Lead 256 is grinding guide 2300mm 60 Acting as a common lead, lead 238 serves as a co-b lead for grinding guide 232. and move.

During grinding, control tracks 21jO12142> and 244 are ground or dropped one after another. 1. The trailing edge of the common Q through-plated hole 2311 is after the control track 2411, It will be removed at the same time as it is removed. Therefore, the grinding guide 230 has a monitoring device ( (not shown), at which point the monitoring device monitors the grinding guide 232? start do. Next, the control tracks 246, 248 and 250 are the last three grinders. Monitored to control operations.

The grinding assembly 260 of FIG. 62K gold is used to control the grinding of the specimens 266 and 268. Cut sample 266 ．． 268 is copper-hard for each bud 272.2711 and 276.278. 12 so that the contact surface is completely ground at a predetermined angle to a predetermined grinding depth. attached to a shelf 270 positioned relative to the guide 262. . The one-dot chain line 323 indicates the alignment of the cutting specimen 266 and 268 with the grinding guide 262. represents.

A portion of coupon 266 and elongated pad 272 are shown in cross-section in FIG. 10B. There is. Pad 272 is connected to solder layer 280 . Copper layers 282 and the interface between them 01 Equipped with 2811. Shelf 27o, D starvation level 264; orientation with respect to τ is the dashed line 28 6 and the dashed line 286 is the upper surface of the pad 272. 2S8 (forms an angle to is preferable.

Ken 1: Tilting with respect to the surface of the 1 dead bad 2T and the interface 2g++ is The surface 28Ilf is exposed at a distance indicated by the heavenly mark 290. Distance 290: Well, world It is many times larger than the % thickness of surface 2g’a, improving the accuracy of inspection in these 9 areas. .

Shelf 270 (FIG. 10A) defines a slot 292 that receives control plate 2611.

The tooling pins 2911.29G shown by imaginary lines are the primary tooling pins, respectively. 298.500 and engages the upper surface of the coupon 266.268. tsu -Ring hole 291! f, 300 are offset from each other by an angle A.

The grinding guides 262 are arranged in different layers for coarse, medium and fine side (to) tracks. . The tightness control track 304 is shown on the outer layer 306 of the control board 2611 and is The coarse and coarse control tracks are located in layers 308 and 310, respectively. common lead 3 12 and precision lead 3111 are precision fIr! Direct contact with control track 504 Printed on layer 306 so as to continue, medium conductive leads 316 and coarse conductive leads 318 Only the lower buttock area is printed on layer 306. facing plated holes 520, 322 and 32+1 are the common conductive leads 512 . to the rest of the grinding guide 262 , respectively. middle school conductive leads) 16 and rough conductive leads 318 are all mounted.

When shelf 270 is assembled to lie along dashed line 328, grinding assembly 260 will have an appearance as shown in FIG. Touring pin 291! , 296 (Fig. (not shown) is the shelf 270'f: tooling hole 29 in order to match the attachment amount at the corner fifA. 1! , 300 can be attached throughout. Touring pins 294 and 296 are plastic It is preferably made of a soft metal that is easily ground, such as steel or copper.

Grinding assembly 260 is supported by shelf 270 by tooling pins 2911.296. By placing the grinding assembly upside down in the potting mold to The pot is formed in a pot. After pot forming, the grinding assembly 260 is moved in the direction indicated by the arrow. It is ground in the direction. The coarse control track and medium control track are indicated by phantom lines. The removed trailing edges 332 and 331j grind away most of the material to be removed. They are being ground one after another as if they were being crushed. The final grinding depth is the precision control track 501+. Controlled by trailing edge 336.

The inner layer 308 of control plate 264 is shown in FIG. Conductive lead 538.3 IIO connects the common through plated hole 520 and the middle through plated hole 322 with the instep control track. It is extending at 31124. In an alternative configuration, trailing edge 332.33I+; 336 can be established by three through-plated holes offset from each other above shelf 270. Wear.

Shelf 270 can be positioned relative to control plate 2611 using many different techniques.

For example, the shelf 270 may be installed in the tooling pin holes 3116, 3118 of the control plate 2611. It may also include a downwardly extending flange that connects the tooling bin to hole 5. A hole aligned with hole 5116.548 is provided to receive it through It's on. As an alternative, the shelf 270 can be mounted on diagonal legs across the control m@2611. By a bracket such as bracket 350.352 supporting 3514.356 I can support it. Bracket 350a (No. 14) has protrusions 358 and 360. and the protrusions 359 and 361 to accommodate the shelf 270 in a slidable manner. Tighten it in place. Platan) 350a is made of 1 elastic material and is attached under the bracket. Compress sides 1 together and pass through elongated hole 292, protrusion 358.360.359 361 is released to engage shelf 270.

Objects to be ground, such as coupons 266, can be easily contained on shelf 270. It can be attached to the alarm or shelf using adhesive. Alternatively, cut Place specimen 266 into the preformed botting cup shown in FIG. Can be attached.

The inclined grinding wheel body 370, shown with the control plate removed, has slotted holes 3 for receiving the control plate. 7) It is equipped with a botting cup 372 in which ↓ is formed. Bottin test A shelf 376 is provided on which pieces 378, 380 are placed. Long hole 37+! and shelf 37 6 is cut by a tool 582 (FIG. 16) with a slope 584 and a protrusion 386 of 6. can be determined in one configuration. The botting die is placed around the tool 582 and falls over. Botting material is added that hardens to form a vertical cup 372.

The shelf 376 of the cup 372 controls the relationship between the coupon 378, 380 and the control plate. Establish. The depth of the elongated hole 3711 is determined by controlling the cutout specimens 37g and 3gO on the control board. It is selected in advance to be aligned with the track Wt-.

For potting cup 372a with ridges 390.392.3 11 A replacement shelf configuration is shown in FIG. The cutting sample 580a has one end attached to the raised portion 3. 90 and the other end is lifted by the raised part 392 It is shown in

A space 396 is created below the coupon 380a so that the botting material can be plated 3. 98 around and below specimen 3g0a to ensure uniform contact with specimen 3g0a. Allow it to flow. An alternative method is to make a cavity in the top of the shelf and The cutting material is received under the coupon.

The grinding assembly according to the invention has an angled surface - with respect to the surface. Can be used to grind objects other than coupons, such as objects where a different grinding surface is desired. Wear. For example, a wedge of 6 with a bottom @1 surface sloped 6 to the top surface. When an object like this is placed on the 6 angled shelf according to the present invention, the 11 table The plane will be parallel to the plane of the grinding surface.

The grinding depth can be determined by monitoring electrical parameters other than the occurrence of open circuits. Can be controlled. Monitor control track grip as it increases beyond a preset amount can. For two parallel tracks separated by a dielectric, their The capacitance of the circuit can be monitored to see if it falls below a predetermined value. these Parameters can also be used to control grinding strayness or pressure.

Certain features of the invention may be shown in some drawings and not in others; For convenience only, it is intended that each feature be combined with all other features according to the invention. This is because it can be done.

The fruits of the land@Example 1 may occur to the person concerned and are included within the scope of the following claims. There is.

F/θ2 F/64 F/θ5B 7G 6 FIG 9 Rθ10B FIG, // FIG/2 Handbook Supplementary Book September 29, 1988 Yoshi, Commissioner of the Patent Office 1) Takeshi Moon (Mr. Examiner) 1.Display of the incident 2. Invention) io name, designated product: slanted grinding assembly 3. Person who corrects Relationship to the case: Patent applicant Laboratory Incorporated.

61. Number of inventions increased by amendment 0 Scope of invention claims L: Grinds an object at a predetermined angle to a predetermined grinding depth, at least two conductive leads and a conductive control track interconnecting said conductive leads; a control plate carrying a grinding guide having a has an upper surface that supports the object and has a predetermined angle with respect to the control plate; Establish an inclined grinding surface on the predetermined grinding surface of the object, Align the depth of cut with a portion of the trailing edge of the control track, and then grind the object at an angle. When grinding at the predetermined grinding depth 1 along the cutting surface, the track is completely ground. a shelf positioned relative to the control plate to allow the control plate to be cut; Grinding assembly.

a. The claimed invention further comprises means for positioning the shelf and the restraining plate relative to each other. An inclined grinding assembly according to scope 1.

5. A tool that engages the shelf so that the positioning means aligns with the shelf full control board. Claims comprising at least two tooling pin holes for receiving tooling pin means. Pigment grinding assembly according to paragraph 2.

4. Is the positioning means a shelf? Provided with bracket means for securing to the control board. An inclined grinding assembly according to claim 2.

5. Claim: the control track comprises a through-plated hole passing through the control plate. An inclined grinding assembly according to paragraph 1.

An inclined grinding assembly according to scope 1.

the trailing edge that connects and is precisely positioned relative to the trailing edge of the other control track. An incline as claimed in claim 1, comprising a second control track having a portion of the metal. Grinding assembly.

Grinds to a specified grinding depth. a shelf having an upper surface for supporting the coupon, at least two conductive leads and a front surface; Carrying a grinding guide with one conductive control track interconnecting the conductive leads a control board to Establishing a grinding surface inclined at the predetermined angle to the coupon, Align the predetermined grinding depth with a portion of the trailing edge of one of the control tracks and make the cut. Cut the sample along the inclined grinding surface to expose the predetermined grinding depth. When the specimen is ground to the predetermined grinding depth, the track is completely ground. how to control the shelf? Means for positioning with respect to KJ temporary A grinding assembly comprising:

9. The bevel grinding assembly of claim 8 formed therein.

Three-dimensional.

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Claims (21)

[Claims] 1. It grinds objects at a predetermined angle to a predetermined grinding depth. at least two conductive leads and a conductive control track interconnecting said conductive leads; a control plate having a grinding guide having a has an upper surface that supports the object and has a predetermined angle with respect to the control plate; establishing an inclined grinding surface on said object at said predetermined grinding depth of said object; align the object with a portion of the trailing edge of the control track and place the object on the inclined grinding surface. When grinding along to the predetermined grinding depth, the track is completely ground. a barrel grinding assembly, comprising: a shelf positioned relative to said control plate to enable Three-dimensional. 2. Claims further comprising means for positioning the shelf and control plate relative to each other. Inclined grinding assembly according to paragraph 1. 3. The positioning means includes a tool that engages the shelf to align the shelf with the control plate. Claims comprising at least two tooling pin holes for receiving ring bin means. Inclined grinding assembly according to clause 2. 4. tooling pin means such that the tooling pin hole engages the top surface of the object; 4. An inclined grinding assembly as claimed in claim 3, which is arranged to orient. 5. Inclined grinding according to claim 3, wherein said tooling bin means is a metal bin. Cutting assembly. 6. Claims wherein the metal bottle is formed of a soft metal that is easily ground and exhausted. Inclined grinding assembly according to clause 5. 7. the positioning means comprising bracket means for securing the shelf to the control plate; An inclined grinding assembly according to claim 2. 8. 10. A claim in which said bracket means includes means for slidably engaging a control plate. Inclined grinding assembly according to clause 7. 9. 10. A claim in which said bracket means includes clip means for slidably receiving a shelf. 9. Inclined grinding assembly according to clause 8. 10. 10. The control track comprising a through-plated hole passing through the control plate. An inclined grinding assembly according to paragraph 1. 11. An inclined grinder according to claim 1, further comprising means for attaching an object to a shelf. Cutting assembly. 12. Claim 1, wherein the grinding assembly is potted in a potting material. Inclined grinding assembly. 13. The grinding guide further interconnects the conductive lead and connects the other control track. a second edge having at least a portion of the trailing edge precisely positioned relative to the trailing edge of the second An inclined grinding assembly according to claim 1, comprising a control track. 14. Claim 1, wherein the shelf is formed inside the cup that supports the object during grinding. Inclined grinding assembly as described. 15. The cup further includes an elongated hole for receiving the control plate, and the elongated hole is connected to the top surface of the shelf. 15. An inclined grinding assembly as claimed in claim 14, having a predetermined depth. 16. Claims wherein the shelf comprises a ridge that lifts the object at a predetermined angle. 15. Inclined grinding assembly according to clause 14. 17. Grinds an object at a predetermined angle to a predetermined grinding depth. a shelf having an upper surface that supports an object; at least three electrically conductive leads and at least two electrically conductive leads interconnecting said electrically conductive leads; Carrying a grinding guide with conductive control tracks, the trailing edge of each control track A control board precisely positioned against the trailing edge of the truck, establishing a grinding surface inclined at said predetermined angle to the object; Control the grinding depth by aligning a portion of the trailing edge of one of the tracks and tilting the object. When grinding along the grinding surface to the predetermined grinding depth, the track is exhausted. and means for positioning the shelf relative to the control plate so that the shelf is positioned relative to the control plate. 18. The control board has multiple layers and each control track is placed on a different layer. 18. A grinding assembly according to claim 17. 19. Grind the printed wiring board specimen at a predetermined angle to a predetermined grinding depth. It is something that a shelf having an upper surface for supporting the coupon, at least two conductive leads and a front surface; Carrying a grinding guide with one conductive control track interconnecting the conductive leads a control board to Establishing a grinding surface inclined at the predetermined angle to the coupon, Align the predetermined grinding depth with a portion of the trailing edge of one of the control tracks and make the cut. Cut the sample along the inclined grinding surface to expose the predetermined grinding depth. When the specimen is ground to the predetermined grinding depth, the track is completely ground. Grinding assembly with control board as shown. 20. The inclined grinding surface passes through the plating interface to be exposed on the coupon. 20. A grinding assembly according to claim 19. 21. Claim wherein said shelf is formed inside the cup to support objects during grinding. An inclined grinding assembly according to clause 19.