JPH0145896B2 - - Google Patents
Info
- Publication number
- JPH0145896B2 JPH0145896B2 JP56181747A JP18174781A JPH0145896B2 JP H0145896 B2 JPH0145896 B2 JP H0145896B2 JP 56181747 A JP56181747 A JP 56181747A JP 18174781 A JP18174781 A JP 18174781A JP H0145896 B2 JPH0145896 B2 JP H0145896B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal
- photosensitive resin
- image
- photosensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 87
- 239000002184 metal Substances 0.000 claims description 87
- 229920005989 resin Polymers 0.000 claims description 60
- 239000011347 resin Substances 0.000 claims description 60
- 239000000463 material Substances 0.000 claims description 34
- 239000002738 chelating agent Substances 0.000 claims description 19
- -1 Phenol derivative Anthraquinone Chemical class 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 8
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 4
- 239000013522 chelant Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 91
- 238000005530 etching Methods 0.000 description 26
- 239000000243 solution Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 14
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 11
- 239000011342 resin composition Substances 0.000 description 8
- 229940114081 cinnamate Drugs 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- MSSUFHMGCXOVBZ-UHFFFAOYSA-N anthraquinone-2,6-disulfonic acid Chemical compound OS(=O)(=O)C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 MSSUFHMGCXOVBZ-UHFFFAOYSA-N 0.000 description 6
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- WOAHJDHKFWSLKE-UHFFFAOYSA-N 1,2-benzoquinone Chemical compound O=C1C=CC=CC1=O WOAHJDHKFWSLKE-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 229930016911 cinnamic acid Natural products 0.000 description 4
- 235000013985 cinnamic acid Nutrition 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000004056 anthraquinones Chemical class 0.000 description 3
- 150000001540 azides Chemical class 0.000 description 3
- SXYCCJAPZKHOLS-UHFFFAOYSA-N chembl2008674 Chemical compound [O-][N+](=O)C1=CC=C2C(N=NC3=C4C=CC=CC4=CC=C3O)=C(O)C=C(S(O)(=O)=O)C2=C1 SXYCCJAPZKHOLS-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- VLZVIIYRNMWPSN-UHFFFAOYSA-N 2-Amino-4-nitrophenol Chemical compound NC1=CC([N+]([O-])=O)=CC=C1O VLZVIIYRNMWPSN-UHFFFAOYSA-N 0.000 description 2
- DOPJTDJKZNWLRB-UHFFFAOYSA-N 2-Amino-5-nitrophenol Chemical compound NC1=CC=C([N+]([O-])=O)C=C1O DOPJTDJKZNWLRB-UHFFFAOYSA-N 0.000 description 2
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 2
- 150000001241 acetals Chemical class 0.000 description 2
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 229920000159 gelatin Polymers 0.000 description 2
- 239000008273 gelatin Substances 0.000 description 2
- 235000019322 gelatine Nutrition 0.000 description 2
- 235000011852 gelatine desserts Nutrition 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- 125000002560 nitrile group Chemical group 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920002689 polyvinyl acetate Polymers 0.000 description 2
- 239000011118 polyvinyl acetate Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- BCNMNYUNSFNSSG-UHFFFAOYSA-N (4-azidophenyl)-phenylmethanone Chemical compound C1=CC(N=[N+]=[N-])=CC=C1C(=O)C1=CC=CC=C1 BCNMNYUNSFNSSG-UHFFFAOYSA-N 0.000 description 1
- FSAONUPVUVBQHL-UHFFFAOYSA-N 1,3-bis(4-azidophenyl)prop-2-en-1-one Chemical compound C1=CC(N=[N+]=[N-])=CC=C1C=CC(=O)C1=CC=C(N=[N+]=[N-])C=C1 FSAONUPVUVBQHL-UHFFFAOYSA-N 0.000 description 1
- HWEONUWVYWIJPF-OWOJBTEDSA-N 1-azido-4-[(e)-2-(4-azidophenyl)ethenyl]benzene Chemical compound C1=CC(N=[N+]=[N-])=CC=C1\C=C\C1=CC=C(N=[N+]=[N-])C=C1 HWEONUWVYWIJPF-OWOJBTEDSA-N 0.000 description 1
- MLIWQXBKMZNZNF-UHFFFAOYSA-N 2,6-bis[(4-azidophenyl)methylidene]-4-methylcyclohexan-1-one Chemical compound O=C1C(=CC=2C=CC(=CC=2)N=[N+]=[N-])CC(C)CC1=CC1=CC=C(N=[N+]=[N-])C=C1 MLIWQXBKMZNZNF-UHFFFAOYSA-N 0.000 description 1
- UZNOMHUYXSAUPB-UHFFFAOYSA-N 2,6-bis[(4-azidophenyl)methylidene]cyclohexan-1-one Chemical compound C1=CC(N=[N+]=[N-])=CC=C1C=C(CCC1)C(=O)C1=CC1=CC=C(N=[N+]=[N-])C=C1 UZNOMHUYXSAUPB-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- IIYLRFRRKZNPIZ-CMDGGOBGSA-N 2-[(e)-3-phenylprop-2-enoyl]oxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC(=O)\C=C\C1=CC=CC=C1 IIYLRFRRKZNPIZ-CMDGGOBGSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- WYSAWGCLEHCQLX-UHFFFAOYSA-N 2-azidophenol Chemical compound OC1=CC=CC=C1N=[N+]=[N-] WYSAWGCLEHCQLX-UHFFFAOYSA-N 0.000 description 1
- MUZDXNQOSGWMJJ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(=C)C(O)=O MUZDXNQOSGWMJJ-UHFFFAOYSA-N 0.000 description 1
- ARXVXVOLXMVYIT-UHFFFAOYSA-N 3-methylbutyl 2-(dimethylamino)benzoate Chemical compound CC(C)CCOC(=O)C1=CC=CC=C1N(C)C ARXVXVOLXMVYIT-UHFFFAOYSA-N 0.000 description 1
- ZZAPKSQAYRQSGU-UHFFFAOYSA-N 4-chloro-2-methylidenebutanoic acid Chemical compound OC(=O)C(=C)CCCl ZZAPKSQAYRQSGU-UHFFFAOYSA-N 0.000 description 1
- NDDZXHOCOKCNBM-UHFFFAOYSA-N 5-nitroquinoline Chemical compound C1=CC=C2C([N+](=O)[O-])=CC=CC2=N1 NDDZXHOCOKCNBM-UHFFFAOYSA-N 0.000 description 1
- OZTBHAGJSKTDGM-UHFFFAOYSA-N 9,10-dioxoanthracene-1,5-disulfonic acid Chemical compound O=C1C=2C(S(=O)(=O)O)=CC=CC=2C(=O)C2=C1C=CC=C2S(O)(=O)=O OZTBHAGJSKTDGM-UHFFFAOYSA-N 0.000 description 1
- IJNPIHLZSZCGOC-UHFFFAOYSA-N 9,10-dioxoanthracene-1,8-disulfonic acid Chemical compound O=C1C2=CC=CC(S(O)(=O)=O)=C2C(=O)C2=C1C=CC=C2S(=O)(=O)O IJNPIHLZSZCGOC-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical group CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- RNRANSTYMSCREL-UHFFFAOYSA-N C1(=CC=CC=C1)O.N(=[N+]=[N-])C1=C(C=O)C=CC=C1 Chemical compound C1(=CC=CC=C1)O.N(=[N+]=[N-])C1=C(C=O)C=CC=C1 RNRANSTYMSCREL-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004819 Drying adhesive Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QNSQTJHTVQSWFR-UHFFFAOYSA-N [(4-diazonioiminocyclohexa-2,5-dien-1-ylidene)hydrazinylidene]azanide Chemical compound [N-]=[N+]=NC1=CC=C(N=[N+]=[N-])C=C1 QNSQTJHTVQSWFR-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001253 acrylic acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001350 alkyl halides Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- CYUOWZRAOZFACA-UHFFFAOYSA-N aluminum iron Chemical compound [Al].[Fe] CYUOWZRAOZFACA-UHFFFAOYSA-N 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- CHFBCXOSLARLKB-UHFFFAOYSA-N bis(4-azidophenyl)methanone Chemical compound C1=CC(N=[N+]=[N-])=CC=C1C(=O)C1=CC=C(N=[N+]=[N-])C=C1 CHFBCXOSLARLKB-UHFFFAOYSA-N 0.000 description 1
- ZKIBBIKDPHAFLN-UHFFFAOYSA-N boronium Chemical compound [H][B+]([H])([H])[H] ZKIBBIKDPHAFLN-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 150000001734 carboxylic acid salts Chemical class 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000005018 casein Substances 0.000 description 1
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 1
- 235000021240 caseins Nutrition 0.000 description 1
- 229920006317 cationic polymer Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- FHIVAFMUCKRCQO-UHFFFAOYSA-N diazinon Chemical compound CCOP(=S)(OCC)OC1=CC(C)=NC(C(C)C)=N1 FHIVAFMUCKRCQO-UHFFFAOYSA-N 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- IQIJRJNHZYUQSD-UHFFFAOYSA-N ethenyl(phenyl)diazene Chemical compound C=CN=NC1=CC=CC=C1 IQIJRJNHZYUQSD-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 description 1
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 description 1
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 description 1
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- ICWPRFNZEBFLPT-UHFFFAOYSA-N n-(2-hydroxyphenyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NC1=CC=CC=C1O ICWPRFNZEBFLPT-UHFFFAOYSA-N 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- JKXONPYJVWEAEL-UHFFFAOYSA-N oxiran-2-ylmethyl acetate Chemical compound CC(=O)OCC1CO1 JKXONPYJVWEAEL-UHFFFAOYSA-N 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- ZKOWFAZDOLZUJK-UHFFFAOYSA-N phthalic acid;azide Chemical compound [N-]=[N+]=[N-].OC(=O)C1=CC=CC=C1C(O)=O ZKOWFAZDOLZUJK-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002755 poly(epichlorohydrin) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
Description
【発明の詳細な説明】
本発明は、金属画像を形成させるための材料に
関し、特にハイコントラストの画像形成能を有
し、ラインワーク、網点用に適した金属画像形成
材料に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a material for forming metal images, and particularly to a metal image forming material that has a high contrast image forming ability and is suitable for line work and halftone dots.
金属画像形成材料においては、一般に金属薄層
(蒸着層やラミネート箔層など)を用いた場合の
欠点として、レジストが浸されない程度の弱いエ
ツチング液ではエツチングされにくいことが挙げ
られる。そのため、通常エツチング時間が長くか
かり、したがつてレジストとしては耐蝕性の極め
て強いものを用いなければならず、しかも鮮鋭な
画像が得にくく、さらに画像のエツヂの乱れを生
ずる欠点がみられる。 In metal image forming materials, a general drawback when using a thin metal layer (such as a vapor deposited layer or a laminated foil layer) is that it is difficult to be etched with a weak etching solution that does not soak the resist. For this reason, etching usually takes a long time, and therefore a resist with extremely high corrosion resistance must be used. Moreover, it is difficult to obtain a sharp image, and furthermore, there are disadvantages in that the edges of the image are disturbed.
一方、これを改良する手段として特開昭56−
9736号公報に、アルミニウムと蒸着可能な有機物
質とが混在する蒸着層が開示されている。しか
し、ここに開示された有機物質は、レジストを浸
さない程度の弱い現像液を用いたのでは、いまだ
十分短かいエツチング時間でエツチングすること
ができず実用的でない。 On the other hand, as a means to improve this,
No. 9736 discloses a vapor deposition layer in which aluminum and a vapor-depositable organic substance are mixed. However, the organic material disclosed herein cannot be etched in a sufficiently short etching time using a weak developer that does not immerse the resist, making it impractical.
他方、感光性樹脂組成物中にキレート化剤を含
有せしめる技術が知られているし、特開昭50−
95004号、同55−38510号公報参照)。 On the other hand, a technique of incorporating a chelating agent into a photosensitive resin composition is known, and is disclosed in Japanese Patent Application Laid-Open No.
95004 and 55-38510).
しかし感光性樹脂層と支持体の間に金属薄層を
設けた画像形成材料において、該感光性樹脂層中
に特開昭50−95004号に記載のアルミニウムアル
コラートを用いてもエツチング時間が長くかか
り、同55−38510号に記載のポリアミノカルボン
酸を用いた場合にはさらにエツチング時間が長く
かかる欠点がある。 However, in image-forming materials in which a thin metal layer is provided between the photosensitive resin layer and the support, etching time is long even when the aluminum alcoholate described in JP-A-50-95004 is used in the photosensitive resin layer. , No. 55-38510, the etching time is longer.
また金属キレート化剤をエツチング処理液中に
含有せしめエツチング時間の短縮をはかる技術が
知られているが(英国特許第1434894号及び同第
1562586号明細書参照)、特定のキレート化剤であ
つてもエツチング処理液中に含有せしめた場合に
は解像力が劣る欠点がある(比較例1参照)。 In addition, there is a known technology for shortening the etching time by incorporating a metal chelating agent into the etching solution (British Patent No. 1434894 and British Patent No. 1434894).
No. 1,562,586), even a specific chelating agent has the drawback of poor resolution when it is included in the etching solution (see Comparative Example 1).
そこで、本発明の目的は、金属薄層を短時間に
エツチングするための強力なエツチング液を使用
するまでもなく、解像力を低下せしめることなく
短時間に金属薄層をエツチングすることが可能で
あり、しかも鮮鋭な画像を得ることができる金属
画像形成材料を提供するにある。 Therefore, an object of the present invention is to etch a thin metal layer in a short time without using a strong etching solution and without reducing resolution. The object of the present invention is to provide a metal image forming material that can provide sharp images.
本発明の目的は、支持体上に金属薄層を有し、
その上に感光性樹脂層を有する金属画像形成材料
において、支持体上の前記金属薄層以外の少なく
とも一層に下記金属キレート化剤の少なくとも1
種を含有せしめたことを特徴とする金属画像形成
材料によつて達成される。 The object of the invention is to have a thin metal layer on a support,
In a metal image forming material having a photosensitive resin layer thereon, at least one layer other than the thin metal layer on the support is coated with at least one of the following metal chelating agents.
This is achieved by a metal imaging material characterized in that it contains a species.
[金属キレート化剤] フエノール誘導体 アントラキノン誘導体 オルトオキシアゾ化合物 以下、本発明について詳述する。[Metal chelating agent] phenol derivatives anthraquinone derivative Orthoxyazo compounds The present invention will be explained in detail below.
本発明に係る金属画像形成材料の層構成の具体
例としては、支持体上に金属薄層が設けられ、そ
の上に感光性樹脂層が設けられてなるものである
が、上記構成に他の付加的構成要素をもたせた態
様、たとえば支持体と金属薄層または、金属薄層
と感光性樹脂層との間など支持体上に設けられて
いる各種の層の間に、下引層が中間層が設けられ
た態様、さらに感光性樹脂層上にたとえば保護層
が設けられた態様などがあり、本発明の金属画像
形成材料はきわめて多種多様な態様の層構成とす
ることができるものである。 A specific example of the layer structure of the metal image-forming material according to the present invention is one in which a thin metal layer is provided on a support and a photosensitive resin layer is provided on the thin metal layer. In embodiments with additional components, for example, between various layers provided on the support, such as between the support and a thin metal layer or a thin metal layer and a photosensitive resin layer, a subbing layer is provided as an intermediate layer. The metal image-forming material of the present invention can have a very wide variety of layer configurations, including embodiments in which a layer is provided, and embodiments in which a protective layer is further provided on the photosensitive resin layer. .
本発明の金属画像形成材料に用いられる金属薄
層の金属は、従来公知のエツチング処理液によつ
てエツチングされ得る金属によつて形成された層
であり、該金属としてはたとえば特開昭50−
139720号公報に記載されているアルミニウムを主
体とする金属や特開昭48−65927号、同48−65928
号、同50−2925号及び同50−14161号の各公報に
記載されているごときテルル、モリブテン、ボロ
ニウム、コバルト、亜鉛、銅、ニツケル、鉄、
錫、バナジウム、ゲルマニウム、銀及び銀エマル
ジヨンなどを挙げることができる。この金属薄層
の厚さは得られる画像に必要な光学濃度によつて
決まつてくるが、両者はほぼ比例関係にあり、た
とえば画像が線画や網点の場合は比較的高濃度が
必要であつて少なくとも光学濃度で2.0以上、特
に本発明の材料をPS印刷版に焼き付けを行なう
ためのマスクとして用いる場合には少なくとも
3.0の光学濃度が必要であるので、それに相応し
た厚さに決めるのである。この金属薄層の厚さと
光学濃度との関係は、金属薄層を形成させる方
法、たとえば真空蒸着の条件によつて多少異なる
ことはあるが大体においてほゞ同様である。所望
の光学濃度を得るために金属薄層の厚さを必要以
上にすることは特に禁止されることはないが、金
属薄層の素材の浪費や後述するごとき画像形成の
ためのエツチングに過大な時間が要することにな
るので望ましいことではない。さらに過大なエツ
チング時間のためにレジストを劣化させることが
あることを考慮すれば金属薄層の必要以上の厚さ
はむしろ避けるべきである。 The metal of the metal thin layer used in the metal image-forming material of the present invention is a layer formed of a metal that can be etched with a conventionally known etching solution.
Aluminum-based metals described in Publication No. 139720 and Japanese Unexamined Patent Publication Nos. 48-65927 and 48-65928
Tellurium, molybdenum, boronium, cobalt, zinc, copper, nickel, iron,
Mention may be made of tin, vanadium, germanium, silver and silver emulsion. The thickness of this thin metal layer is determined by the optical density required for the resulting image, and the two are almost proportional; for example, if the image is a line drawing or halftone dot, a relatively high density is required. The optical density must be at least 2.0 or higher, especially when the material of the present invention is used as a mask for printing on PS printing plates.
Since an optical density of 3.0 is required, the thickness is determined accordingly. The relationship between the thickness of the metal thin layer and the optical density is generally the same, although it may differ somewhat depending on the method of forming the metal thin layer, for example, the vacuum deposition conditions. Although it is not particularly prohibited to make the metal thin layer thicker than necessary in order to obtain the desired optical density, it is not prohibited to make the metal thin layer thicker than necessary. This is not desirable because it takes time. Furthermore, considering that excessive etching time may deteriorate the resist, it is better to avoid making the metal thin layer thicker than necessary.
本発明の金属画像形成材料に用いられる金属薄
層が設けられる支持体は、その上に直接あるいは
間接(他の層を介して)に設けられる画像形成層
としての金属薄層を保持するものであつて、しか
も本発明になる金属画像形成材料の目的とする用
途を考慮して各種の形態のものとすることができ
る。従つて通常の画像形成材料の形態からして本
発明の金属画像形成材料の場合もシート状、フイ
ルム状あるいは板状といつた形態とすることが好
ましく、その用途によつて透明なもの、半透明の
ものあるいは不透明のものとすることができる。
そして支持体は金属薄層を腐蝕させるエツチング
液に侵されず、かつエツチング液によりその上に
設けられている層が剥離しやすくなつたりするよ
うなものであつてはならない。支持体の素材とし
ては従来公知の多くのものが用いられ、例えば陶
磁器、無定形ガラス、結晶性ガラス、金属、合
金、プラスチツク及びこれらの複合材料などを挙
げることができる。これらの素材は不透明なもの
や透明なものがあるが、必要によつては透明なも
のに着色剤や不透明化剤を加えて、半透明化ある
いは不透明化させることができる。しかしながら
考えられる多くの用途の分野は、本発明の画像形
成材料に金属層による画像を形成せしめ、金属層
がなくて支持体が画面に露出している非画線部分
に光を透化せしめ、画像部分は金属層によつて光
を遮断するいわゆる透過型の応用分野であり、そ
のような分野に用いられる画像形成材料の場合は
その支持体が透明であることが必要である。他方
形成された画像を反射光によつて認識する応用分
野に適用されるものにあつては、その支持体は透
明であることを要しない。 The support on which the thin metal layer used in the metal image-forming material of the present invention is provided holds the thin metal layer as an image-forming layer provided thereon directly or indirectly (via another layer). Furthermore, the metal image-forming material of the present invention can be formed into various forms in consideration of the intended use. Therefore, considering the form of ordinary image-forming materials, the metal image-forming material of the present invention is preferably in the form of a sheet, film, or plate, and depending on its use, it may be transparent or semi-transparent. It can be transparent or opaque.
The support must not be affected by the etching solution that corrodes the thin metal layer, and must not be such that the layer provided thereon is easily peeled off by the etching solution. Many conventionally known materials can be used for the support, including ceramics, amorphous glass, crystalline glass, metals, alloys, plastics, and composite materials thereof. These materials can be opaque or transparent, but if necessary, a coloring agent or an opaque agent can be added to a transparent material to make it translucent or opaque. However, many possible fields of application include imaging the imaging material of the present invention with a metal layer, allowing light to pass through to non-image areas where there is no metal layer and the support is exposed to the screen; The image area is a so-called transmission type application field in which light is blocked by a metal layer, and in the case of an image forming material used in such a field, the support thereof must be transparent. On the other hand, in applications where the formed image is recognized by reflected light, the support does not need to be transparent.
本発明に係る金属画像形成材料の感光性樹脂層
の素材である感光性樹脂としては、オルトキノ
ンジアジド類とノボラツク樹脂とを組合せた感光
性樹脂、ジアゾ樹脂と水溶性樹脂あるいはアル
カリ可溶樹脂とを組合せた感光性樹脂、アジド
化合物と、天然ゴム、合成ゴム又はそれらの環化
ゴムとを組合せたゴム−アジド系感光性樹脂、
アジド基を分子の中に組み入れた感光性樹脂、
桂皮酸系感光性樹脂、エチレン性不飽和二重結
合を有する光重合系感光性樹脂などのフオトエツ
チング用レジストとして用いられる各種の感光性
樹脂を挙げることができる。 The photosensitive resin that is the material of the photosensitive resin layer of the metal image forming material according to the present invention may be a photosensitive resin that is a combination of orthoquinone diazides and a novolak resin, or a diazo resin and a water-soluble resin or an alkali-soluble resin. A rubber-azide photosensitive resin that is a combination of a photosensitive resin, an azide compound, and a natural rubber, a synthetic rubber, or a cyclized rubber thereof;
A photosensitive resin that incorporates an azide group into its molecule,
Examples include various photosensitive resins used as photoetching resists, such as cinnamic acid photosensitive resins and photopolymerizable photosensitive resins having ethylenically unsaturated double bonds.
以下、これらの感光性樹脂を詳細に述べる。 Below, these photosensitive resins will be described in detail.
前記オルトキノンジアジド類とノボラツク樹
脂とを組合せた感光性樹脂としては、2,3,4
−トリオキシベンゾフエノン−ビス−〔ナフトキ
ノン−1,2−ジアジド−5,5−スルホン酸エ
ステル〕、2−ナフトキノン−1,2−ジアジド
−5−スルホニルオキシ〕−ヒドロキシ−7−ナ
フタリン、ナフトキノン−1,2−ジアジド−5
−スルフアニリド、ナフトキノン−1,2−ジア
ジド−5−スルホン酸ノボラツクエステルなどの
オルトキノンジアジド類をノボラツク樹脂と組合
せた感光性樹脂を挙げることができる。このオル
トキノンジアジド類は光を受けるとアルカリ可溶
性になるのでボジ・ワーク用素材として重要であ
る。 The photosensitive resin which is a combination of orthoquinone diazide and novolac resin is 2, 3, 4.
-trioxybenzophenone-bis-[naphthoquinone-1,2-diazide-5,5-sulfonic acid ester], 2-naphthoquinone-1,2-diazide-5-sulfonyloxy]-hydroxy-7-naphthalene, naphthoquinone -1,2-diazide-5
-sulfanilide, naphthoquinone-1,2-diazide-5-sulfonic acid novolak ester, and other orthoquinone diazides in combination with novolak resins. These orthoquinone diazides become alkali-soluble when exposed to light, so they are important as materials for physical work.
前記ジアゾ樹脂と水溶性樹脂あるいはアルカ
リ可溶性樹脂とを組み合せた感光性樹脂として
は、芳香族ジアゾニウム塩と活性カルボニル含有
化合物、殊にアルデヒド類例えばホルムアルデヒ
ドとを酸性媒体中で縮合した水溶性ジアゾ樹脂、
あるいは前記水溶性ジアゾ樹脂のアニオン成分を
BF4 -,PF6 -,SiF6 --,SbF6 --,BeF4 --,IO4 -
または有機スルホン酸塩で置換した油溶性ジアゾ
樹脂とゼラチン、ポリビニルアルコール、部分ケ
ン化ポリ酢酸ビニル、メチルセルロース、ヒドロ
キシエチルセルロース、ヒドロキシプロピルメチ
ルセルロース、カルボキシメチルセルロース、ポ
リエチレングリコール、ポリビニルピロリドン等
の水溶性樹脂、スチレン、メチルメタクリレー
ト、2−ヒドロキシエチルメタクリレート、グリ
シジルメタクリレートとアクリル酸メタクリル酸
との共重合体等のアルカリ可溶性樹脂を挙げるこ
とができる。 The photosensitive resin that is a combination of the diazo resin and a water-soluble resin or an alkali-soluble resin includes a water-soluble diazo resin obtained by condensing an aromatic diazonium salt and an active carbonyl-containing compound, especially an aldehyde such as formaldehyde, in an acidic medium;
Alternatively, the anion component of the water-soluble diazo resin
BF 4 - , PF 6 - , SiF 6 -- , SbF 6 -- , BeF 4 -- , IO 4 -
Or an oil-soluble diazo resin substituted with an organic sulfonate and a water-soluble resin such as gelatin, polyvinyl alcohol, partially saponified polyvinyl acetate, methylcellulose, hydroxyethylcellulose, hydroxypropylmethylcellulose, carboxymethylcellulose, polyethylene glycol, polyvinylpyrrolidone, styrene, Examples include alkali-soluble resins such as methyl methacrylate, 2-hydroxyethyl methacrylate, and copolymers of glycidyl methacrylate and acrylic acid methacrylic acid.
前記ゴム−アジド系感光性樹脂としては、p
−フエニレンビスアジド、p−アジドベンゾフエ
ノン、4,4′−ジアジドベンゾフエノン、4,
4′−ジアジドフエニルメタン、4,4′−ジアジド
スチルベン、4,4′−ジアジドカルコン、2,6
−ジ−(4′−アジドベンザル)シクロヘキサノン、
2,6−ジ−(4′−アジドベンザル)−4−メチル
シクロヘキサノンなどのアジド化合物と、天然ゴ
ム、合成ゴム又はそれらを環化したゴムを組合せ
た感光性樹脂を挙げることができる。 As the rubber-azide photosensitive resin, p
-phenylene bisazide, p-azidobenzophenone, 4,4'-diazidobenzophenone, 4,
4'-diazidophenylmethane, 4,4'-diazidostilbene, 4,4'-diazidochalcone, 2,6
-di-(4′-azidobenzal)cyclohexanone,
Examples include photosensitive resins in which an azide compound such as 2,6-di-(4'-azidobenzal)-4-methylcyclohexanone is combined with natural rubber, synthetic rubber, or a cyclized rubber thereof.
前記アジド基を分子の中に組み入れた感光性
樹脂としては、ポリアジド安息香酸ビニル、ポリ
アジドフタル酸ビニル、ポリアジドスチレン、ポ
リビニルアジドベンザルアセタール、ポリビニル
アジドナフチルアセタール、アジドベンズアルデ
ヒドフエノール樹脂、アジドフエニルアミン・ホ
ルマリン縮合重合体ポリビニルアルコールのアジ
ド高分子、部分的に加水分解されたセルロースア
セテートのアジドフタレートのごときセルロース
のアジド高分子、及びゼラチンやカゼインのアジ
ド高分子などを挙げることができる。 Examples of photosensitive resins incorporating an azide group into the molecule include polyazidovinyl benzoate, polyazidovinyl phthalate, polyazidostyrene, polyvinylazidobenzal acetal, polyvinylazidonaphthyl acetal, azidobenzaldehyde phenol resin, and azidophenol. Examples include azide polymers of amine-formalin condensation polymer polyvinyl alcohol, azide polymers of cellulose such as azide phthalate of partially hydrolyzed cellulose acetate, and azide polymers of gelatin and casein.
前記桂皮酸系感光性樹脂としては、ポリ桂皮
酸ビニル、ポリ(m−ニトロ桂皮酸ビニル)、ポ
リ−α−シアノ桂皮酸ビニル、ポリ−α−ニトロ
桂皮酸ビニル、ポリ−β−ニトロ桂皮酸ビニル、
ポリ−α−クロロ桂皮酸ビニル、ポリ−β−クロ
ロ桂皮酸ビニル、ポリシンナミリデン酢酸ビニ
ル、ポリビニルオキシエチルシンナメート、ポリ
ビニルチオエチルシンナメート、ポリ(2−シン
ナモイルオキシエチルアクリレート)、ポリ(2
−シンナモイルオキシエチルメタアクリレート)、
ポリ(シンナモイルオキシ酢酸ビニル)、ポリ
(p−シンナモイルオキシビニルベンゼン)。ポリ
(p−シンナモイルスチレン)等のビニル重合
体;これらと他の重合体との共重合体;ポリ桂皮
酸グリシジル、ポリシンナミリデン酢酸グリシジ
ル等のオキシラン環の開環重合体;側鎖にハロゲ
ン化アルキルを含む重合体に感光基を有するカル
ボン酸塩を非プロトン性極性溶媒中で、高分子反
応を行つて全部あるいは部分的に感光基を導入し
た重合体、例えばポリクロルエチルビニルエーテ
ル、ポリクロル酢酸ビニル、ポリ(β−クロルエ
チルアクリル酸エステル)、ポリエピクロルヒド
リン、ポリエピブロムヒドリン等に桂皮酸若しく
はその誘導体の塩を反応させて得た重合体;ビニ
ルエーテル類のカチオン重合体、例えばポリビニ
ロキシエチルシンナメートなどを挙げることがで
きる。 The cinnamic acid-based photosensitive resins include polyvinyl cinnamate, poly(m-vinyl nitrocinnamate), poly-α-cyanovinyl cinnamate, poly-α-vinyl nitrocinnamate, and poly-β-nitrovinyl cinnamate. vinyl,
Poly-α-vinyl chlorocinnamate, poly-β-chlorovinyl cinnamate, polycinnamylidene vinyl acetate, polyvinyloxyethyl cinnamate, polyvinylthioethyl cinnamate, poly(2-cinnamoyloxyethyl acrylate), poly( 2
-cinnamoyloxyethyl methacrylate),
Poly(cinnamoyloxyvinyl acetate), poly(p-cinnamoyloxyvinylbenzene). Vinyl polymers such as poly(p-cinnamoylstyrene); copolymers of these with other polymers; ring-opening polymers of oxirane rings such as polyglycidyl cinnamate and polycinnamylidene glycidyl acetate; Polymers in which photosensitive groups have been introduced in whole or in part by performing a polymer reaction on a polymer containing an alkyl halide with a carboxylic acid salt having a photosensitive group in an aprotic polar solvent, such as polychloroethyl vinyl ether, polychloride, etc. Polymers obtained by reacting vinyl acetate, poly(β-chloroethyl acrylic acid ester), polyepichlorohydrin, polyepibromohydrin, etc. with salts of cinnamic acid or its derivatives; cationic polymers of vinyl ethers, such as polyvinyl ethers. Examples include roxyethylcinnamate.
桂皮酸系感光性樹脂のうち、米国特許第
3030208号明細書に記載されている不飽和感光性
ポリエステル化合物と下記の化学構造式によつて
表わされる感光性樹脂との混合物はきわめて好適
なものである。後者の感光性樹脂は、
〔A〕
−CH2−CR1COOR2CO(−CR3=CH)a――−(CH=
CH))−bR4
(式中、R1は水素原子、ハロゲン原子、ニト
リル基、又は低級アルキル基、R2は2価の脂肪
族基、R3は水素原子又はニトリル基、R4は芳香
核、a及びbは0又は1で、かつa+bは1又は
2である。)及び〔B〕アクリル酸又はメタクリ
ル酸を単位とする重合物である。 Among cinnamic acid-based photosensitive resins, U.S. Patent No.
A mixture of the unsaturated photosensitive polyester compound described in No. 3030208 and the photosensitive resin represented by the chemical structural formula below is very suitable. The latter photosensitive resin is [A] −CH 2 −CR 1 COOR 2 CO(−CR 3 =CH) a ---(CH=
CH)) - b R 4 (wherein, R 1 is a hydrogen atom, a halogen atom, a nitrile group, or a lower alkyl group, R 2 is a divalent aliphatic group, R 3 is a hydrogen atom or a nitrile group, and R 4 is aromatic nucleus, a and b are 0 or 1, and a+b is 1 or 2) and [B] a polymer having acrylic acid or methacrylic acid as units.
前記エチレン性不飽和二重結合を有する光重
合型の感光性樹脂の例としては、モノマーとその
重合性結合体に関して米国特許第276083号および
第3060026号明細書などに詳述されているが、モ
ノマーの一例として多価アルコールのアクリル酸
エステル及びメタクリル酸エステルが適当であ
り、たとえばエチレングリコール、トリエチレン
グリコール、テトラエチレングリコール、プロピ
レングリコール、トリメチロールプロパン、ペン
タエリスリトール、ネオペンチルグリコール等の
アクリル酸あるいはメタクリル酸エステルを例と
して挙げることができる。ビスフエノールAから
変性誘導されたアクリル酸、メタクリル酸のエス
テル、例えばビスフエノールA−エピクロルヒド
リン系エポキシ樹脂プレポリマーとアクリル酸あ
るいはメタクリル酸との反応生成物、ビスフエノ
ールAのアルキレンオキシド付加体あるいはその
水素添加物のアクリル酸、メタクリル酸エステル
等を使用し得る。その他メチレンビスアクリルア
ミド、エチレンビスアクリルアミドならびにエチ
レンジアミン、プロピレンジアミン、ブチレンジ
アミン、ペンタメチレンジアミン等のジアミンの
ビスアクリルアミド又はビスメタクリルアミド、
ジオールモノアクリレートもしくはジオールモノ
メタクリレートとジイソシアネートとの反応生成
物、トリアクリルホルマール又はトリアリルシア
ヌレート等も使用することができる。 Examples of photopolymerizable photosensitive resins having ethylenically unsaturated double bonds are detailed in U.S. Pat. Suitable examples of monomers include acrylic esters and methacrylic esters of polyhydric alcohols, such as acrylic acids such as ethylene glycol, triethylene glycol, tetraethylene glycol, propylene glycol, trimethylolpropane, pentaerythritol, neopentyl glycol, etc. Methacrylic acid esters may be mentioned by way of example. Esters of acrylic acid and methacrylic acid modified and derived from bisphenol A, such as reaction products of bisphenol A-epichlorohydrin epoxy resin prepolymers and acrylic acid or methacrylic acid, alkylene oxide adducts of bisphenol A, or hydrogen thereof Additives such as acrylic acid and methacrylic esters may be used. Other bisacrylamide or bismethacrylamide of diamines such as methylenebisacrylamide, ethylenebisacrylamide, ethylenediamine, propylenediamine, butylenediamine, pentamethylenediamine, etc.
Reaction products of diol monoacrylates or diol monomethacrylates with diisocyanates, triacrylic formals or triallylcyanurates, etc. can also be used.
本発明の画像形成材料に用いられる金属キレー
ト化剤とは支持体上に設けられた金属薄層の金属
とエツチング時にキレート化合物を作りうるもの
をいう。 The metal chelating agent used in the image forming material of the present invention is one that can form a chelate compound with the metal of the thin metal layer provided on the support during etching.
本発明に用いられるキレート化剤は、フエノー
ル誘導体、アントラキノン誘導体、オルトオキシ
アゾ化合物の少なくとも1種である。 The chelating agent used in the present invention is at least one of phenol derivatives, anthraquinone derivatives, and orthoxyazo compounds.
フエノール誘導体としては、8−オキシキノリ
ン、オルトオキシキノリン、2,4−ジオキシキ
ノリン、5−ニトロキノリン、5−ニトロ−2−
アミノフエノール、4−ニトロ−2−アミノフエ
ノール及びそれらの塩等が挙げられる。 Examples of phenol derivatives include 8-oxyquinoline, orthoxyquinoline, 2,4-dioxyquinoline, 5-nitroquinoline, 5-nitro-2-
Examples include aminophenol, 4-nitro-2-aminophenol and salts thereof.
アントラキノン誘導体としては、アントラキノ
ン−α−スルホン酸、アントラキノン−β−スル
ホン酸、アントラキノン−1,5−ジスルホン
酸、アントラキノン−1,8−ジスルホン酸、ア
ントラキノン−2,6−ジスルホン酸、アントラ
キノン−2,7−ジスルホン酸及びそれらの塩等
が挙げられる。 Anthraquinone derivatives include anthraquinone-α-sulfonic acid, anthraquinone-β-sulfonic acid, anthraquinone-1,5-disulfonic acid, anthraquinone-1,8-disulfonic acid, anthraquinone-2,6-disulfonic acid, anthraquinone-2, Examples include 7-disulfonic acid and salts thereof.
オルトオキシアゾ化合物としてはエリオクロム
ブラツクT、エリオクロムブラツクA等が挙げら
れる。 Examples of the orthoxyazo compound include eriochrome black T and eriochrome black A.
前記金属キレート化剤を、前記金属薄層以外の
少くとも一層に含有せしめる態様は、金属薄層上
に設けられた感光性樹脂層中に混入する場合、中
間層(金属薄層と感光性樹脂層の間)に混入する
場合、下引層(支持体と金属薄層の間)に混入す
る場合、感光性樹脂層上に設けられる保護層に混
入する場合の4通りの場合が代表的具体例である
が、これらの2以上の組合せの場合もあり、その
他具体的には、きわめて多種多様な態様の層構成
とすることができる。 A mode in which the metal chelating agent is contained in at least one layer other than the metal thin layer is that when the metal chelating agent is mixed into the photosensitive resin layer provided on the metal thin layer, the metal chelating agent is contained in the intermediate layer (the metal thin layer and the photosensitive resin layer). There are four typical cases: when the substance is mixed in the undercoat layer (between the support and the thin metal layer), and when it is mixed in the protective layer provided on the photosensitive resin layer. As an example, there may be a combination of two or more of these, and other specific examples include a wide variety of layer configurations.
金属キレート化剤の添加量については、前記層
構成のそれぞれの場合により添加量は異なるが、
約0.001g/m2以上、特に好ましくは約0.01g/
m2以上である。 The amount of metal chelating agent added varies depending on the layer structure, but
About 0.001g/ m2 or more, particularly preferably about 0.01g/m2
m2 or more.
本発明に係る金属画像形成材料を調製するに
は、まず特定した支持体表面に真空蒸着法やスパ
ツタリング法、イオンプレーテイング法、電着
法、電気泳動法、気相析出法、スプレー法など各
種の方法によつて所望の金属層を形成せしめ、さ
らにその上に(必要に応じ中間層を介して)感光
性樹脂層(必要に応じ保護層)を形成せしめるこ
とによつて行なわれる。感光性樹脂層中に金属キ
レート化剤を混入させる場合、感光性樹脂層を形
成せしめる塗布液としては、前述した各種の感光
性樹脂から選ばれた1つ又は複数個の樹脂と共に
金属キレート化剤を水あるいは有機溶媒によつて
溶液とする。必要に応じて設けられる感光層と金
属薄層間の中間層支持体と金属薄層の間の下塗層
あるいは感光性樹脂層上の保護層中に金属キレー
ト化剤を混入する場合は、それら各層に使用され
る材料と共に金属キレート化剤を水あるいは有機
溶媒によつて溶液とする。このようにして調製し
た塗布液は、たとえばローラー塗布法、エアナイ
フ塗布法、浸漬法、カーテン塗布法、スプレー塗
布法など公知の塗布方法によつて前記の金属層上
に塗布し乾燥せしめることによつて感光性樹脂層
を形成せしめるのである。感光性樹脂層の乾燥厚
さとしては0.1〜10μ程度であればよい。薄すぎる
場合にはレジスト層として弱いものであり、厚す
ぎる場合はエツチングに過大な時間がかかり、か
つ露光像に対応した正確な画像のレジスト画像が
できなくなるという問題を生ずることがある。金
属キレート化剤の混入場所の選定は、使用する感
光性樹脂の種類、エツチング液あるいはエツチン
グ方法(一浴か二浴か)等によつて行なうが、金
属薄層のためのエツチング液の供給時に非画像部
に金属キレート化剤が存在していることが必要で
ある。 In order to prepare the metal image forming material according to the present invention, first, various methods such as vacuum evaporation method, sputtering method, ion plating method, electrodeposition method, electrophoresis method, vapor phase deposition method, spray method, etc. are applied to the surface of the specified support. This is carried out by forming a desired metal layer by the method described above, and further forming a photosensitive resin layer (a protective layer as necessary) thereon (via an intermediate layer as necessary). When a metal chelating agent is mixed into the photosensitive resin layer, the coating liquid for forming the photosensitive resin layer includes one or more resins selected from the various photosensitive resins mentioned above and the metal chelating agent. Make a solution with water or an organic solvent. If a metal chelating agent is mixed into the undercoat layer between the support and the metal thin layer or the protective layer on the photosensitive resin layer, which is provided as necessary, the intermediate layer between the photosensitive layer and the metal thin layer, The materials used in each layer and the metal chelating agent are dissolved in water or an organic solvent. The coating solution prepared in this manner is applied onto the metal layer by a known coating method such as a roller coating method, an air knife coating method, a dipping method, a curtain coating method, or a spray coating method, and then allowed to dry. Then, a photosensitive resin layer is formed. The dry thickness of the photosensitive resin layer may be about 0.1 to 10 μm. If it is too thin, the resist layer will be weak; if it is too thick, etching will take an excessively long time, and a resist image that accurately corresponds to the exposed image may not be formed. The location where the metal chelating agent is mixed is determined depending on the type of photosensitive resin used, the etching solution, or the etching method (one bath or two baths). It is necessary that the metal chelating agent be present in the non-image areas.
上記の如くして調製された金属画像形成材料に
は、公知の技術により感光性樹脂層に対して像露
光を行ない、エツチング処理液により感光性樹脂
層を現像し、同時に(1浴法)又は次いで(2浴
法)金属薄層のエツチングを行ない、所望により
感光性樹脂層によるレジストを除去することによ
り、目的の金属画像を得ることができる。 For the metal image forming material prepared as described above, the photosensitive resin layer is subjected to imagewise exposure using a known technique, the photosensitive resin layer is developed with an etching treatment solution, and the photosensitive resin layer is simultaneously (one-bath method) or Next, the thin metal layer is etched (two-bath method), and if desired, the resist formed by the photosensitive resin layer is removed to obtain the desired metal image.
本発明に係る金属画像形成材料は、支持体上の
金属薄層以外の少なくとも一層に特定の金属キレ
ート化剤を含有しているため、レジストを浸さな
い程度の弱いアルカリ、酸、酸化剤水溶液等の金
属エツチング液を用いても充分短時間のエツチン
グ処理が可能で作業時間が大巾に短縮される一
方、エツチング部分のエツヂのシヤープネスが良
好で、解像力の高い画像が得られる。 Since the metal image forming material according to the present invention contains a specific metal chelating agent in at least one layer other than the thin metal layer on the support, a weak alkali, acid, or oxidizing agent aqueous solution that does not immerse the resist can be used. Etching processing can be carried out in a sufficiently short time even when using a metal etching solution of 100%, and the working time is greatly shortened, while the edge sharpness of the etched portion is good and an image with high resolution can be obtained.
以下、実施例を挙げて本発明を例証するが、本
発明の実施態様は、これらに限定されない。 The present invention will be illustrated below with reference to Examples, but the embodiments of the present invention are not limited thereto.
実施例 1
Al約400mgを真空蒸着装置内に配置されている
Al2O3ボート中に入れ、厚さ100μのポリエチレン
テレフタレートフイルム(支持体)を、上記蒸発
源からの距離が約30cmになるように真空蒸着装置
内に配置し、真空度5×10-5Torrのもとで厚さ
800ÅのAl蒸着膜を得た。この蒸着膜上に下記の
感光性樹脂組成物を乾燥後の膜厚が2.5μとなるよ
うにホワラー塗布し、100℃乾燥器中で5分間乾
燥した。Example 1 Approximately 400 mg of Al is placed in a vacuum evaporation device.
A polyethylene terephthalate film (support) with a thickness of 100 μ was placed in an Al 2 O 3 boat and placed in a vacuum evaporation apparatus so that the distance from the evaporation source was approximately 30 cm, and the degree of vacuum was 5 × 10 -5. Thickness under Torr
An 800 Å thick Al deposited film was obtained. The following photosensitive resin composition was coated on this vapor-deposited film so that the film thickness after drying was 2.5 μm, and the film was dried in a dryer at 100° C. for 5 minutes.
スチレンとメタクリル酸共重合体 5g
(スチレン/メタクリル酸=70/30)
ペンタエリスリトールトリアクリレート 5g
2−イソプロピルチオキサントン 1g
アントラキノン−2,6−ジスルホン酸 2g
メチルセロソルブ 100ml
このようにして得られた金属画像形成材料の試
料を明室プリンターUp−6(3kWメタルハライド
ランプ、上野化学製)を行い、網点原稿を通して
20秒間パターン露光し、0.1Nの水酸化ナトリウ
ム水溶液中に、液温25℃で30秒間浸漬した。未露
光部の金属薄層は完全に除去される一方、露光部
の金属薄層は原稿とほぼ完全に明暗が逆転し、網
点のエツヂのシヤープネスも良好であることが確
認された。Styrene and methacrylic acid copolymer 5 g (styrene/methacrylic acid = 70/30) Pentaerythritol triacrylate 5 g 2-isopropylthioxanthone 1 g Anthraquinone-2,6-disulfonic acid 2 g Methyl cellosolve 100 ml Metallic image formed in this way A sample of the material was passed through a bright room printer Up-6 (3kW metal halide lamp, manufactured by Ueno Chemical Co., Ltd.) and the halftone original was printed.
It was pattern-exposed for 20 seconds and immersed in a 0.1N aqueous sodium hydroxide solution for 30 seconds at a temperature of 25°C. It was confirmed that the thin metal layer in the unexposed areas was completely removed, while the brightness of the thin metal layer in the exposed areas was almost completely reversed from that of the original, and the sharpness of the halftone dot edges was also good.
これに対し、上記感光性樹脂組成物中からアン
トラキノン−2,6−ジスルホン酸を除いた感光
性樹脂組成物で同様に金属画像形成材料を作成
し、上記エツチング液で処理したところ、エツチ
ング時間も3分間の長時間を要し、出来上がつた
網点画像のエツヂのシヤープネスが悪いことが確
認された。 On the other hand, when a metal image forming material was prepared in the same manner using a photosensitive resin composition in which anthraquinone-2,6-disulfonic acid was removed from the photosensitive resin composition and treated with the above etching solution, the etching time was also reduced. It took a long time of 3 minutes, and it was confirmed that the edge sharpness of the finished halftone image was poor.
実施例 2
Al2Fe合金の適量を真空蒸着装置内に配置され
ているAl2O3ボート中に入れ、厚さ100μのポリエ
チレンテレフタレートフイルム(支持体)を、上
記蒸発源からの距離が約30cmになるように真空蒸
着装置内に配置し、真空度5×10-5Torrのもと
で厚さ800Åのアルミニウム−鉄合金フイルムを
得た。この蒸着膜上に下記の感光性樹脂組成物を
乾燥後の膜厚2.0μの厚さにホワラー塗布した。Example 2 A suitable amount of Al 2 Fe alloy was placed in an Al 2 O 3 boat placed in a vacuum evaporation apparatus, and a 100μ thick polyethylene terephthalate film (support) was placed at a distance of about 30 cm from the evaporation source. An aluminum-iron alloy film with a thickness of 800 Å was obtained under a vacuum degree of 5×10 -5 Torr. On this vapor-deposited film, the following photosensitive resin composition was coated with a whirlpool coating to a thickness of 2.0 μm after drying.
メチルメタクリレートとメタクリル酸共重合
体 5g
(メチルメタクリレート/メタクリル酸=
80/20)
ペンタエリスリトールトリアクリレート 5g
2−イソプロピルチオキサントン 1g
ジメチルアミノ安息香酸イソアミル 0.5g
メチルセロソルブ 100ml
次いで、その上に、保護層として、下記の保護
組成物を2.0μの厚さにホワラー塗布した。Methyl methacrylate and methacrylic acid copolymer 5g (methyl methacrylate/methacrylic acid =
80/20) Pentaerythritol triacrylate 5g 2-isopropylthioxanthone 1g Isoamyl dimethylaminobenzoate 0.5g Methyl cellosolve 100ml Next, the following protective composition was coated thereon to a thickness of 2.0μ as a protective layer.
ポリビニルアルコール 10g
(日本合成化学製PVA−GL−05)
4−ニトロ−2−アミノフエノールNa 3g
水 100ml
このようにして得られた試料を実施例1と同様
に露光し、0.1N水酸化ナトリウム水溶液中に浸
漬したところ、液温25℃、浸漬時間10秒において
未露光部の金属薄層は完全に除去される一方、露
光部の金属薄層は原稿とほぼ完全に明暗が逆転
し、網点のエツヂのシヤープネスの良好であるこ
とが確認された。Polyvinyl alcohol 10g (PVA-GL-05 manufactured by Nippon Gosei) 4-nitro-2-aminophenol Na 3g Water 100ml The sample thus obtained was exposed in the same manner as in Example 1, and a 0.1N aqueous sodium hydroxide solution was used. When the liquid temperature was 25°C and the immersion time was 10 seconds, the thin metal layer in the unexposed area was completely removed, while the thin metal layer in the exposed area was almost completely reversed in brightness compared to the original, resulting in halftone dots. It was confirmed that the sharpness of the edges was good.
実施例 3
実施例1と同様にして作成したAl蒸着膜上に、
下記の組成で接着層(中間層)を乾燥後の膜厚
1μの厚さにホワラー塗布した。Example 3 On the Al vapor deposited film created in the same manner as in Example 1,
Film thickness after drying adhesive layer (intermediate layer) with the following composition
The whiter was applied to a thickness of 1μ.
ヒドロキシフエニルメタクリルアミド、 5g
アクリロニトリル、メチルメタクリレート、
メタクリル酸の共重合体 5g
(30/40/25/5)
5−ニトロ−2−アミノフエノール 2g
メチルセロソルブ 100ml
次いで、その上に下記の感光性樹脂組成物を乾
燥後の膜厚2.0μの厚さにホワラー塗布した。Hydroxyphenyl methacrylamide, 5g acrylonitrile, methyl methacrylate,
Copolymer of methacrylic acid 5g (30/40/25/5) 5-nitro-2-aminophenol 2g Methyl cellosolve 100ml Next, the following photosensitive resin composition was applied thereon to form a dried film with a thickness of 2.0μ. I applied whirler on it.
ポリビニルアセテート/長鎖アクリレート共
重合体 100ml
エマルジヨン(Gelva TS−100,Monsanto
Corp製)
ジアゾ樹脂(Fairmount#4) 4g
このようにして得られた試料を実施例1と同様
に露光し、水道水で10秒間現像した。次いで、こ
の試料を100℃で5分間熱処理した後、0.1Nの水
酸化ナトリウム水溶液中に浸漬したところ、液温
25℃、浸漬時間30秒において未露光部の金属薄層
は完全に除去される一方、露光部の金属薄層は原
稿とほぼ完全に明暗が逆転し、網点のエツヂのシ
ヤープネスの良好であることが確認された。Polyvinyl acetate/long chain acrylate copolymer 100ml emulsion (Gelva TS-100, Monsanto
Corp.) Diazo resin (Fairmount #4) 4 g The sample thus obtained was exposed as in Example 1 and developed in tap water for 10 seconds. Next, this sample was heat-treated at 100℃ for 5 minutes, and then immersed in a 0.1N aqueous sodium hydroxide solution.
At 25℃ and immersion time for 30 seconds, the thin metal layer in the unexposed area is completely removed, while the thin metal layer in the exposed area is almost completely reversed in contrast to the original, and the sharpness of the halftone dot edges is good. This was confirmed.
実施例 4
厚さ100μのポリエチレンテレフタレートフイ
ルム(支持体)上に、下記の組成で、下引層を乾
燥後の膜厚1μになるように塗布した。Example 4 On a polyethylene terephthalate film (support) having a thickness of 100 μm, a subbing layer having the following composition was coated so that the film thickness after drying was 1 μm.
クレゾールノボラツク樹脂 5g
(群栄化学(株)製)
エリオクロムブラツクT 2g
メチルセロソルブ 100ml
次に、この上に実施例1と同様に、Al蒸着膜
を設け、さらにその上に下記組成の感光性樹脂層
を乾燥後の膜厚2.5μになるように塗布した。Cresol novolac resin 5g (manufactured by Gunei Kagaku Co., Ltd.) Eriochrome Black T 2g Methyl cellosolve 100ml Next, an Al vapor deposited film was provided on this in the same manner as in Example 1, and a photosensitive film with the following composition was further applied on top of this in the same manner as in Example 1. The resin layer was applied so that the film thickness after drying was 2.5 μm.
クレゾールノボラツク樹脂 2.5g
(群栄化学(株)製)
クレゾールノボラツク樹脂の1,2−ナフト
キノンジアジド−5−スルホン酸エステル
5g
(エステル化率25モル%)
メチルセロソルブ 100ml
このようにして得られた感光材料の試料を実施
例1と同様に露光し、現像したところ、液温25
℃、浸漬時間35秒において露光部の金属薄層は完
全に除去される一方、未露光部の金属薄層は原稿
とほぼ完全に明暗が対応し、網点のエツヂのシヤ
ープネス良好な画像が得られた。Cresol novolak resin 2.5g (manufactured by Gunei Chemical Co., Ltd.) 1,2-naphthoquinonediazide-5-sulfonic acid ester of cresol novolak resin
5g (esterification rate: 25 mol%) Methyl cellosolve 100ml A sample of the photosensitive material thus obtained was exposed and developed in the same manner as in Example 1, and the solution temperature was 25%.
℃ and immersion time for 35 seconds, the thin metal layer in the exposed area is completely removed, while the thin metal layer in the unexposed area matches the original in almost perfect contrast, resulting in an image with good halftone dot edge sharpness. It was done.
比較例 1
実施例1において感光性樹脂組成物からアント
ラキノン−2,6−ジスルホン酸を除いて金属画
像形成材料を得、この材料に同様に露光後、下記
の処理液中に液温25℃で30秒間浸漬した。Comparative Example 1 A metal image forming material was obtained by removing anthraquinone-2,6-disulfonic acid from the photosensitive resin composition in Example 1, and after exposing this material in the same manner, it was added to the following processing solution at a temperature of 25°C. Soaked for 30 seconds.
(処理液)
水酸化ナトリウム 2g
アントラキノン−2,6−ジスルホン酸 6g
水 1
実施例1では画像の解像力が100本/mmであつ
たのに対し、解像力が70本/mm劣つていた。(Treatment liquid) Sodium hydroxide 2g Anthraquinone-2,6-disulfonic acid 6g Water 1 In Example 1, the image resolution was 100 lines/mm, whereas the resolution was inferior by 70 lines/mm.
比較例 2
実施例1の感光性樹脂組成物のアントラキノン
−2,6−ジスルホン酸を特開昭50−95004号に
記載のアルミニウムアルコレート又はアルミニウ
ムキレート化合物に代えた以外は同様にエツチン
グ処理した。Comparative Example 2 Etching treatment was carried out in the same manner as in Example 1 except that anthraquinone-2,6-disulfonic acid in the photosensitive resin composition of Example 1 was replaced with aluminum alcoholate or aluminum chelate compound described in JP-A-50-95004.
その結果、いずれの場合にもエツチング時間は
25℃で60秒間要した。 As a result, the etching time is
It took 60 seconds at 25°C.
比較例 3
実施例3の接着層の5−ニトロ−2−アミノフ
エノールをポリアミノカルボン酸に代えた以外は
同様にエツチング処理した。Comparative Example 3 Etching treatment was carried out in the same manner as in Example 3 except that 5-nitro-2-aminophenol in the adhesive layer was replaced with polyaminocarboxylic acid.
その結果、エツチング時間は25℃で75秒間要し
た。 As a result, the etching time was 75 seconds at 25°C.
Claims (1)
樹脂層を有する金属画像形成材料において、支持
体上の前記金属薄層以外の少なくとも一層に下記
金属キレート化剤の少なくとも1種を含有せしめ
たことを特徴とする金属画像形成材料。 [金属キレート化剤] フエノール誘導体 アントラキノン誘導体 オルトオキシアゾ化合物[Scope of Claims] 1. In a metal image forming material having a thin metal layer on a support and a photosensitive resin layer thereon, at least one layer other than the thin metal layer on the support is coated with the following metal chelate. A metal image-forming material characterized by containing at least one type of agent. [Metal chelating agent] Phenol derivative Anthraquinone derivative Orthooxyazo compound
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56181747A JPS5883846A (en) | 1981-11-14 | 1981-11-14 | Metallic image forming material |
US06/439,427 US4455364A (en) | 1981-11-14 | 1982-11-05 | Process for forming metallic image, composite material for the same |
GB08232192A GB2113152B (en) | 1981-11-14 | 1982-11-11 | Process for forming metallic image composite material for the same and treating solution for the same( |
DE19823241980 DE3241980A1 (en) | 1981-11-14 | 1982-11-12 | METHOD FOR PRODUCING A METALLIC IMAGE AND COMPOSITE MATERIAL AND TREATMENT SOLUTION THEREFOR |
GB8428641A GB2156088B (en) | 1981-11-14 | 1984-11-13 | A composite material for forming metallic images |
GB08428642A GB2155861A (en) | 1981-11-14 | 1984-11-13 | A treating solution for use in forming metallic images |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56181747A JPS5883846A (en) | 1981-11-14 | 1981-11-14 | Metallic image forming material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5883846A JPS5883846A (en) | 1983-05-19 |
JPH0145896B2 true JPH0145896B2 (en) | 1989-10-05 |
Family
ID=16106171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56181747A Granted JPS5883846A (en) | 1981-11-14 | 1981-11-14 | Metallic image forming material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5883846A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0450845A (en) * | 1990-06-14 | 1992-02-19 | Toyo Ink Mfg Co Ltd | Relief resin printing plate |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5095004A (en) * | 1973-12-24 | 1975-07-29 | ||
JPS50139720A (en) * | 1974-04-25 | 1975-11-08 | ||
GB1434894A (en) * | 1974-03-01 | 1976-05-05 | Pennwalt Corp | Aluminium etching |
GB1562586A (en) * | 1978-05-12 | 1980-03-12 | Pennwalt Corp | Aluminium etching |
JPS5538510A (en) * | 1978-09-11 | 1980-03-18 | Hitachi Ltd | Photosensitive composition |
-
1981
- 1981-11-14 JP JP56181747A patent/JPS5883846A/en active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5095004A (en) * | 1973-12-24 | 1975-07-29 | ||
GB1434894A (en) * | 1974-03-01 | 1976-05-05 | Pennwalt Corp | Aluminium etching |
JPS50139720A (en) * | 1974-04-25 | 1975-11-08 | ||
GB1562586A (en) * | 1978-05-12 | 1980-03-12 | Pennwalt Corp | Aluminium etching |
JPS5538510A (en) * | 1978-09-11 | 1980-03-18 | Hitachi Ltd | Photosensitive composition |
Also Published As
Publication number | Publication date |
---|---|
JPS5883846A (en) | 1983-05-19 |
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