JPH0145753B2 - - Google Patents

Info

Publication number
JPH0145753B2
JPH0145753B2 JP57209288A JP20928882A JPH0145753B2 JP H0145753 B2 JPH0145753 B2 JP H0145753B2 JP 57209288 A JP57209288 A JP 57209288A JP 20928882 A JP20928882 A JP 20928882A JP H0145753 B2 JPH0145753 B2 JP H0145753B2
Authority
JP
Japan
Prior art keywords
wax
molten wax
valve
printed circuit
gear pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57209288A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59100590A (ja
Inventor
Kenji Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP20928882A priority Critical patent/JPS59100590A/ja
Publication of JPS59100590A publication Critical patent/JPS59100590A/ja
Publication of JPH0145753B2 publication Critical patent/JPH0145753B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP20928882A 1982-12-01 1982-12-01 はんだ付け装置のワツクス処理部 Granted JPS59100590A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20928882A JPS59100590A (ja) 1982-12-01 1982-12-01 はんだ付け装置のワツクス処理部

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20928882A JPS59100590A (ja) 1982-12-01 1982-12-01 はんだ付け装置のワツクス処理部

Publications (2)

Publication Number Publication Date
JPS59100590A JPS59100590A (ja) 1984-06-09
JPH0145753B2 true JPH0145753B2 (enEXAMPLES) 1989-10-04

Family

ID=16570457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20928882A Granted JPS59100590A (ja) 1982-12-01 1982-12-01 はんだ付け装置のワツクス処理部

Country Status (1)

Country Link
JP (1) JPS59100590A (enEXAMPLES)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523164A (en) * 1975-06-27 1977-01-11 Aiwa Co Method of securing electric components printed circuit board
CA1125712A (en) * 1979-04-16 1982-06-15 Walter H. Cobbs, Jr. Method and apparatus for dispensing heat sensitive liquid polymeric compositions
JPS592938Y2 (ja) * 1979-12-06 1984-01-26 千住金属工業株式会社 フラクサ−
JPS592938U (ja) * 1982-06-30 1984-01-10 富士重工業株式会社 防音形エンジン駆動ゼネレータ

Also Published As

Publication number Publication date
JPS59100590A (ja) 1984-06-09

Similar Documents

Publication Publication Date Title
US4474311A (en) Thermoplastic melting and dispensing apparatus
CA1063565A (en) Feeder for apparatus for ejecting a mixture of a plurality of liquids
JPH0145752B2 (enEXAMPLES)
CN102365910B (zh) 局部喷流锡焊装置及局部喷流锡焊方法
JP2010115207A (ja) 液体注入装置
JP4116102B2 (ja) 温度制御された非酸化性雰囲気中で部品を印刷回路板にウエーブはんだ付けするための方法
CA1163206A (en) Oil supply system
US3198414A (en) Molten solder bath with uniformly dispersed additive
CN106334852A (zh) 一种在线式选择性波峰焊接机
JPH0145753B2 (enEXAMPLES)
US5047262A (en) Apparatus and method for selectively coating printed circuit panels
JPH0212627B2 (enEXAMPLES)
JPH0145754B2 (enEXAMPLES)
JP3801765B2 (ja) リフロー炉
GB1602779A (en) Methods and apparatus for mass soldering of printed circuit boards
JPS59100593A (ja) ワツクス付け処理装置の噴射装置
JPH0212626B2 (enEXAMPLES)
JP2004205985A (ja) パネルの樹脂塗布方法、ディスプレイ用パネルの製造方法及び樹脂塗布装置
GB2159084A (en) Vapour phase soldering
DE4430764A1 (de) Kühleinrichtung
CN206241414U (zh) 一种在线式选择性波峰焊接机
CA1217684A (en) Swell-soldering apparatus
KR100271271B1 (ko) 접착제 자동 분사기
JPH10126049A (ja) 後付け半田装置
KR970008849B1 (ko) 납땜기의 산화 방지장치