JPH0144216Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) This invention relates to a testing soldering device for setting soldering conditions for printed circuit boards.

(Prior Art) Conventionally, as a test soldering device for setting soldering conditions for printed circuit boards, a printed circuit board P is mounted on a carrier 2 running on a conveyor 1, as shown in FIG. , fluxer (whole foaming type) 3, preheater 4, solder bath 5
There is something that passes over the . In this case, the carrier 2 stops above the fluxer 3, the fluxer 3 is raised by the piston 3a, and the foamed flux adheres to the printed circuit board P. Next, when the fluxer 3 descends, the carrier 2 moves and preheats the printed circuit board P while passing over the preheater 4. Next, the carrier 2 stops again on the solder bath 5. At this time, carrier 2 is lifter 6
It is lowered into the solder bath 5 by the lifter 6, and molten solder adheres to the printed circuit board P.
After this, carrier 2 rises together with lifter 6,
It moves by a conveyor 1.

However, in the case of this device, equipment for raising and lowering the fluxer 3 and lifter 6 is required, which makes the structure complicated, and there are also problems such as the need to stop the conveyor 1, which increases the overall soldering time. .

FIG. 5 shows a test soldering device that solves the above problems. In this device, a carrier 12 continuously moves on a conveyor 11 that is constantly in operation. The fluxer 13 is a nozzle 13a
A foamed flux is generated from the foamed flux, and as the carrier 12 passes over this, the flux adheres to the printed circuit board P. Next, the carrier 12 carrying the printed circuit board P is transferred to the preheater 1
4, and then enters the solder bath 15 at a predetermined angle (5 to 30 degrees). The carrier 12 moves on the molten solder liquid level 16 in the solder tank 15 while being dragged by the conveyor 11. After the soldering is completed in this manner, it leaves the solder liquid level 16 at a certain angle (5 to 30 degrees). Note that the conveyor 11 moves at a constant speed throughout the entire journey.

(Problems to be Solved by the Invention) However, even in the test soldering apparatus shown in FIG. The detachment angle and immersion time are set and cannot be changed. Furthermore, since the carrier 12 is dragged inside the solder tank 15, the solder tank 15 becomes large and the testing soldering apparatus also becomes large.

This idea was developed to set the soldering conditions for printed circuit boards, including the flux application conditions, i.e., the angle of entry of the fluxer into the printed circuit board, the application time,
Another object of the present invention is to provide a testing soldering device that can easily change the preheating conditions, that is, the preheating time, and also the soldering conditions in the soldering tank, that is, the angle of entry and exit of the printed circuit board, and the soldering time, and that has a simple structure. do.

(Means for Solving the Problems) This invention, as a means for solving the above problems, includes a carrier on which a printed circuit board is mounted, a guide rail for guiding the carrier, and a A test soldering device comprising a chain conveyor that is provided in parallel and advances the carrier via a stay, a fluxer, a preheater, and a soldering bath that are arranged below the guide rail, the fluxer and Multi-joint cams are provided above the solder baths to guide the lifting and tilting movements of the carriers, and the carriers are composed of a running section and a carrier body disposed below the running section. A roller that rolls on a guide rail is attached, and the carrier body is coupled to the traveling section via a connecting rod and a coil spring so as to be able to move up and down, and the upper end of the connecting rod has the articulated joint for lifting and lowering. Attach a roller that rolls on the underside of the cam,
The apparatus for soldering a printed circuit board for testing is characterized in that a roller that rolls on the upper surface of the tilting multi-joint cam is attached to the carrier body.

(Example) This invention will be described below based on drawings showing examples. FIG. 3 is a schematic front view of the test soldering device according to this invention. The carrier 21 consists of a carrier main body 22 and a running section 23. A printed circuit board P is mounted on the carrier main body 22, and a stay 24 and front and rear running rollers 25, 2 are mounted on the running section 23.
6 is provided. The upper end of the stay 24 is connected to a chain 28 of a chain conveyor 27 provided at the top of the apparatus. The chain 28 is driven by a motor 29 at the left end of the device (shown).
The rotational speed of the motor 29 is controlled by a speed controller 30 and a limit switch 32 provided on each post 31 of the device. The driving force of the chain 28 is transmitted to the running section 23 by the stay 24,
The carrier 21 is moved by running rollers 25 and 26 along a guide rail 33 provided at the middle stage of the apparatus. Below the guide rail 33, a fluxer 34 and a preheater 3 are installed in order from the right side of the figure.
5. A solder tank 36 is arranged. The support 31 close to the fluxer 34 and the solder bath 36 is provided with lifting cams 37 and 38 above the guide rail 33, and inclined cams 39 and 40 below the guide rail 33, respectively.
is provided. The cams 37 to 40 are all multi-jointed cams, and the inclination angle of each is variable by a mounting screw 43 slidably inserted into a cam-side mounting groove 41 and a support-side mounting groove 42. It's summery.

FIG. 1 shows details of the carrier 21. Running part 2
A through hole 23a is provided at approximately the center of the rod 3, into which a connecting rod 45 is inserted so as to be able to reciprocate. The lower end of the connecting rod 45 is connected to the carrier body 22 via a hinge part 46, and the upper end is connected to the flange 4.
5a and a coil spring 47, it is connected to the traveling section 23. An elevating roller 48 is attached to the upper end of the connecting rod 45, and the elevating cam 37
Or it contacts the lower surface of 38 and rolls. The carrier body 22 is provided with a roller mounting plate 49 having protrusions on the front and rear, and each protrusion has an inclined roller 5.
0,51 is installed and the inclined cam 39 or 4
It contacts the top surface of 0 and rolls. Further, an adjusting rod 52 with an adjusting screw is attached to the right end of the running portion 23 in the drawing by passing through a screw hole. The center of gravity of the carrier body 22 is located on the left side of the hinge portion 46 in the drawing, and therefore a counterclockwise moment acts on the hinge portion 46 in the drawing.
2 can be held in any position by abutting the lower end as a stopper.

In the test soldering apparatus configured as described above, the carrier 21 on which the printed circuit board P is mounted is coupled to a chain conveyor 27 driven by a motor 29, and the running rollers 25,
26, it advances along the guide rail 33. When the carrier 21 is above the fluxer 34, the lifting roller 48 comes into contact with the lower surface of the lifting cam 37 and is pushed down, as shown in FIG.
The coil spring 47 is compressed and the carrier body 22 descends to approach the top surface of the fluxer 34. At this time, the inclined roller 5 of the carrier body 22
0 and 51 move along the inclined cam 39, and the foamed flux properly adheres to the printed circuit board P. When the carrier 21 reaches the rear end of the fluxer 34,
The lifting roller 48 moves along the upward slope of the lifting cam 37. At the same time, the inclined roller 50 of the carrier body,
Since the carrier body 51 also moves along the upward slope of the inclined cam 39, the carrier body 22 moves forward toward the next stroke while rising in a stable state. Then Carrier 2
1 passes above the preheater 35, and the printed circuit board P is preheated. Next, when the carrier 21 comes above the solder tank 36, the carrier main body 22 is lowered by the lifting cam 38 and the tilting cam 40 and the solder tank 36 is lowered, similar to the case of the fluxer 34.
molten solder adheres to the printed circuit board P.

In the above, limit the position of carrier 21.
It is detected by the switch 32, and the motor rotation speed can be changed by the controller 30 based on this detection, so the flux immersion time, preheat time, and solder bath immersion time can be adjusted appropriately while controlling the forward speed of the carrier 21. can be controlled.

(Effects of the invention) Since this invention is a test soldering device for printed circuit boards having the configuration described above, it has a simple structure and can easily adjust flux application conditions, preheat conditions, soldering conditions in a soldering bath, etc. It can be easily changed, and therefore has the effect of facilitating the setting of soldering conditions to suit printed circuit boards of different shapes.

[Brief explanation of drawings]

Figure 1 is a detailed view of the main parts of the embodiment of this invention, Figure 2
3 is a schematic front view of this embodiment, FIG. 4 is an explanatory diagram of a conventional test soldering device, and FIG. 5 is an explanatory diagram of another conventional example. 21...Carrier, 22...Carrier body, 2
3... Running part, 25, 26... Running roller, 27
...Chain conveyor, 33...Guide rail, 34...Fluxer, 35...Prichter,
36... Solder bath, 37, 38... Multi-joint cam for lifting, 39, 40... Multi-joint cam for tilting, 45...
...Connection rod, 47...Coil spring, 4
8... Lifting roller, 50, 51... Inclined roller,
P...Printed circuit board.

Claims (1)

[Scope of utility model registration request] A carrier on which a printed circuit board is mounted, a guide rail that guides the carrier, and a guide rail that guides the carrier.
a chain conveyor that is provided in parallel above the rail and advances the carrier via a stay;
The test soldering device includes a fluxer, a preheater, and a soldering tank arranged below the guide rail, and above the fluxer and the soldering tank respectively guide the lifting and tilting movements of the carrier. A multi-joint cam is installed to
The carrier is composed of a running part and a carrier body disposed below the running part, a roller that rolls on the guide rail is attached to the running part, and the carrier body is connected to the carrier body through a connecting rod and a coil spring. A roller is connected to the traveling part so as to be movable up and down, and a roller that rolls on the lower surface of the elevating multi-joint cam is attached to the upper end of the connecting rod, and the upper surface of the tilting multi-joint cam is attached to the carrier body. A soldering device for testing printed circuit boards that is equipped with a rolling roller.