JPH0140127Y2 - - Google Patents
Info
- Publication number
- JPH0140127Y2 JPH0140127Y2 JP18101286U JP18101286U JPH0140127Y2 JP H0140127 Y2 JPH0140127 Y2 JP H0140127Y2 JP 18101286 U JP18101286 U JP 18101286U JP 18101286 U JP18101286 U JP 18101286U JP H0140127 Y2 JPH0140127 Y2 JP H0140127Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- cavity
- wire insertion
- housing
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 21
- 230000037431 insertion Effects 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000669 biting effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18101286U JPH0140127Y2 (enrdf_load_html_response) | 1986-11-25 | 1986-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18101286U JPH0140127Y2 (enrdf_load_html_response) | 1986-11-25 | 1986-11-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6385877U JPS6385877U (enrdf_load_html_response) | 1988-06-04 |
| JPH0140127Y2 true JPH0140127Y2 (enrdf_load_html_response) | 1989-12-01 |
Family
ID=31125495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18101286U Expired JPH0140127Y2 (enrdf_load_html_response) | 1986-11-25 | 1986-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0140127Y2 (enrdf_load_html_response) |
-
1986
- 1986-11-25 JP JP18101286U patent/JPH0140127Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6385877U (enrdf_load_html_response) | 1988-06-04 |